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1. 发明公开

KR1020090127912A 몰드 및 반도체 제조 방법 有权
标题翻译：模具，模具生产工艺，加工设备和加工方法
公开(公告)号：KR1020090127912A
公开(公告)日：2009-12-14
申请号：KR1020097020827
申请日：2008-03-14
申请人： 캐논 가부시끼가이샤
发明人： 테라사끼아쯔노리 , 세끼준이찌
IPC分类号： B81C1/00
CPC分类号： B82Y10/00 , B81C99/009 , B82Y40/00 , G03F7/0002 , G03F9/7084 , Y10T428/24479
摘要： A mold for imprinting a pattern onto a member to be processed is constituted by a mold body having a front surface, at which the pattern is formed, and a rear surface opposite from the front surface; a coating layer for, covering the front surface of the mold body; and a coating layer for covering the rear surface of the mold body. The coating layer for covering the rear surface of the mold body is partially provided with an opening at the rear surface of the mold body.
摘要翻译：用于将图案压印到待加工构件上的模具由具有形成图案的前表面和与前表面相对的后表面的模体构成; 涂覆层，用于覆盖模体的前表面; 以及用于覆盖模具体的后表面的涂层。用于覆盖模具体的后表面的涂层在模体的后表面部分地设置有开口。

2. 发明授权

KR101114172B1 몰드 및 반도체 제조 방법 有权
标题翻译：模具和半导体制造方法
公开(公告)号：KR101114172B1
公开(公告)日：2012-03-14
申请号：KR1020097020827
申请日：2008-03-14
申请人： 캐논 가부시끼가이샤
发明人： 테라사끼아쯔노리 , 세끼준이찌
IPC分类号： B81C1/00
CPC分类号： B82Y10/00 , B81C99/009 , B82Y40/00 , G03F7/0002 , G03F9/7084 , Y10T428/24479
摘要： 본 발명은 패턴이 형성된 상면 및 상면과 대향하는 이면을 갖는 몰드 본체, 몰드 본체의 상면을 피복하기 위한 피복층 및 몰드 본체의 이면을 피복하기 위한 피복층에 의해 구성되는 피가공 부재에 패턴을 임프린트하기 위한 몰드에 관한 것이다. 몰드 본체의 이면을 피복하기 위한 피복층은 몰드 본체의 이면에 개구부가 부분적으로 제공된다.
몰드, 임프린트, 피가공 부재, 몰드 본체, 피복층, 개구부, 투명한 재료, 얼라인먼트

3. 发明公开

KR1020100056483A 임프린트 방법 및 기판 가공 방법 无效
标题翻译：衬底的印刷方法和处理方法
公开(公告)号：KR1020100056483A
公开(公告)日：2010-05-27
申请号：KR1020107004749
申请日：2008-08-01
申请人： 캐논 가부시끼가이샤
发明人： 오꾸시마싱고 , 세끼준이찌 , 오노하루히또 , 나까쯔지나오
IPC分类号： G03F7/00 , B29C33/38
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , Y10T428/24479
摘要： In an imprint method, a step of forming a pattern by imprinting a pattern of a mold onto a resin material on a substrate is repeated multiple times. The imprint method includes: a step of preparing the mold including a light blocking member at a position in which the pattern is not formed; a step of forming a pattern for a first time through steps including a step of bringing the mold into contact with a photocurable resin material provided on the substrate, a step of forming a first processed area by curing the photocurable resin material through light irradiation, and a step of removing a part of the photocurable resin material extruded from the first processed area into an outside area at a periphery of the first processed area: and a step of forming a pattern for a second time through steps including a step of bringing the mold into contact with a photocurable resin material provided on the substrate in an area which includes the outside area and is adjacent to the first processed area, a step of forming a second processed area by curing the photocurable resin material in the area, and a step of removing a part of the photocurable resin material extruded from the second processed area at a periphery of the second processed area.
摘要翻译：在压印方法中，重复多次将通过将模具图案压印在基板上的树脂材料上形成图案的步骤。压印方法包括：在未形成图案的位置准备包括遮光构件的模具的步骤; 通过包括使模具与设置在基板上的可光固化树脂材料接触的步骤的步骤，首先形成图案的步骤，通过光照射固化光固化性树脂材料来形成第一处理区域的步骤，以及将从第一处理区域挤出的部分可光固化树脂材料除去到第一处理区域的周边的外部区域的步骤;以及通过包括以下步骤的步骤形成第二次的图案的步骤：与设置在包括外部区域并且与第一处理区域相邻的区域中的设置在基板上的可光固化树脂材料接触;通过固化该区域中的可光固化树脂材料形成第二处理区域的步骤，以及步骤从所述第二处理区域的周围除去从所述第二处理区域挤出的所述可光固化树脂材料的一部分。

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