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    • 5. 发明公开
    • 실리콘계 고분기 고분자 계면 활성제, 이의 제조방법 및이를 포함하는 린스용액을 이용한 린스방법
    • 基于硅酮的高分子量聚合物表面活性剂,其制备方法和使用含有表面活性剂的溶液的冲洗方法
    • KR1020040077454A
    • 2004-09-04
    • KR1020040001916
    • 2004-01-12
    • 삼성전자주식회사
    • 김경미김부득김재호김영호이시용윤상웅
    • C11D1/00C11D11/00H01L21/02
    • C08G77/50C08G77/06C08G77/12C08G77/20C08L83/04C08L83/06C11D1/008C11D3/373C11D11/0047H01L21/02057
    • PURPOSE: A silicone-based highly branched polymer surfactant and preparation method thereof, and a rinsing method using a rinse solution containing the surfactant are provided to remove the hydrophobic photoresist residues with ease, by substituting the terminal group of a polymer having a hydrophobic siloxane backbone with a hydrophilic carboxyl group. CONSTITUTION: The silicone-based highly branched polymer surfactant comprising both of a hydrophilic group and a hydrophobic group is prepared by: hydrolyzing dimethylchlorosilane to form a dimethylsilanol; reacting the resulted dimethylsilanol with divinylmethylchlorosilane to obtain a monomer of methyldivinylsiloxy dimethylsilane represented by the formula 1, wherein R1 is a vinyl group and R2 is a hydric group; and carrying out polymerization process, which comprises polymerizing the monomers by hydrosilation to prepare a polymer and substituting the terminal group of the resulted polymer with a carboxylic group. The rinsing method using a rinse solution containing the surfactant comprises: forming photoresist patterns on a semiconductor substrate; applying a rinse solution comprised of the silicone-based highly branched polymer surfactant and deionized water onto the photoresist pattern and the semiconductor substrate; releasing the residues of a developing solution and photoresist from the pattern and the substrate; and removing the released residues.
    • 目的:提供一种硅基高支化聚合物表面活性剂及其制备方法,以及使用含有表面活性剂的漂洗溶液的漂洗方法,通过用具有疏水性硅氧烷主链的聚合物的末端基取代疏水性光致抗蚀剂残留物 具有亲水性羧基。 构成:通过以下方法制备包含亲水基团和疏水基团的硅氧烷基高支化聚合物表面活性剂:水解二甲基氯硅烷以形成二甲基硅烷醇; 使得到的二甲基硅烷醇与二乙烯基甲基氯硅烷反应,得到由式1表示的甲基二乙烯基甲硅烷氧基二甲基硅烷的单体,其中R1是乙烯基,R2是一个羟基; 并进行聚合过程,其包括通过硅氢化使单体聚合以制备聚合物并用羧基取代所得聚合物的末端基团。 使用含有表面活性剂的冲洗溶液的冲洗方法包括:在半导体衬底上形成光刻胶图案; 将由硅氧烷基高分子量聚合物表面活性剂和去离子水组成的漂洗溶液施加到光致抗蚀剂图案和半导体衬底上; 从图案和衬底释放显影液和光致抗蚀剂的残留物; 并除去释放的残留物。
    • 10. 发明公开
    • 웨이퍼 가열용 열판
    • 加热加热板
    • KR1020030059633A
    • 2003-07-10
    • KR1020020000231
    • 2002-01-03
    • 삼성전자주식회사
    • 최삼종조규철윤상웅김연숙한신혁
    • H01L21/027
    • PURPOSE: A heat plate for heating a wafer is provided to be capable of securing the uniformity of heat distributed at the wafer by forming an additional heat coil at the center and peripheral portion of the heat plate, respectively. CONSTITUTION: A heat plate(40') for heating a wafer is provided with a plurality of closed loop type heat coils(61,62,63) having different diameters. At this time, the second closed loop type heat coil(62) has a diameter larger than that of the first closed loop type heat coil(61). At the time, the third closed loop type heat coil(63) has a diameter larger than that of the second closed loop type heat coil(62). Preferably, a plurality of connecting screws capable of controlling the distance between the center portion of the heat plate and each heat coil, are installed corresponding to each heat coil.
    • 目的:提供用于加热晶片的加热板,以便能够通过在加热板的中心和周边部分处形成额外的热线圈来确保分布在晶片上的热量的均匀性。 构成:用于加热晶片的加热板(40')设置有具有不同直径的多个闭环型热线圈(61,62,63)。 此时,第二闭环式热线圈(62)的直径大于第一闭环式热线圈(61)的直径。 此时,第三闭环式热线圈(63)的直径大于第二闭环式热线圈(62)的直径。 优选地,对应于每个热线圈安装能够控制加热板的中心部分和每个热线圈之间的距离的多个连接螺钉。