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    • 1. 发明公开
    • 집적회로의 언더필 인캡슐레이션 장치 및 방법
    • 集成电路不充分封装的装置和方法
    • KR1020030013115A
    • 2003-02-14
    • KR1020010047446
    • 2001-08-07
    • 서화일한세진김광선
    • 서화일김광선한세진
    • H01L21/56
    • PURPOSE: An apparatus and method for underfill encapsulation of integrated circuits are provided to shorten a time for encapsulation process by removing the remaining encapsulant from an encapsulant injection hole and an encapsulant exhaust hole after hardening the encapsulant. CONSTITUTION: A frame(100) includes a base(110), an upper plate(120), a plurality of guide bars(130) for connecting the base(110) with the upper plate(120), and a transport plate(140). A mold(200) is formed with an upper mold(210) loaded on a bottom face of the upper plate(120) and a lower mold(220) mounted on the transport plate(140). A cavity(212) and a channel are formed at a lower portion of the upper mold(210). A groove(222) is formed at the upper mold(220). The groove(222) corresponds to the cavity(212) and the channel. An elevator(300) is used for moving the transport plate(140) along the guide bars(130). An encapsulant injector(400) has a plunger(410) and a sub motor(420) in order to inject an encapsulant into the cavity(212). A pressure controller(500) has a plunger(510) and a sub motor(520) in order to control a pressure of the cavity(212) or remove the remaining encapsulant from an exhaust hole(216).
    • 目的:提供一种用于集成电路的底部填充封装的装置和方法,以缩短封装工艺的时间,通过在封装剂硬化之后从密封剂注入孔和密封剂排出孔中除去剩余的密封剂。 框架(100)包括底座(110),上板(120),用于将基座(110)与上板(120)连接的多个导杆(130)和传送板(140) )。 模具(200)形成有装载在上板(120)的底面上的上模(210)和安装在输送板(140)上的下模220。 在上模具(210)的下部形成空腔(212)和通道。 在上模(220)处形成有凹槽(222)。 凹槽(222)对应于空腔(212)和通道。 电梯(300)用于沿着导杆(130)移动传送板(140)。 密封剂注入器(400)具有柱塞(410)和子马达(420),以便将密封剂注入到空腔(212)中。 压力控制器(500)具有柱塞(510)和副马达(520),以便控制空腔(212)的压力或从排气孔(216)移除剩余的密封剂。
    • 2. 发明公开
    • 멀티 플립칩의 언더필 인캡슐레이션 공정용 몰드
    • 多芯片芯片封装过程的模具
    • KR1020030048743A
    • 2003-06-25
    • KR1020010078746
    • 2001-12-13
    • 서화일한세진김광선
    • 서화일김광선한세진
    • H01L21/56
    • B29C45/34H01L21/565H01L24/97H01L2224/16225
    • PURPOSE: A mold for an underfill encapsulation process of a multi flip-chip is provided to be capable of simultaneously carrying out the encapsulation process at the flip-chips, and previously preventing the damage of the flip-chips due to the generation of voids and direct contact by forming cavities having a predetermined size. CONSTITUTION: A plurality of cavities(310) having an opening portion opposite to a substrate, are formed for holding semiconductor chips when carrying out an encapsulation process, respectively. A plurality of encapsulant inflow ports(320) are formed at one sides of the cavities for guiding encapsulant into the cavities, respectively. A plurality of encapsulant outflow ports(340) are formed at the other sides of the cavities for exhausting the encapsulant and air from the cavities, respectively. The maximum distance length between the semiconductor chip and the walls of the cavity is limited according to the long and short length of the semiconductor chip, and the interval between the rear surface of the semiconductor chip and the substrate.
