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1. 发明授权

KR101872644B1 팬-아웃 반도체 장치 有权
公开(公告)号：KR101872644B1
公开(公告)日：2018-06-28
申请号：KR1020170069756
申请日：2017-06-05
申请人： 삼성전기주식회사
发明人： 황준오 , 김광윤 , 성기정
IPC分类号： H01L25/07 , H01L23/48 , H01L23/28 , H01L23/522
CPC分类号： H01L23/5386 , H01L23/13 , H01L23/3128 , H01L23/367 , H01L23/481 , H01L23/5384 , H01L23/5389 , H01L23/552 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/24 , H01L2224/02379 , H01L2224/0401 , H01L2224/05024 , H01L2224/13023 , H01L2224/13024 , H01L2224/16227 , H01L2224/18 , H01L2224/2401 , H01L2224/24195 , H01L2224/24225 , H01L2224/24265 , H01L2924/14 , H01L2924/15153 , H01L2924/19041 , H01L2924/19102 , H01L2924/19105 , H01L2924/301 , H01L2924/3025 , H01L25/073 , H01L23/28 , H01L23/522 , H01L2224/25171
摘要： 본개시는반도체칩이배치된팬-아웃형태의제1패키지와수동부품이배치된팬-아웃형태의제2패키지가반도체칩과수동부품이최대한짧은경로를통하여전기적으로연결되도록상하로적층된, 팬-아웃반도체장치에관한것이다.

2. 发明公开

KR1020140014674A 인쇄회로기판 제조용 지그 및 제조방법 无效
标题翻译：制造印刷电路板的制造方法和方法
公开(公告)号：KR1020140014674A
公开(公告)日：2014-02-06
申请号：KR1020120081308
申请日：2012-07-25
申请人： 삼성전기주식회사
发明人： 홍종국 , 최재훈 , 김광윤
IPC分类号： H05K3/46 , B29C43/20 , B29C43/52 , B29C65/02
CPC分类号： H05K3/4611 , B29C43/206 , B29C43/52 , B29C65/02 , H05K2203/068
摘要： According to the present invention, provided is a jig for manufacture of a printed circuit board comprising: first heat transfer plates disposed at the top and bottom of a plurality of substrate laminates stacked on top of one another to transfer heat to the substrate laminates; a plurality of second heat transfer plates disposed at the top and bottom of the substrate laminates to transfer the heat transmitted from the first heat transfer plates to the substrate laminates; and a plurality of connecting parts configured to connect the second heat transfer plates to transfer heat among the second heat transfer plates. According to another aspect of the present invention, provided is a method for manufacturing a printed circuit board comprising the steps of: interposing each of a plurality of second heat transfer plates between a plurality of substrate laminates to stack the substrate laminates; stacking a pair of first heat transfer plates at the top and bottom of the substrate laminates; connecting the second heat transfer plates to each other by using a plurality of connecting parts; and heating and pressurizing the first heat transfer plates by a heat press machine.
摘要翻译：根据本发明，提供了一种用于制造印刷电路板的夹具，包括：第一传热板，其设置在彼此叠置的多个基板层叠体的顶部和底部，以将热量传递到基板层压板; 设置在基板层叠体的顶部和底部的多个第二传热板，以将从第一传热板传递的热量传递到基板层压板; 以及多个连接部件，其构造成连接第二传热板以在第二传热板之间传递热量。根据本发明的另一方面，提供了一种制造印刷电路板的方法，包括以下步骤：将多个第二传热板中的每一个插入多个基板层压板之间以堆叠基板层压板; 在基板层叠体的顶部和底部堆叠一对第一传热板; 通过使用多个连接部分将第二传热板彼此连接; 并通过热压机加热和加压第一传热板。

