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    • 2. 发明专利
    • Method for producing a silica powder
    • JP4745138B2
    • 2011-08-10
    • JP2006157365
    • 2006-06-06
    • 電気化学工業株式会社
    • 英明 園田貴也 後藤誠吾 成瀬
    • C01B33/18C08K3/36C08L63/00C08L83/00H01L33/56
    • PROBLEM TO BE SOLVED: To provide silica powder which has excellent light transmittance equal to that of an epoxy resin, the light transmittance of which is hardly deteriorated even when used for a long time and which is suitable for producing an LED sealing resin composition or the like and to provide a method for manufacturing the silica powder and a rubber or resin composition, particularly, the LED sealing resin composition using the silica powder. SOLUTION: The silica powder has 120-250 m 2 /g specific surface area when measured according to a BET one-point method, ≤1.8 cc/100 g linseed oil absorption capacity per 1 m 2 specific surface area when measured according to JIS-K5101-13-1 and ≥0.85 average sphericity. The method for manufacturing the silica powder comprises the steps of: forming a high temperature field of ≥1,600°C; and jetting gaseous organosiloxane of 1/200 to 1/5 times of the volume of the high temperature field toward the high temperature field at 200-800 m/second jetting speed to heat-treat the jetted organosiloxane. A composition is obtained by mixing the obtained silica powder in at least one of the epoxy resin and a silicone resin. The LED sealing resin composition consists of the obtained composition. COPYRIGHT: (C)2008,JPO&INPIT