    • 目的:提供一种用于多倒装芯片的底部填充封装工艺的模具,以能够在倒装芯片上同时执行封装工艺,并且以前防止由于空隙的产生而导致的倒装芯片的损坏, 通过形成具有预定尺寸的空腔直接接触。 构成:分别形成具有与基板相对的开口部分的多个空腔(310),用于在进行封装工艺时保持半导体芯片。 多个密封剂流入端口(320)形成在空腔的一侧,分别用于将密封剂引导到空腔中。 多个密封剂流出口(340)形成在空腔的另一侧,用于分别从空腔排出密封剂和空气。 根据半导体芯片的长和短长度以及半导体芯片的背面与衬底之间的间隔,限制了半导体芯片与空腔壁之间的最大距离长度。
    • 3. 发明授权
    • 멀티 플립칩의 언더필 인캡슐레이션 공정용 몰드
    • 멀티플립칩칩의언필필인캡슐레이션공정용몰드
    • KR100400496B1
    • 2003-10-08
    • KR1020010078746
    • 2001-12-13
    • 서화일한세진김광선
    • 서화일김광선한세진
    • H01L21/56
    • B29C45/34H01L21/565H01L24/97H01L2224/16225
    • A mold for underfill encapsulation process of multi flip chip is disclosed. The mold has a multiplicity of cavities, in each of which each of said semiconductor chips is accommodated; a multiplicity of encapsulant inlets for guiding the injected encapsulant into said cavities; and a multiplicity of encapsulant outlets for exhausting the encapsulant and air in said cavities to the outside of said cavities. The mold for underfill encapsulation process of multi flip chip in accordance with the present invention is able to encapsulate numbers of flip chips at the same time, and thus it reduces the processing time required for encapsulation process and thereby remarkably improves the overall productivity.
    • 公开了用于多倒装芯片的底部填充封装工艺的模具。 该模具具有多个空腔,每个空腔容纳有每个所述半导体芯片; 多个密封剂入口,用于将注入的密封剂引导到所述空腔中; 以及多个密封剂出口,用于将所述空腔中的密封剂和空气排出到所述空腔的外部。 根据本发明的用于多倒装片的底部填充密封工艺的模具能够同时封装多个倒装芯片,因此减少了封装工艺所需的处理时间,从而显着提高了整体生产率。
    • 4. 发明授权
    • 집적회로의 언더필 인캡슐레이션 장치 및 방법
    • 집적회로의언더필인캡슐레이션장치및방법
    • KR100418428B1
    • 2004-02-11
    • KR1020010047446
    • 2001-08-07
    • 서화일한세진김광선
    • 서화일김광선한세진
    • H01L21/56
    • PURPOSE: An apparatus and method for underfill encapsulation of integrated circuits are provided to shorten a time for encapsulation process by removing the remaining encapsulant from an encapsulant injection hole and an encapsulant exhaust hole after hardening the encapsulant. CONSTITUTION: A frame(100) includes a base(110), an upper plate(120), a plurality of guide bars(130) for connecting the base(110) with the upper plate(120), and a transport plate(140). A mold(200) is formed with an upper mold(210) loaded on a bottom face of the upper plate(120) and a lower mold(220) mounted on the transport plate(140). A cavity(212) and a channel are formed at a lower portion of the upper mold(210). A groove(222) is formed at the upper mold(220). The groove(222) corresponds to the cavity(212) and the channel. An elevator(300) is used for moving the transport plate(140) along the guide bars(130). An encapsulant injector(400) has a plunger(410) and a sub motor(420) in order to inject an encapsulant into the cavity(212). A pressure controller(500) has a plunger(510) and a sub motor(520) in order to control a pressure of the cavity(212) or remove the remaining encapsulant from an exhaust hole(216).