3. 发明公开

KR1020160097948A 연성 인쇄회로기판 및 그 제조 방법 无效
标题翻译：柔性印刷电路板及其制造方法
公开(公告)号：KR1020160097948A
公开(公告)日：2016-08-18
申请号：KR1020150020465
申请日：2015-02-10
申请人： 삼성전기주식회사
发明人： 정명희 , 정주환 , 김광윤 , 유제광 , 정율교
IPC分类号： H05K3/46 , H05K1/18 , H05K3/28
CPC分类号： H05K3/4632 , H05K1/185 , H05K3/28
摘要： 연성인쇄회로기판및 그제조방법이개시된다. 본발명의일 측면에따른연성인쇄회로기판은연성영역을포함하는내층기판부, 연성영역을제외한내층기판부상에적층되는외층기판부및 연성영역에해당하는내층기판부의적어도일면에적층되는적층체를포함하고, 적층체는내부에도전체가이방성으로혼입되어내층기판부에적층되는접착층및 접착층상에적층되는폴리이미드층을포함한다.
摘要翻译：公开了一种柔性印刷电路板及其制造方法。根据本发明的实施例，柔性印刷电路板包括：内层基板单元，其包括柔性区域; 层叠在除了柔性区域之外的内层基板单元上的外层基板单元; 以及层压体，层叠在与柔性区域对应的内层基板单元的至少一个面上。层叠体包括：通过各向异性将导体混合在内层基板单元上层压的接合层; 以及层叠在所述接合层上的聚酰亚胺层。

4. 发明授权

KR100852504B1 노광장치 失效
标题翻译：曝光装置
公开(公告)号：KR100852504B1
公开(公告)日：2008-08-18
申请号：KR1020070020934
申请日：2007-03-02
申请人： 삼성전기주식회사
发明人： 김기홍 , 김광윤 , 김근호 , 박경태 , 손상혁 , 신용상 , 김동현
IPC分类号： G03F7/20
CPC分类号： G03F7/2051 , G03F7/70116 , G03F7/70158 , G03F7/70225 , G03F7/70233 , G03F7/70316
摘要： An exposure apparatus for exposing a substrate selectively by corresponding to a circuit pattern is provided to allow an exposure process to be carried out without using a work film, thereby simplifying the process and lowering cost. An exposure apparatus comprises a main body; a plate display part(21) which is combined with the main body and displays the image corresponding to a circuit pattern; and a mirror part(23) which is laminated on the display part and reflects light to the direction of a substrate(31). Preferably the apparatus comprises further a light source(10) which radiates a parallel light to the mirror part; and the display part corresponds to the change of the size of the substrate so as to change the size of the image and to display the changed image.
摘要翻译：提供用于通过对应于电路图案选择性地曝光衬底的曝光设备，以允许在不使用工作膜的情况下进行曝光处理，从而简化了工艺并降低了成本。曝光装置包括主体; 与主体组合并显示对应于电路图案的图像的板显示部分（21）; 以及层叠在显示部上并将光反射到基板（31）的方向的反射镜部（23）。优选地，该装置还包括将平行光辐射到镜部分的光源（10）; 并且显示部分对应于基板的尺寸的变化，以便改变图像的尺寸并显示改变的图像。

5. 发明公开

KR1020070113404A 인쇄회로기판 및 그 제조 방법 失效
标题翻译： PCB及其制造方法
公开(公告)号：KR1020070113404A
公开(公告)日：2007-11-29
申请号：KR1020060046208
申请日：2006-05-23
申请人： 삼성전기주식회사
发明人： 김종국 , 임경환 , 김병학 , 김광윤 , 김근호 , 전일균
IPC分类号： H05K3/00 , H05K3/42 , H05K3/40
CPC分类号： H05K3/0044 , H05K1/115 , H05K3/108 , H05K3/42
摘要： A printed circuit board and a manufacturing method thereof are provided to improve the flexural rigidity of the printed circuit board by using a reinforcing material in a core layer of the printed circuit board. A manufacturing method of a printed circuit board includes the steps of: forming a through hole by perforating a reinforcing substrate(S11) with a mechanical method; filling the through hole with an insulating material by laminating the insulating material on both sides of the reinforcing substrate(S12); perforating a via hole which penetrates the insulating material and the through hole in correspondence to the corresponding location to the through hole(S13); and plating the inner peripheral surface of the via hole, and forming a circuit pattern on the surface of the insulating material(S14).
摘要翻译：提供一种印刷电路板及其制造方法，以通过在印刷电路板的芯层中使用增强材料来提高印刷电路板的抗弯刚度。印刷电路板的制造方法包括以下机械方法对增强基板（S11）进行穿孔而形成贯通孔的工序; 通过在加强基板的两侧层叠绝缘材料，用绝缘材料填充通孔（S12）; 对应于通孔的对应位置穿透贯穿绝缘材料和通孔的通孔（S13）; 并对通孔的内周面进行电镀，在绝缘材料的表面形成电路图案（S14）。

