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    • 1. 发明授权
    • 포토레지스트 제거용 씬너 조성물
    • 稀释剂组合物用于去除光刻胶
    • KR101215429B1
    • 2012-12-26
    • KR1020030073134
    • 2003-10-20
    • 주식회사 동진쎄미켐
    • 윤석일전우식박희진
    • G03F7/32
    • 본발명은포토레지스트제거용씬너조성물에관한것으로, 특히 a) 프로필렌글리콜모노에틸에테르아세테이트 10 내지 98 중량부; b) 에틸락테이트 1 내지 70 중량부; c) 케톤 1 내지 70 중량부; 및 d) 폴리에틸렌옥사이드계축합물 0.001 내지 1 중량부를포함하는포토레지스트제거용씬너조성물에관한것이다. 본발명의포토레지스트제거용씬너조성물은액정디스플레이디바이스에사용되는글라스기판및 반도체제조에사용되는웨이퍼의가장자리와후면부위에사용되어불필요하게부착되어진포토레지스트를단시간에효율적으로제거할수 있을뿐만아니라, 인체에대한안정성이높으며, 계면의단차를줄여다양한공정에적용가능하고, 액정디스플레이디바이스및 반도체제조공정을간편화하여경제적으로생산수율을향상시킬수 있다.
    • 本发明涉及一种用于去除光刻胶的较薄组合物,特别是a)10至98重量份丙二醇单乙醚乙酸酯; b)1至70重量份的乳酸乙酯; c)1至70重量份的酮; d)0.001〜1重量份的聚环氧乙烷类缩合物。 光致抗蚀剂去除较薄的本发明的组合物不仅能有效地去除玻璃基板和光致抗蚀剂的边缘被附连在所述晶片的在很短的时间周期在半导体制造中使用的用于在一个液晶显示装置的背面,对人体不必要地使用 并且,通过减小界面的台阶高度并简化液晶显示装置和半导体的制造工艺,从而可以将本发明应用于各种工艺,从而经济地提高生产成品率。
    • 5. 发明公开
    • 감광성 수지 조성물을 제거하기 위한 씬너 조성물
    • 用于在短时间内去除光电子元件的薄膜组合物,去除薄膜,并减少界面的厚度差异
    • KR1020050014955A
    • 2005-02-21
    • KR1020030053380
    • 2003-08-01
    • 주식회사 동진쎄미켐
    • 윤석일전우식박희진
    • G03F7/32
    • PURPOSE: A thinner composition is provided to remove a color resist in a short time efficiently from the edges and the back side of a big color glass substrate for a liquid crystal display device, which removes thin residual membrane and reduces a thickness difference of an interface. CONSTITUTION: The thinner composition comprises: 10-90pts.wt. of alkyl amide selected from N-methyl acetamide, dimethyl formamide, and dimethyl acetamide; 10-90pts.wt. of ketone selected from acetone, methyl isopropyl ketone, methyl n-propyl ketone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone, cyclopentanone, cyclohexanone, and cycloheptanone; and 0.001-1pts.wt. of perfluoroalkyl amine oxide having a C5-C30 alkyl group.
    • 目的:提供更薄的组合物,用于从用于液晶显示装置的大型彩色玻璃基板的边缘和背面有效地短时间地除去抗蚀剂,从而去除薄的残留膜并减小界面的厚度差异 。 构成:较薄的组成包括:10-90pts.wt。 的选自N-甲基乙酰胺,二甲基甲酰胺和二甲基乙酰胺的烷基酰胺; 10-90pts.wt。 选自丙酮,甲基异丙基酮,甲基正丙基酮,甲基乙基酮,甲基异丁基酮,二异丁基酮,环戊酮,环己酮和环庚酮的酮; 和0.001-1pts.wt。 的具有C 5 -C 30烷基的全氟烷基氧化胺。
    • 6. 发明公开
    • 포토레지스트 제거용 씬너 조성물
    • 含有丙烯醇单硬脂酸酯,乙醇酸乙酯和环糊精的薄膜组合物用于剥离光刻胶
    • KR1020040104161A
    • 2004-12-10
    • KR1020030035683
    • 2003-06-03
    • 주식회사 동진쎄미켐
    • 윤석일전우식박희진
    • G03F7/42
    • G03F7/168G03F7/422
    • PURPOSE: Provided is a thinner composition for stripping photoresist, which strips photoresist in a short time with high efficiency during a manufacturing process of a semiconductor device or LCD device, while preventing interfacial infiltration into the photoresist at edges of a substrate. CONSTITUTION: The thinner composition for stripping photoresist comprises: (a) 10-90 parts by weight of a propyleneglycol monoalkyl ether; (b) 10-70 parts by weight of an alkyl ethanoate; and 1-70 parts by weight of a cycloketone. The thinner composition may further comprise at least one selected from the group consisting of: (d) 0.001-1 part by weight of an acrylic copolymer and (e) 0.001-1 parts by weight of a polyethylene oxide-based condensation product.
