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    • 2. 发明公开
    • 메모리 유닛의 제조 방법
    • 制造记忆单元的方法
    • KR1020100053795A
    • 2010-05-24
    • KR1020080112595
    • 2008-11-13
    • 삼성전자주식회사
    • 이문숙조병옥정석우야스에타카히로전상훈조은희
    • H01L27/115H01L21/8247B82Y10/00
    • H01L21/28273B82Y10/00H01L21/31144H01L21/3213H01L21/76224Y10S977/762
    • PURPOSE: A method for manufacturing a memory unit is provided to arrange precisely integrated nano-wires on a substrate using guide patterns of a micro-structure as a molding layer. CONSTITUTION: A first electrode layer is formed on an acceptor substrate(100). A micro-structure includes first guide patterns and a second guide patterns on the first electrode layer. First nano-wires(204) are formed on a donor substrate. The first nano-wires are attached on the upper side of the first electrode layer and the second guide patterns. A part of the first electrode layer is removed in order to form first electrodes(120) on the lower side of the first nano-wires. An insulation layer for filling space between the first electrodes and the first nano-wires is formed on the acceptor substrate. Second electrodes are formed on the first nano-wires and the insulation layer.
    • 目的:提供一种用于制造存储单元的方法,以使用作为模制层的微结构的引导图案将精确集成的纳米线布置在基板上。 构成:在受主衬底(100)上形成第一电极层。 微结构包括第一引导图案和第一电极层上的第二引导图案。 在施主衬底上形成第一纳米线(204)。 第一纳米线附着在第一电极层和第二引导图案的上侧。 去除第一电极层的一部分以在第一纳米线的下侧形成第一电极(120)。 在受主基板上形成用于填充第一电极和第一纳米线之间的空间的绝缘层。 在第一纳米线和绝缘层上形成第二电极。
    • 5. 发明公开
    • 상변화 메모리 장치 및 이의 제조 방법
    • 相变存储器件及其制造方法
    • KR1020060018172A
    • 2006-02-28
    • KR1020040066532
    • 2004-08-23
    • 삼성전자주식회사
    • 조병옥남상돈최석헌
    • H01L27/115
    • H01L45/06H01L45/1233H01L45/126H01L45/143H01L45/144H01L45/16H01L45/1675H01L21/28273
    • 상변화 메모리 장치 및 이의 제조 방법에 관한 것으로서, 제1절연막 패턴에 형성된 비아홀 내에 금속막 패턴과 상기 금속막 패턴의 상부 중심에 매립된 플러그를 포함하는 금속 배선을 형성한 후 상기 제1절연막 패턴 상에 상기 금속 배선과 연결되는 콘택 전극을 포함하는 제2절연막 패턴을 형성한다. 이어서, 상기 제2절연막 패턴 상에 상변화 물질막을 형성한 후 상기 상변화 물질막 상에 상부 전극막을 형성함으로서 상변화 메모리 장치를 완성한다. 상술한 방법으로 형성된 상변환 메모리 장치는 금속 배선 내에 공극이 형성되지 않기 때문에 저항의 페일(Fail)없이 고속으로 정보를 저장 및 소거 할 수 있다.
    • 在第一绝缘膜图案上形成包括在第一绝缘膜图案中形成的通孔中的金属膜图案以及嵌入在金属膜图案的上部中心中的插塞的金属布线, 形成包括连接到金属布线的接触电极的第二绝缘膜图案。 随后,在第二绝缘膜图案上形成相变材料膜,然后在相变材料膜上形成上电极膜以完成相变存储器件。 通过上述方法形成的相变存储器件可以高速地存储和擦除信息,而不会导致电阻器的故障,因为在金属布线中没有形成空隙。
    • 6. 发明公开
    • 구조물들 검측 방법
    • 检查结构的方法
    • KR1020110006080A
    • 2011-01-20
    • KR1020090063547
    • 2009-07-13
    • 삼성전자주식회사
    • 우석훈여정호조병옥박주온박창민김원선
    • G01N21/25G01B11/30
    • G01B11/06G01B11/02G01B11/24G01B2210/56G01N21/956G01N2021/95615G03F7/70625
    • PURPOSE: A structure inspecting method is provided to facilitate the measurement of the line width and thicknesses of structure by removal in processes of offsetting measurement difference between a model and a structure to be measured. CONSTITUTION: A structure inspecting method comprises following steps. A preliminary spectrum of standard diffraction intensity according to the line widths of the standard structures is prepared(S100). The linear spectrum is obtained from the preliminary spectrum in a fixed line width range(S110). The first light is incident to a structure formed on a structure to be measured(S120). The diffracted measurement diffraction intensity is measured from the structure(S130). The line width of the structure is obtained from the measurement diffraction intensity using the linear spectrum(S140).
    • 目的:提供一种结构检查方法,以便在模拟和待测量结构之间的测量差异偏移的过程中通过去除在线宽度和结构厚度的测量。 构成:结构检查方法包括以下步骤。 准备根据标准结构的线宽的标准衍射强度的初步光谱(S100)。 从固定线宽范围的初步光谱获得线性光谱(S110)。 第一光入射到待测结构上形成的结构(S120)。 从结构(S130)测量衍射测量衍射强度。 使用线性光谱从测量衍射强度获得结构的线宽(S140)。
    • 7. 发明公开
    • 씨모스 트랜지스터 및 그 제조 방법
    • CMOS晶体管及其制造方法
    • KR1020100009869A
    • 2010-01-29
    • KR1020080070685
    • 2008-07-21
    • 삼성전자주식회사
    • 전상훈이문숙조병옥
    • H01L27/092H01L21/8238B82Y40/00
    • H01L27/124B82Y10/00H01L27/095H01L27/1214H01L27/1222H01L27/1225H01L27/1251H01L29/0665H01L29/0673H01L29/45H01L29/7839H01L29/78681H01L29/7869
    • PURPOSE: A CMOSFET and a manufacturing method thereof are provided to obtain On/Off property by forming an N-type transistor and a P-type transistor on a semiconducting channel film. CONSTITUTION: A first and a second gate electrode(102a,102b) are formed on a substrate(100). A gate insulating layer(104) is laminated on the first and the second gate electrode and the substrate. An N-type semiconducting channel film(106) is formed on the substrate to cover the gate insulating layer(104). An ohmic contact(108) is welded on an N-type semiconducting channel film surface of the first gate electrode. A Schottky contact(110) is welded on the N-type semiconducting channel film of the both sides of the second gate electrode. The ohmic contact and the Schottky contact are covered by a protective film(112). The ohmic contact and the Schottky contact are electrically connected through a second wire(120). The third wire(122) is electrically connected to the ohmic contact. The fourth wire(124) is electrically connected to the Schottky contact.
    • 目的:提供CMOSFET及其制造方法,通过在半导体沟道膜上形成N型晶体管和P型晶体管来获得On / Off特性。 构成:在基板(100)上形成第一和第二栅电极(102a,102b)。 栅极绝缘层(104)层叠在第一和第二栅电极和基板上。 在衬底上形成N型半导体沟道膜(106)以覆盖栅极绝缘层(104)。 欧姆接触件(108)焊接在第一栅电极的N型半导体沟道膜表面上。 将肖特基接触件(110)焊接在第二栅电极的两侧的N型半导体沟道膜上。 欧姆接触和肖特基接触被保护膜(112)覆盖。 欧姆接触和肖特基接触通过第二导线(120)电连接。 第三线(122)电连接到欧姆接触。 第四线(124)电连接到肖特基接触。