6. 发明授权

KR100653243B1 적응형 인쇄회로기판 제조 방법 失效
标题翻译： 적응형인쇄회로기판제조방법
公开(公告)号：KR100653243B1
公开(公告)日：2006-12-01
申请号：KR1020050074634
申请日：2005-08-16
申请人： 삼성전기주식회사
发明人： 정재엽 , 임경환 , 김광윤 , 조인숙 , 김근호
IPC分类号： H05K13/08 , H05K3/06
摘要： A method for fabricating an adaptive type printed circuit board is provided to measure a detailed scale by using a three-dimension measuring instrument. A method for fabricating an adaptive type printed circuit board includes the steps of: forming a circuit pattern outside a core layer(S305); performing outer layer inspection and scale measurement for the formed circuit pattern simultaneously(S355); fabricating a solder resist exposure film corresponding to the measured scale(S353); spreading solder resist ink on the circuit pattern(S365); performing an exposure process by using the fabricated solder resist exposure film(S370); and performing a development process removing the solder resist ink(S375).
摘要翻译：提供了一种用于制造自适应型印刷电路板的方法，以通过使用三维测量仪器来测量详细比例。一种制造自适应型印刷电路板的方法包括以下步骤：在芯层外部形成电路图案（S305）; 对形成的电路图案同时进行外层检查和刻度测量（S355）; 制造对应于所测量的刻度的阻焊剂曝光膜（S353）; 在电路图案上散布阻焊油墨（S365）; 通过使用制造的阻焊剂曝光膜执行曝光工艺（S370）; 并执行去除阻焊油墨的显影工艺（S375）。

7. 发明公开

KR1020130089497A 인쇄회로기판 제조용 캐리어와 그 제조 방법 无效
标题翻译：制造印刷电路板的承载件及其制造方法
公开(公告)号：KR1020130089497A
公开(公告)日：2013-08-12
申请号：KR1020120010915
申请日：2012-02-02
申请人： 삼성전기주식회사
发明人： 김광윤 , 장태은 , 조석현
IPC分类号： H05K3/00 , H01L23/28
CPC分类号： H05K3/428 , H05K3/007 , Y10T29/49165 , Y10T29/53265
摘要： PURPOSE: A carrier for manufacturing a printed circuit board and a manufacturing method thereof are provided to minimize physical and chemical stresses in a substrate manufacturing process through a structure where an outskirt part of a carrier is completely wrapped by a protecting unit, and to offer the carrier capable of uniformly forming a predetermined sized buffer zone regardless of elasticity of a product when the buffer zone for preventing external shocks is formed, through a hole punching process and an X-ray process at the time of manufacturing the carrier to conduct uniform trimming. CONSTITUTION: A carrier for manufacturing a printed circuit board comprises a core member (100) consisting of a base substrate (101), first metal layers (102) stacked on the both surfaces of the base substrate, and second metal layers (103) stacked on the first metal layers; and a protection unit (200) formed in order to completely wrap an outskirt of the core member.
摘要翻译：目的：提供一种用于制造印刷电路板的载体及其制造方法，以通过其中载体的外围部分被保护单元完全包裹的结构来最小化基板制造过程中的物理和化学应力，并提供能够通过打孔处理和制造载体时的X射线处理来形成用于防止外部冲击的缓冲区域而使产品的弹性均匀地形成预定尺寸的缓冲区域的载体，以进行均匀的修整。构成：用于制造印刷电路板的载体包括由基底基板（101），堆叠在基底基板的两个表面上的第一金属层（102）和堆叠在基底基板的两个表面上的第二金属层（103）组成的芯体（100）在第一层金属层上; 以及保护单元（200），其形成为完全包裹芯构件的外围。

