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    • 2. 发明公开
    • 저온 액상 증착 기술을 이용한 실리콘산화물 절연막의제조방법
    • 使用低温液相沉积技术制造SIO2电介质层的方法
    • KR1020090114655A
    • 2009-11-04
    • KR1020080040404
    • 2008-04-30
    • 성균관대학교산학협력단
    • 노용한김경섭
    • H01L21/31H01L21/208B82Y40/00
    • H01L21/02282H01L21/02164H01L21/76897
    • PURPOSE: A method for manufacturing SiO2 dielectric layers using low temperature liquid phase deposition technology are provided to improve the degree of integration by using the conformal insulating layer. CONSTITUTION: The circuit region(33) is formed in the fixed region on the semiconductor substrate(31). The photoresist is evaporated in the front side of the semiconductor board which has the circuit region. The photoresist pattern which exposes the circuit region by performing the exposure development process on a photoresist is formed. The first insulating layer(37) is formed by the low temperature LPD(Liquid Phase Deposition) on the exposed circuit region. The photoresist pattern is removed. The metal wiring(39) electrically connected to the semiconductor substrate to the circuit region is formed.
    • 目的:提供使用低温液相沉积技术制造SiO 2电介质层的方法,以通过使用保形绝缘层来提高集成度。 构成:电路区域(33)形成在半导体衬底(31)上的固定区域中。 在具有电路区域的半导体板的正面中蒸发光致抗蚀剂。 形成通过对光致抗蚀剂进行曝光显影处理来曝光电路区域的光致抗蚀剂图案。 第一绝缘层(37)由暴露电路区域上的低温LPD(液相沉积)形成。 去除光致抗蚀剂图案。 形成与半导体基板电连接到电路区域的金属布线(39)。
    • 7. 发明公开
    • 나노 소자의 형성방법
    • 使用具有自组装特性的纳米结构形成纳米器件的方法
    • KR1020100039978A
    • 2010-04-19
    • KR1020080098992
    • 2008-10-09
    • 성균관대학교산학협력단
    • 노용한김경섭정석원김형진박성하
    • B82B3/00H01L21/20B82Y40/00
    • H01L21/32139B81C1/00396B81C2201/0149B81C2201/0198B82Y10/00H01L21/0332H01L29/0665H01L29/0673H01L29/78
    • PURPOSE: A nano device forming method is provided to pattern a substrate in a nano scale without using a light source, to improve the degree of integration of the device while reducing the fabrication cost, and to improve the yield of the device production. CONSTITUTION: A nano device forming method comprises the following steps: forming a self-assembly material layer(23) in a nano scale on a substrate(21) formed with more than one layer; forming a mask layer(25) on the self-assembly material layer; performing a surface processing on the substrate using the mask layer as a mask; and removing the self-assembly material layer. The surface processing is either an etching or an ion inserting. The mask layer contains a substance selected from the group consisting of gold, silver, silicon, silicon oxide, silicon nitride, iron, cadmium selenide, carbon nano tube, bucky ball and grapheme.
    • 目的:提供一种纳米器件形成方法,用于在不使用光源的情况下以纳米尺度对衬底进行图案化,从而提高器件的集成度,同时降低制造成本,并提高器件生产的产量。 构成:纳米器件形成方法包括以下步骤:在形成有多于一层的衬底(21)上形成纳米尺度的自组装材料层(23); 在所述自组装材料层上形成掩模层(25); 使用掩模层作为掩模在基板上进行表面处理; 并移除自组装材料层。 表面处理是蚀刻或离子插入。 掩模层包含选自金,银,硅,氧化硅,氮化硅,铁,硒化镉,碳纳米管,巴基球和图形的物质。
    • 8. 发明公开
    • 액상 증착 기술을 이용한 나노구조체의 제조방법 및 그에의해 제조된 나노구조체
    • 使用液相沉积技术制造纳米结构的方法及其纳米结构
    • KR1020090114653A
    • 2009-11-04
    • KR1020080040401
    • 2008-04-30
    • 성균관대학교산학협력단
    • 김경섭노용한
    • B82B3/00B82B1/00B82Y40/00
    • PURPOSE: A method for manufacturing a nanostructure using liquid phase deposition technology and the nanostructure manufactured by the same are provided to reduce the size of polymer particles and to grow nanostructures selectively. CONSTITUTION: A method for manufacturing a nanostructure comprises the following steps of: preparing a substrate(31); forming a single layered nano-sized spherical materials on the substrate; partly etching the spherical materials; depositing the etched spherical materials on the substrate to form a metal layer(35); removing the spherical materials to expose the substrate to be partly seen, which is a nano hole; selectively forming a nano dot(37) on the nano hole through liquid phase deposition; and removing the metal layer.
    • 目的:提供使用液相沉积技术制造纳米结构的方法和由其制造的纳米结构,以减小聚合物颗粒的尺寸并选择性地生长纳米结构。 构成:制造纳米结构的方法包括以下步骤:制备基底(31); 在基板上形成单层纳米尺寸球形材料; 部分蚀刻球形材料; 将蚀刻的球形材料沉积在基底上以形成金属层(35); 去除球形材料以露出待部分看到的衬底,其是纳米孔; 通过液相沉积在纳米孔上选择性地形成纳米点(37); 并去除金属层。