    • 目的:提供用于剥离光致抗蚀剂的较薄组合物,其在半导体器件或LCD器件的制造过程中以高效率在短时间内剥离光致抗蚀剂,同时防止在基底的边缘处的光致抗蚀剂的界面渗透。 构成:用于剥离光刻胶的较薄组合物包括:(a)10-90重量份的丙二醇单烷基醚; (b)10-70重量份烷基乙酸酯; 和1-70重量份的环酮。 更薄的组合物还可以包含选自以下的至少一种:(d)0.001-1重量份的丙烯酸共聚物和(e)0.001-1重量份的聚环氧乙烷缩合产物。
    • 8. 发明授权
    • 포토레지스트 제거용 씬너 조성물
    • 用于去除感光树脂的薄膜组合物
    • KR101213144B1
    • 2012-12-17
    • KR1020030073105
    • 2003-10-20
    • 주식회사 동진쎄미켐
    • 윤석일전우식박희진
    • G03F7/32
    • 본발명은포토레지스트제거용씬너조성물에관한것으로, 특히 a) 디에틸렌글리콜에틸에테르 30 내지 90 중량부; b) 부틸아세테이트 1 내지 70 중량부; c) 폴리에틸렌옥사이드계축합물 0.001 내지 1 중량부; 및 d) 플루오리네이티드아크릴릭코폴리머 0.001 내지 0.1 중량부을포함하는포토레지스트제거용씬너조성물에관한것이다. 본발명의포토레지스트제거용씬너조성물은액정디스플레이디바이스에사용되는글라스기판및 반도체제조에사용되는웨이퍼의가장자리와후면부위에사용되어불필요하게부착되어진포토레지스트를단시간에효율적으로제거할수 있을뿐만아니라, 인체에대한안정성이높으며, 계면의단차를줄여다양한공정에적용가능하고, 액정디스플레이디바이스및 반도체제조공정을간편화하여경제적으로생산수율을향상시킬수 있다.
    • 9. 发明公开
    • 레지스트 스트리퍼 제거용 케미칼 린스 조성물
    • 化学洗涤组合物用于去除耐腐蚀剥离器
    • KR1020070096330A
    • 2007-10-02
    • KR1020060026545
    • 2006-03-23
    • 주식회사 동진쎄미켐
    • 김성배박희진윤석일김병욱신성건
    • C11D7/32C11D7/50C11D7/26G03F7/40
    • C11D7/3209C11D7/261C11D7/3281C11D7/5004G03F7/40
    • A chemical rinse composition for cleaning a resist stripper is provided to improve cleaning power, to prevent the corrosion of a metal film and to remove the organic and inorganic impurities from a substrate. A chemical rinse composition comprises 0.05-10 wt% of an organic amine compound; 0.05-30 wt% of an organic solvent; 0.005-5 wt% of a triazole-based corrosion inhibitor; 0.005-5 wt% of a corrosion inhibitor selected from the group consisting of a hydroxyphenol corrosion inhibitor, an alkyl gallate corrosion inhibitor and a reducing agent; and the balance of water. Preferably the organic solvent is at least one glycol ether compound selected from ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol butyl ether, diethylene glycol methyl ether, diethylene glycol ethyl ether, diethylene glycol butyl ether, and diethylene glycol propyl ether.
    • 提供用于清洁抗蚀剂剥离器的化学漂洗组合物以提高清洁能力,防止金属膜的腐蚀和从基底去除有机和无机杂质。 化学漂洗组合物包含0.05-10重量%的有机胺化合物; 0.05-30重量%的有机溶剂; 0.005-5重量%的三唑类缓蚀剂; 0.005-5重量%的腐蚀抑制剂,选自羟基苯酚腐蚀抑制剂,没食子酸没食子酸烷酯缓蚀剂和还原剂; 和水的平衡。 优选有机溶剂是选自乙二醇甲醚,乙二醇乙醚,乙二醇丁醚,二甘醇甲醚,二乙二醇乙醚,二乙二醇丁醚和二乙二醇丙醚中的至少一种二醇醚化合物。
    • 10. 发明公开
    • 포토레지스트 제거용 씬너 조성물
    • 用于去除光电子的薄膜组合物
    • KR1020070013777A
    • 2007-01-31
    • KR1020050068387
    • 2005-07-27
    • 주식회사 동진쎄미켐
    • 박희진신성건윤석일김병욱
    • G03F7/42
    • A thinner composition for removing photoresist used in manufacturing semiconductor or liquid crystal display is provided to efficiently and rapidly remove photoresist adhered in undesired portions of a substrate regardless of kinds of photoresist by comprising alkyl ethanoate and fluorinated acrylic copolymer. The composition principally comprises (a) alkyl ethanoate and (b) fluorinated acrylic copolymer in amount of 0.001 to 1.0wt. parts relative to 100wt. parts of alkyl ethanoate. The fluorinated acrylic copolymer has weight average molecular weight of 1,000 to 10,000. The alkyl ethanoate is selected from a group consisting of methyl ethanoate, ethyl ethanoate, isopropyl ethanoate, normal propyl ethanoate and butyl ethanoate.
    • 提供了用于去除用于制造半导体或液晶显示器中的光致抗蚀剂的较薄组合物,用于通过包括烷基乙酸酯和氟化丙烯酸共聚物来有效且快速地除去粘附在基板的不希望的部分中的光致抗蚀剂,不管种类的光致抗 组合物主要包含(a)烷基乙酸酯和(b)含量为0.001至1.0重量%的氟化丙烯酸共聚物。 零件相对于100wt。 部分烷基乙酸酯。 氟化丙烯酸共聚物的重均分子量为1,000〜10,000。 乙酸烷基酯选自乙酸甲酯,乙酸乙酯,乙酸异丙酯,乙酸正丙酯和乙酸丁酯。