8. 发明公开

KR1020100045659A 컴퓨터 수치 제어 드릴 장치 有权
标题翻译：计算机数字控制钻机
公开(公告)号：KR1020100045659A
公开(公告)日：2010-05-04
申请号：KR1020080104700
申请日：2008-10-24
申请人： 삼성전기주식회사
发明人： 전일균 , 김광윤 , 손상혁 , 이충희
IPC分类号： B23B39/08
摘要： PURPOSE: A drilling machine with computer numerical control is provided to precisely control a depth for a hole boring process for an interconnection by removing an error risk of the deviation of an insulation distance. CONSTITUTION: A drilling machine with computer numerical control comprises: a work table(110) which a workpiece(120) is place on; a drilling unit(131,132,133) which drills hole in the workpiece; a supporting unit(100) which supports the drilling unit and moves the drilling unit between a working position and a ready position; an ultrasonic sensor unit(140) which measures the distance from a surface of the workpiece to an internal layers; and a computer numerical control part which controls the entire operation.
摘要翻译：目的：提供一种具有计算机数字控制的钻孔机，通过消除绝缘距离偏差的误差风险，精确控制互连孔钻孔深度。构成：具有计算机数字控制的钻孔机包括：放置工件（120）的工作台（110）; 钻孔单元（131,132,133），其在工件中钻孔; 支撑单元（100），其支撑所述钻井单元并且使所述钻井单元在工作位置和就绪位置之间移动; 超声波传感器单元，其测量从工件的表面到内层的距离; 以及控制整个操作的计算机数字控制部分。

9. 发明公开

KR1020060037698A 리지드-플렉서블 기판의 제조 방법 有权
公开(公告)号：KR1020060037698A
公开(公告)日：2006-05-03
申请号：KR1020040086731
申请日：2004-10-28
申请人： 삼성전기주식회사
发明人： 이양제 , 양덕진 , 황정욱 , 임규혁 , 채정훈 , 이영호 , 김광윤 , 안동기
IPC分类号： H05K3/04
CPC分类号： H05K3/4691 , H05K3/28 , H05K3/4652 , H05K2201/09127 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： 본 발명은 리지드-플렉서블 기판의 제조 방법에 관한 것으로 레지스트 커버를 사용하지 않고 외층 회로패턴 형성시 플렉서블 영역의 베이스 동박을 윈도우 에칭처리함으로써, 공정 및 비용을 절감하고 오염에 의한 불량을 방지하여 신뢰성을 최대화하면서 외부 단자 및 실장 패드를 위하여 노출된 내층 회로패턴을 외부 환경으로부터 보호한 리지드-플렉서블 기판의 제조 방법에 관한 것이다.
리지드 플레서블 기판, 플라잉 테일 타입, 레지스트 커버, 윈도우 에칭

10. 发明授权

KR101044186B1 컴퓨터 수치 제어 드릴 장치 有权
标题翻译：电脑数控钻床
公开(公告)号：KR101044186B1
公开(公告)日：2011-06-28
申请号：KR1020080104700
申请日：2008-10-24
申请人： 삼성전기주식회사
发明人： 전일균 , 김광윤 , 손상혁 , 이충희
IPC分类号： B23B39/08
摘要： 본 발명은 컴퓨터 수치 제어 드릴 장치에 관한 것으로서, 홀 가공을 필요로 하는 부재가 놓이는 작업대와, 상기 작업대 상에 놓인 부재에 홀을 가공하는 드릴링 수단과, 상기 드릴링 수단을 지지하며 상기 드릴링 수단을 작업 위치와 작업 준비 위치 사이로 이동시키는 지지 수단과, 상기 드릴링 수단의 일측에 장착되어 상기 부재 표면으로부터 부재의 내부 구성 층들의 거리를 측정하는 초음파 센서부와, 전체 작동을 제어하는 컴퓨터 수치 제어부를 포함한다. 본 발명에 따른 컴퓨터 수치 제어 드릴 장치는 특히 다층 인쇄회로기판의 비아홀 가공 시 가공 깊이 두께 조절이 용이한 이점이 있다.
컴퓨터 수치 제어, 드릴 장치, 인쇄회로기판, 초음파 센서부

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