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    • 3. 发明公开
    • 아발란치 포토 다이오드의 제조 방법
    • 制备化合物的方法
    • KR1020100071693A
    • 2010-06-29
    • KR1020080130496
    • 2008-12-19
    • 한국전자통신연구원
    • 심재식권용환박미란민봉기오대곤남은수
    • H01L31/107
    • H01L31/107H01L31/02366H01L31/0392H01L31/18
    • PURPOSE: A method for manufacturing an avalanche photo diode is provided to suppress an edge breakdown by reducing the curvature of a junction interface without a guard ring. CONSTITUTION: A first conductive amplification layer(105) is formed on a first conductive substrate(101). A recess region including a first recess unit(113) and a second recess unit(117) is formed by etching the first conductive amplification layer. A second conductive diffusion layer(130) is formed by diffusing conductive diffusion materials to the first conductive amplification layer. A second conductive electrode(150) connected to the second conductive diffusion layer is formed on the first conductive amplification layer. A first conductive electrode(160) is formed on the rear of the first conductive substrate.
    • 目的:提供一种制造雪崩光电二极管的方法,通过降低没有保护环的接合界面的曲率来抑制边缘击穿。 构成:第一导电性放电层(105)形成在第一导电性基板(101)上。 通过蚀刻第一导电放大层形成包括第一凹部单元(113)和第二凹部单元(117)的凹部区域。 通过将导电扩散材料扩散到第一导电放大层来形成第二导电扩散层(130)。 连接到第二导电扩散层的第二导电电极(150)形成在第一导电放大层上。 第一导电电极(160)形成在第一导电基板的后部。
    • 4. 发明公开
    • 반사형 반도체 광 증폭기 및 이를 이용하는 광신호 처리방법
    • 反射半导体光放大器和光信号处理方法
    • KR1020100040481A
    • 2010-04-20
    • KR1020080099613
    • 2008-10-10
    • 한국전자통신연구원
    • 김현수권오균김동철최병석김기수오대곤
    • H04B10/291H04B10/00H01S3/16
    • H01S5/50H01S5/026H01S5/0608H01S5/06258H01S5/1014H01S5/509
    • PURPOSE: A reflective semiconductor optical amplification device and an optical signal processing method using the same are provided to reduce the cost of manufacturing using a reflective semiconductor amplifier which uses one optical fiber. CONSTITUTION: An optical signal amplification are(102) supplies gain to a downlink optical signal applied from the outside. An optical signal modulation area(103) is connected with the optical signal amplification area and generates a modulated optical signal. The downlink optical signal is amplified through cross gain modulation by the modulated optical signal and outputted as an uplink optical signal. The optical signal amplification area includes a semiconductor amplifier. The optical signal demodulation area includes a laser diode. The optical signal amplification and demodulation areas respectively have a first electrode and a second electrode. The first and the second electrodes receive independent current.
    • 目的:提供一种反射半导体光放大装置和使用该反射半导体光放大装置的光信号处理方法,以减少使用使用一根光纤的反射半导体放大器的制造成本。 构成:光信号放大(102)向从外部施加的下行光信号提供增益。 光信号调制区域(103)与光信号放大区域连接并产生调制光信号。 下行光信号通过调制光信号的交叉增益调制进行放大,作为上行光信号输出。 光信号放大区包括半导体放大器。 光信号解调区域包括激光二极管。 光信号放大和解调区域分别具有第一电极和第二电极。 第一和第二电极接收独立电流。
    • 6. 发明公开
    • 양자점을 포함하는 반도체 레이저 구조물
    • 包括量子点的SENICONDUCTOR DEVICE STRUCTURE
    • KR1020070058960A
    • 2007-06-11
    • KR1020060084913
    • 2006-09-05
    • 한국전자통신연구원
    • 오대곤이진홍김진수홍성의곽호상
    • H01S5/12
    • H01S5/1237H01S3/08009H01S5/1209H01S5/2228
    • A semiconductor laser structure including a quantum dot is provided to reduce cost and improve yield by obtaining single wavelength laser only through changing a mask without new technology development. A semiconductor laser structure including a quantum dot includes a lower clad layer, a plurality of gratings(320), a lower ridge waveguide(330), and an upper clad layer. The lower and upper clad layers are formed in a p+ or n+ clad layer. The lower and upper clad layers are different types from each other. A period of the grating(320) is integer times of T=(lambda/2)n. The grating(320) is arranged to form a predetermined angle with the lower ridge waveguide(330) for forming the lower ridge waveguide(330) in a direction for cleaving.
    • 提供包括量子点的半导体激光器结构,通过仅通过改变掩模即可获得单波长激光来降低成本并提高产量,而无需新技术开发。 包括量子点的半导体激光器结构包括下包层,多个光栅(320),下脊波导(330)和上包覆层。 下包层和上覆盖层形成在p +或n +覆层中。 下层和上层包层彼此不同。 光栅(320)的周期是T =(λ/ 2)n的整数倍。 光栅(320)被布置成与下脊波导(330)形成预定角度,用于在切割的方向上形成下脊波导(330)。
    • 10. 发明授权
    • 무결함, 무반사의 스폿사이즈 변환기를 구비한 광소자의제조 방법
    • 무결함사의스폿사이즈변환기를구비한광소자의제조방
    • KR100369329B1
    • 2003-01-24
    • KR1020010011091
    • 2001-03-05
    • 한국전자통신연구원주식회사 케이티
    • 김성복오대곤
    • G02B6/42
    • H01S5/10G02B6/1228G02B6/136
    • The present invention relates to a method for fabricating an optical device integrated with a spot size converter to reduce defect and low reflectivity in a butt-joint portion, the method including the steps of: a) depositing a first clad layer, an active layer and a second clad layer sequentially on the (100) plane of a semiconductor substrate; b) forming on the second clad layer a double dielectric mask of which the lower layer has a relatively wider width than that of the upper layer, exposing one side of the second clad layer; c) wet-etching the first clad layer, the active layer and the second clad layer in a buried ridge structure by using the double dielectric mask, and exposing the (111)A plane of the active layer tilted towards the (100) plane by a predetermined angle; d) growing a spot size conversion region on the (111)A plane of the active layer; and e) removing the double dielectric mask.
    • 本发明涉及一种用于制造与点尺寸转换器集成的光学器件以减少对接部分中的缺陷和低反射率的方法,该方法包括以下步骤:a)沉积第一包层,有源层和 在半导体衬底的(100)平面上顺序地形成第二包层; b)在第二覆盖层上形成双电介质掩模,该双电介质掩模的下层的宽度比上层的宽度宽,暴露出第二覆层的一侧; c)通过使用双电介质掩模,对第一覆盖层,有源层和第二覆盖层进行湿式蚀刻,并通过使用双电介质掩模,使活性层的(111)A面向(100)面倾斜 预定角度; d)在有源层的(111)A平面上生长光点尺寸转换区域; 和e)去除双电介质掩模。