    • 目的:提供一种用于集成电路的未填充封装的设备和方法,以在固化封装剂之后通过从密封剂注入孔和密封剂排出孔移除剩余的密封剂来缩短封装过程的时间。 构成:框架(100)包括基座(110),上板(120),用于将基座(110)与上板(120)连接的多个导杆(130),以及传送板(140 )。 模具(200)由装载在上板(120)的底面上的上模具(210)和安装在运输板(140)上的下模具(220)形成。 在上模(210)的下部形成空腔(212)和通道。 在上模(220)处形成凹槽(222)。 凹槽(222)对应于空腔(212)和通道。 电梯(300)用于沿着引导杆(130)移动运输板(140)。 密封剂注入器(400)具有柱塞(410)和子马达(420)以将密封剂注入空腔(212)中。 压力控制器(500)具有柱塞(510)和副电机(520),以控制腔体(212)的压力或从排气孔(216)移除剩余的密封剂。
    • 5. 发明公开
    • 유자 식초 제조 방법
    • CITRON VINIIGAR的制造方法
    • KR1020130053462A
    • 2013-05-24
    • KR1020110117976
    • 2011-11-14
    • 서화일
    • 서화일
    • C12J1/04C12R1/02
    • C12J1/04C12R1/02
    • PURPOSE: A method for manufacturing citrus vinegar is provided to effectively extract nutrients and useful substances of citrus by pulverizing and maturing the fruit of citrus. CONSTITUTION: A method for manufacturing citrus vinegar comprises: a step of selecting and washing citrus(S100) by ultrasonic wave and aeration; a step of cutting and crushing the citrus(S200); a step of adding organic sugar and maturing(S300) at 10 deg. C for 1 month; a step of inoculating yeast and fermenting(S400); a step of clarifying(S500) and fermenting by acetic acid fermentation(S600); and a step of maturing and filtering the liquid(S700). [Reference numerals] (S100) Select and wash raw materials; (S200) Cut and crush the entire body; (S300) Sugar and low temperature mature; (S400) Ferment with alcohol; (S500) Centrifuge and clarify; (S600) Static culture; (S700) Mature and filter
    • 目的:提供柑橘醋的制造方法,通过粉化和熟化柑橘的果实来有效提取柑橘的营养成分和有效成分。 构成:生产柑橘醋的方法包括:通过超声波和曝气选择和清洗柑橘(S100)的步骤; 切割柑橘的一个步骤(S200); 在10℃加入有机糖并熟化(S300)的步骤。 C一个月; 接种酵母和发酵的步骤(S400); 澄清(S500)和通过乙酸发酵发酵的步骤(S600); 以及熟化和过滤液体的步骤(S700)。 (附图标记)(S100)选择并洗涤原料; (S200)切割并粉碎整个身体; (S300)糖低温成熟; (S400)酒精发酵; (S500)离心澄清; (S600)静态培养; (S700)成熟并过滤
    • 6. 实用新型
    • 동전선별계수기
    • 硬币分类柜台
    • KR200270403Y1
    • 2002-04-03
    • KR2020010037911
    • 2001-12-07
    • 서화일
    • 서화일
    • G07D3/16
    • 본 고안은 동전선별계수기에 관한 것이다. 본 고안의 동전선별계수기는 회전식 선별장치에서 동전이 떨어지거나 미끄러져 내려올 때 센서를 이용해 동전을 계수하는 수단, 일정 개수의 동전이 계수되면, 다음 동전이 동전선별장치의 동전구멍에서 떨어지기 전 동전선별장치를 정지시키는 수단, 동전이 담긴 동전통에서 계수된 동전이 제거되어 동전통이 빈 상태가 되면 이를 센서로 감지하거나, 별도 스위치를 눌러 다시 동전선별장치를 동작시켜 동전선별계수를 시작하는 수단을 포함한다. 본 고안에서의 동전통은 동전랩퍼(wrapper)과 랩퍼케이스로 구성된다. 동전랩퍼는 동전이 담긴 후 동전선별계수기에서 제거되어 사용되며, 랩퍼케이스는 동전랩퍼를 물리적으로 지지하기 위한 것이다. 동전이 랩퍼 바깥으로 떨어지는 것을 막기 위해 동전이 떨어지는 반대쪽 랩퍼케이스의 위가 높게 고안된다.
      이에 따라 본 고안의 동전선별계수기에 의하면, 일정개수의 동전이 동전선별장치에서 떨어진 후 다음 동전이 떨어지기전 선별장치를 정지시킴으로써 정확한 개수의 동전을 동전랩퍼에 담을 수 있다. 또한 랩퍼케이스의 구조를 동전통로 반대쪽 위가 높도록 함으로써 동전이 랩퍼 바깥으로 떨어지는 것을 방지하므로 선별된 모든 동전이 랩퍼속에 들어가게 된다. 따라서 동전의 정확한 계수 및 수집이 가능하다.
