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    • 3. 发明申请
    • HARDENABLE EPOXY RESIN COMPOSITION
    • 可再生环氧树脂组合物
    • WO2008009560A1
    • 2008-01-24
    • PCT/EP2007/056782
    • 2007-07-05
    • ABB RESEARCH LTDSCHAAL, StéphaneGHOUL, CherifTILLIETTE, VincentARAUZO, FranciscoGONZALEZ, Patricia
    • SCHAAL, StéphaneGHOUL, CherifTILLIETTE, VincentARAUZO, FranciscoGONZALEZ, Patricia
    • C08G59/00H01B3/40
    • H01B3/40C08K5/54C08L63/00
    • A hardenable epoxy resin composition which is suitable for the production of an electrical insulation with improved thermal ageing properties, wherein said hardenable epoxy resin composition comprises an epoxy resin, a hardener, an inorganic filler composition, and a coupling agent for improving the bonding between the polymer matrix and the filler, and optionally further additives, characterized in that, (i) the filler composition comprises silica and aluminum trihydride (ATH) at a ratio of silica:ATH from 10:1 to 1:10; (ii) the average particle size distribution of the silica is within the range of from 100 µm - 0.5 µm; (iii) the average particle size distribution of ATH is below 10 µm, preferably within the range of from 10.0 µm - 0.5 µm; and (iv) the filler composition is present in an amount within the range of 20-80% by weight, calculated to the total weight of the insulating composition, and wherein (v) the coupling agent is present preferably within the range 20 of 0.1% - 10% by weight, calculated to the total weight of the insulating composition, the use of the composition for the production of an electrical insulation, and electrical articles containing such an electrical insulation system.
    • 一种适用于生产具有改善的热老化性能的电绝缘体的可硬化环氧树脂组合物,其中所述可硬化环氧树脂组合物包含环氧树脂,硬化剂,无机填料组合物和用于改善 聚合物基质和填料,以及任选的其它添加剂,其特征在于,(i)填料组合物包含二氧化硅和三氢化铝(ATH),二氧化硅的比例为:ATH为10:1至1:10; (ii)二氧化硅的平均粒度分布在100μm〜0.5μm的范围内; (iii)ATH的平均粒度分布低于10μm,优选在10.0μm〜0.5μm的范围内; 和(iv)填充剂组合物的存在量为绝对组合物总重量的20-80重量%,并且其中(v)偶联剂优选存在于0.1重量份的范围内 %-10重量%,计算绝缘组合物的总重量,用于生产电绝缘的组合物的使用,以及含有这种电绝缘系统的电气制品。
    • 5. 发明申请
    • CURABLE EPOXY RESIN COMPOSITION
    • 可固化环氧树脂组合物
    • WO2011023227A1
    • 2011-03-03
    • PCT/EP2009/061038
    • 2009-08-27
    • ABB RESEARCH LTDSINGH, BandeepSCHAAL, StéphaneKORNMANN, XavierPURI, Prateek
    • SINGH, BandeepSCHAAL, StéphaneKORNMANN, XavierPURI, Prateek
    • C08G59/42C08G59/58
    • C08G59/4284C08G59/58C08L63/00H01B3/40
    • A curable epoxy resin composition comprising at least an epoxy resin component and a hardener component, and optionally further additives, characterized in that: (a) said epoxy resin component is a conventional epoxy resin compound or a mixture of such compounds; (b) said hardener component comprises (b1) an aliphatic and cycloaliphatic or aromatic poly-carbonic acid anhydride, preferably a phthalic acid anhydride; and (b2) a polyether-amine of the general formula (I) : H 2 N-(C n H 2n -O) m -C n H 2n -NH 2 (I) wherein n is an integer from 2 to 8; and m is from about 3 to about 100; wherein (c) the polycarbonic acid anhydride, preferably the phthalic acid anhydride [component (b1) ] is present in the curable epoxy resin composition in a concentration of 0.60 MoI to 0.93 MoI, calculated per one epoxy group weight equivalent present in the epoxy resin component of the composition; and (d) the polyether-amine of the general formula (I) [component (b2) ] is present in the curable epoxy resin composition in a concentration of about 0.02 MoI to about 0.1 MoI, calculated per one epoxy group weight equivalent present in the epoxy resin component of the composition; and electrical articles comprising an insulation material made therefrom.
