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    • 7. 发明申请
    • EPOXY RESIN COMPOSITION
    • 环氧树脂组合物
    • WO2011006530A1
    • 2011-01-20
    • PCT/EP2009/058965
    • 2009-07-14
    • ABB RESEARCH LTDSINGH, BandeepGHOUL, CherifSCHAAL, StéphanePURI, Prateek
    • SINGH, BandeepGHOUL, CherifSCHAAL, StéphanePURI, Prateek
    • C08G59/42
    • C08G59/4276
    • Curable epoxy resin composition comprising at least an epoxy resin component and a hardener component, and optionally further additives, wherein (a) at least a part of the hardener component is a chemically modified polycarbonic acid anhydride, said chemically modified polycarbonic acid anhydride being the reaction product of a polycarbonic acid anhydride and a glycol (diol) or a polyglycol, or the reaction product of a polycarbonic acid anhydride and a compound containing two carboxylic groups; (b) said glycol or polyglycol being selected from the group comprising compounds of formula (I) : HO-(C n H 2n -O) m -H (I) wherein n is an integer from 2 to 8; and m is an integer from 1 to 10; (c) said compound containing two carboxylic groups being selected from the group comprising compounds of formula (II) : HOOC- (C p H 2p ) -COOH (II) wherein p an integer from 2 to 18; and (d) the chemically modified acid anhydride hardener is present in an amount comprising at least 10 % of the reactive hardening groups calculated to all the reactive hardening groups contained in the total amount of hardener component present in the epoxy resin composition; and electrical insulators made therefrom.
    • 包含至少一种环氧树脂组分和一种硬化剂组分的可固化环氧树脂组合物,以及任选的其它添加剂,其中(a)至少一部分所述硬化剂组分是化学改性的聚碳酸酐,所述化学改性的聚碳酸酐是反应 聚碳酸酐和二醇(二醇)或聚乙二醇的产物,或聚碳酸酐与含有两个羧基的化合物的反应产物; (b)所述二醇或聚二醇选自式(I)化合物:HO-(C n H 2n-O)m -H(I)其中n是2至8的整数; m为1〜10的整数。 (c)所述含有两个羧基的化合物选自式(II)化合物:HOOC-(CpH 2 p)-COOH(II),其中p为2至18的整数; 和(d)化学改性的酸酐固化剂的存在量为包含至少10%的反应性硬化基团,其计算为环氧树脂组合物中存在的固化剂组分总量中包含的所有反应性硬化基团; 和由此制成的电绝缘体。
    • 9. 发明申请
    • CURABLE EPOXY RESIN COMPOSITION
    • 可固化环氧树脂组合物
    • WO2010106084A1
    • 2010-09-23
    • PCT/EP2010/053420
    • 2010-03-17
    • ABB RESEARCH LTDGHOUL, CherifGERIG, WilliBODMER, UrsTILLIETTE, Vincent
    • GHOUL, CherifGERIG, WilliBODMER, UrsTILLIETTE, Vincent
    • C08J3/20C08L63/00H01B3/40
    • C08G59/4284C08J3/203C08J2363/00C08K3/36C08L63/00H01B3/40
    • Curable epoxy resin composition comprising an epoxy resin component and a filler component and optionally a hardener component and further additives, wherein (a) said curable epoxy resin composition has been produced by separately mixing together at least a part of the epoxy resin component and at least a part of the filler component and optionally some or all of the optional additives, previously to mixing theses components with the optional hardener component and with any remaining optional additives present in the curable epoxy resin composition, and that (b) said mixing together of at least a part of the epoxy resin component and at least a part of the filler component and optionally some or all of the optional additives has been carried out at a temperature higher than the casting temperature of the curable epoxy resin composition, and electrical insulation systems made therefrom.
    • 包含环氧树脂组分和填料组分和任选的硬化剂组分和其它添加剂的可固化环氧树脂组合物,其中(a)所述可固化环氧树脂组合物是通过将至少一部分环氧树脂组分和至少 填充剂组分的一部分和任选的一些或所有任选的添加剂,预先将这些组分与任选的硬化剂组分和存在于可固化环氧树脂组合物中的任何剩余的任选的添加剂混合,以及(b)将 环氧树脂组分的至少一部分和填料组分的至少一部分以及任选的一些或所有任选的添加剂已经在高于可固化环氧树脂组合物的浇铸温度的温度下进行,并且制备了电绝缘体系 由此。