    • 7. 发明授权
    • 마이크로 미러의 제조방법
    • 마이크로미러의제조방법
    • KR100374516B1
    • 2003-03-03
    • KR1020010017867
    • 2001-04-04
    • 서화일이우영임경화
    • 서화일이우영임경화
    • G11B7/22
    • PURPOSE: A method for manufacturing a micro mirror is provided to improve the reliability of manufacturing processes by defining a thickness of mirror plate and forming a structure of mirror after the mirror plate is attached to an electrode plate. CONSTITUTION: A method for manufacturing a micro mirror includes the steps of: forming a gap between a mirror plate(11) and an electrode plate(12) by partially etching a silicon wafer, forming an electrode(13) by depositing and etching a metal on a glass wafer, coupling the glass wafer deposited thereon the electrode(13) to the etched silicon wafer, forming the mirror with dozens of μm in thickness by grinding the silicon wafer and forming the mirror plate(11) and a spring by partially etching the silicon wafer.
    • 目的:提供一种制造微反射镜的方法,通过限定反射镜板的厚度并且在反射镜板附接到电极板上之后形成反射镜的结构来提高制造过程的可靠性。 用于制造微镜的方法包括以下步骤:通过部分地蚀刻硅晶片在镜板(11)和电极板(12)之间形成间隙,通过沉积和蚀刻金属来形成电极(13) 在玻璃晶片上,将沉积在其上的玻璃晶片与电极(13)耦合到蚀刻的硅晶片上,通过研磨硅晶片并形成镜板(11)和形成具有几十μm厚度的反射镜 通过部分蚀刻硅晶片来弹簧。
    • 9. 发明授权
    • 냉각장치가 구비된 노광설비
    • 具有冷却装置的曝光装置
    • KR100823181B1
    • 2008-04-21
    • KR1020070026693
    • 2007-03-19
    • 주식회사 코디엠이우영서화일김종원
    • 강흥석박용규이우영서화일김종원
    • H01L21/027
    • G03F7/70891G03F7/7015G03F7/702
    • Exposure equipment with a cooling apparatus is provided to adjust the temperature in a chamber by supplying and circulating water of low temperature to cooling pipes installed in both sides of the chamber. A reflection plate for reflecting the light generated from a lamp downward is installed in a chamber. A pair of first and second reflection mirrors reflect the light transferred from the reflection plate in both lateral directions. A pair of lenses collect the light transferred as a dispersed state from the second reflection mirror to transfer the collected light to the edge of a substrate. Cooling pipes(150a,150b) uniformly maintains the inner temperature of the chamber increased by the lamp, installed in both lateral surfaces of the chamber. A sub chamber can guarantee the path of the parallel light transferred to the first reflection mirror through the reflection plate, installed between the lamp and the first reflection mirror.
    • 提供具有冷却装置的曝光设备,通过将低温水供应并循环到安装在室的两侧的冷却管道来调节室内的温度。 用于将从灯泡产生的光向下反射的反射板安装在室中。 一对第一和第二反射镜在两个横向上反射从反射板传递的光。 一对透镜从第二反射镜收集作为分散状态传送的光以将收集的光转印到基板的边缘。 冷却管(150a,150b)通过安装在室的两个侧表面中的灯均匀地保持室的内部温度升高。 子室可以保证通过安装在灯和第一反射镜之间的反射板传递到第一反射镜的平行光的路径。
    • 10. 发明公开
    • 무기질 재료를 섬유에 증착하는 방법
    • 在纤维上沉积无机材料的方法
    • KR1020010089091A
    • 2001-09-29
    • KR1020000014402
    • 2000-03-21
    • 권대혁서화일전춘배허만우
    • 권대혁전춘배허만우서화일
    • D06M10/06
    • PURPOSE: A method for depositing inorganic material such as elvan using sputtering method and condensing moisture contained in fiber using a cooling apparatus is provided. Whereby, the deposited inorganic material does not come off after creasing several times or cleaning and has excellent infiltration performance to fiber and deep color properties. CONSTITUTION: In depositing inorganic material on the surface of fiber, the pressure in a chamber is controlled lower than normal pressure for depositing and the inorganic material such as elvan is sintered and formed in a state of powder. A cooling apparatus is used to remove moisture contained in fiber and control pressure.
    • 目的:提供使用溅射法沉积诸如elvan的无机材料并使用冷却装置冷凝纤维中含有的水分的方法。 由此,沉积的无机材料在折皱几次或清洗之后不会脱落,并且对纤维具有优异的渗透性能和深色性能。 构成:在纤维表面上沉积无机材料时,将室内的压力控制得比正常压力低,并且将诸如埃尔文的无机材料以粉末状烧结形成。 使用冷却装置去除纤维中含有的水分并控制压力。