    • 一种可固化环氧树脂组合物,其至少包含环氧树脂组分和硬化剂组分,以及任选的其它添加剂,其特征在于:(a)所述环氧树脂组分是常规的环氧树脂化合物或这些化合物的混合物; (b)所述固化剂组分包含(b1)脂族和脂环族或芳族聚碳酸酐,优选邻苯二甲酸酐; 和(b2)通式(I)的聚醚 - 胺:H 2 N-(C n H 2n-O)m -C n H 2n-NH 2(I)其中n是2至8的整数; m为约3至约100; 其中(c)聚碳酸酐,优选邻苯二甲酸酐[组分(b1)]以0.60摩尔至0.93摩尔的浓度存在于可固化环氧树脂组合物中,每环氧树脂组合物中存在的环氧基重量当量计算 组分的组分; 和(d)通式(I)[组分(b2)]的聚醚胺存在于可固化环氧树脂组合物中,其浓度约为0.02MoI至约0.1MoI,按每个环氧基重量当量存在 组合物的环氧树脂组分; 以及包括由其制成的绝缘材料的电气制品。
    • 6. 发明申请
    • EPOXY RESIN COMPOSITION
    • 环氧树脂组合物
    • WO2011006530A1
    • 2011-01-20
    • PCT/EP2009/058965
    • 2009-07-14
    • ABB RESEARCH LTDSINGH, BandeepGHOUL, CherifSCHAAL, StéphanePURI, Prateek
    • SINGH, BandeepGHOUL, CherifSCHAAL, StéphanePURI, Prateek
    • C08G59/42
    • C08G59/4276
    • Curable epoxy resin composition comprising at least an epoxy resin component and a hardener component, and optionally further additives, wherein (a) at least a part of the hardener component is a chemically modified polycarbonic acid anhydride, said chemically modified polycarbonic acid anhydride being the reaction product of a polycarbonic acid anhydride and a glycol (diol) or a polyglycol, or the reaction product of a polycarbonic acid anhydride and a compound containing two carboxylic groups; (b) said glycol or polyglycol being selected from the group comprising compounds of formula (I) : HO-(C n H 2n -O) m -H (I) wherein n is an integer from 2 to 8; and m is an integer from 1 to 10; (c) said compound containing two carboxylic groups being selected from the group comprising compounds of formula (II) : HOOC- (C p H 2p ) -COOH (II) wherein p an integer from 2 to 18; and (d) the chemically modified acid anhydride hardener is present in an amount comprising at least 10 % of the reactive hardening groups calculated to all the reactive hardening groups contained in the total amount of hardener component present in the epoxy resin composition; and electrical insulators made therefrom.
    • 包含至少一种环氧树脂组分和一种硬化剂组分的可固化环氧树脂组合物,以及任选的其它添加剂,其中(a)至少一部分所述硬化剂组分是化学改性的聚碳酸酐,所述化学改性的聚碳酸酐是反应 聚碳酸酐和二醇(二醇)或聚乙二醇的产物,或聚碳酸酐与含有两个羧基的化合物的反应产物; (b)所述二醇或聚二醇选自式(I)化合物:HO-(C n H 2n-O)m -H(I)其中n是2至8的整数; m为1〜10的整数。 (c)所述含有两个羧基的化合物选自式(II)化合物:HOOC-(CpH 2 p)-COOH(II),其中p为2至18的整数; 和(d)化学改性的酸酐固化剂的存在量为包含至少10%的反应性硬化基团,其计算为环氧树脂组合物中存在的固化剂组分总量中包含的所有反应性硬化基团; 和由此制成的电绝缘体。