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    • 1. 发明公开
    • 포지티브형 감광성 수지 조성물, 패턴형 수지막의 제조방법, 반도체 장치, 표시소자, 및 반도체 장치 및표시소자의 제조 방법
    • 正型型感光性树脂组合物,使用该组合物生产图案树脂膜的方法,使用该组合物生产的半导体器件和显示器件
    • KR1020050000351A
    • 2005-01-03
    • KR1020040047232
    • 2004-06-23
    • 스미토모 베이클라이트 가부시키가이샤
    • 반바도시오이케다다쿠지야노다쓰야히라노다카시
    • G03F7/022
    • G03F7/0757G03F7/0048G03F7/0226G03F7/0233
    • PURPOSE: A positive type photosensitive resin composition is provided, which has high sensitivity and can make pattern without development residue. And a processes for producing a patterned resin membrane, a semiconductor device, and a display device by using the composition are also provided. CONSTITUTION: The positive type photosensitive resin composition comprises an alkali-soluble resin, a diazo quinone compound, and a compound containing -CH2OH and not containing a phenolic hydroxide. And the process for producing the patterned resin membrane comprises the steps of: coating the positive type photosensitive resin composition on a substrate to form a composition layer; irradiating an activated energy beam on the composition layer and contacting to a developer to form a pattern; heating the composition. And the process for producing the semiconductor device or the display device comprises the steps of: coating the positive type photosensitive resin composition on a semiconductor device or a member of a display device to be a membrane thickness of 0.1-50 micrometer after heating; prebaking, exposing, developing, and heating.
    • 目的:提供一种正型感光性树脂组合物,其具有高灵敏度,并且可以使图案无显影残留。 还提供了通过使用该组合物制造图案化树脂膜,半导体器件和显示装置的方法。 构成:正型感光性树脂组合物包含碱溶性树脂,重氮醌化合物和含有-CH 2 OH且不含酚性氢氧化物的化合物。 制造图案化树脂膜的方法包括以下步骤:将正型感光性树脂组合物涂布在基材上以形成组合物层; 将激活的能量束照射在组合物层上并与显影剂接触以形成图案; 加热组合物。 制造半导体装置或显示装置的方法包括以下步骤:将正型感光性树脂组合物在加热后的半导体装置或显示装置的部件上涂布成为0.1-50微米的膜厚; 预烘烤,曝光,开发和加热。
    • 5. 发明公开
    • 폴리아미드 수지, 포지티브형 감광성 수지 조성물, 패턴상수지막의 제조 방법, 반도체 장치, 표시 소자, 및 반도체장치와 표시 소자의 제조 방법
    • 聚酰胺树脂,包含它们的正型感光性树脂组合物,图案形成的树脂膜,半导体器件和包含组合物的显示器件,其制造方法
    • KR1020050016162A
    • 2005-02-21
    • KR1020040061659
    • 2004-08-05
    • 스미토모 베이클라이트 가부시키가이샤
    • 반바도시오히라노다카시
    • G03F7/022G03F7/039C08L77/00
    • C08G69/42C08G77/455G03F7/0233G03F7/0757
    • PURPOSE: Provided are a polyamide resin for the preparation of a positive photosensitive resin composition having excellent resistance to hydrofluoric acid and development property, a pattern-formed resin film, a semiconductor device and a display device using the composition, and a manufacturing method thereof. CONSTITUTION: The polyamide resin comprises a structure of the formula 1, wherein about 0.1-30 mol% of the total amount of Y has a structure of the formula 2. In the formulae 1 and 2, X is a 2-4 valent organic group, Y is a 2-6 valent organic group, R1 is a hydroxyl group or -O-R3, m is an integer of 0-2, R2 is a hydroxyl group, a carboxy group, -O-R3 or -COO-R3, n is an integer of 0-4, R3 is a C1-C15 organic group, with the proviso that if R1 is not a hydroxyl group, then at least one of R2 is a carboxy group and if R2 is not a carboxy group, then at least one of R1 is a hydroxyl group, each of R4 and R5 is a divalent organic group, each of R6 and R7 is a monovalent organic group, and n is an integer of 0-20. The positive photosensitive resin composition comprises such polyamide resin, a photosensitive diazoquinone compound and optionally a phenolic hydroxyl group-containing compound.
    • 目的:提供一种用于制备耐氢氟酸和显影性优异的正型感光性树脂组合物的聚酰胺树脂,图案形成树脂膜,半导体装置和使用该组合物的显示装置及其制造方法。 构成:聚酰胺树脂包括式1的结构,其中Y的总量的约0.1-30mol%具有式2的结构。在式1和2中,X是2-4价有机基团 Y为2-6价有机基团,R1为羟基或-O-R3,m为0-2的整数,R2为羟基,羧基,-O-R3或-COO-R3 ,n为0-4的整数,R3为C1-C15有机基团,条件是如果R1不是羟基,则R2中的至少一个是羧基,如果R2不是羧基, 那么R1中的至少一个是羟基,R 4和R 5各自是二价有机基团,R 6和R 7各自是一价有机基团,n是0-20的整数。 正型感光性树脂组合物包含这种聚酰胺树脂,感光性重氮醌化合物和任选的含酚羟基的化合物。