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1. 发明专利

JP4323706B2 Bonding method of the ceramic body and the copper plate 有权
公开(公告)号：JP4323706B2
公开(公告)日：2009-09-02
申请号：JP2000324912
申请日：2000-10-25
申请人：電気化学工業株式会社
发明人：信行吉野 , 浩二西村 , 好彦辻村
IPC分类号： B23K1/00 , C04B37/02 , B23K1/19 , B23K101/42 , H05K3/38

2. 发明专利

JP3933287B2 Heat sink with a circuit board 失效
公开(公告)号：JP3933287B2
公开(公告)日：2007-06-20
申请号：JP1839398
申请日：1998-01-30
申请人：電気化学工業株式会社
发明人：美幸中村 , 康人伏井 , 好彦辻村
IPC分类号： H01L23/14 , H01L23/373 , H05K1/03 , H05K3/38
CPC分类号： H01L2924/0002 , H05K1/0306 , H05K3/38 , H01L2924/00

3. 发明专利

JP3929335B2 Aluminum nitride sintered body and a method for manufacturing 有权
公开(公告)号：JP3929335B2
公开(公告)日：2007-06-13
申请号：JP2002068091
申请日：2002-03-13
申请人：電気化学工業株式会社
发明人：信行吉野 , 清治矢野 , 浩二西村 , 好彦辻村
IPC分类号： C04B35/581

4. 发明专利

JP3874677B2 Nitride continuous manufacturing method of the sintered aluminum 有权
公开(公告)号：JP3874677B2
公开(公告)日：2007-01-31
申请号：JP2002068090
申请日：2002-03-13
申请人：電気化学工業株式会社
发明人：信行吉野 , 清治矢野 , 浩二西村 , 好彦辻村
IPC分类号： C04B35/581 , C04B35/64
摘要： PROBLEM TO BE SOLVED: To provide a method for continuous production of an aluminum nitride sintered compact having a density, a three point bending strength and a thermal conductivity coefficient all of which are matched to those of the sintered compact obtained by a conventional batch process. SOLUTION: This method comprises continuously performing the processes for degreasing, sintering and cooling a formed body including an aluminum nitride powder, a sintering aid and an organic binder while feeding the formed body from one end of a multiple inner box and taking out a sintered body from the other end to obtain an aluminum nitride sintered compact. The multiple box is provided with the inner and outer boxes, and the relation of the partial pressure (PN 2 in ) of a non-oxidizing gas in the inner box and that (PN 2 out ) of the non-oxidizing gas between the inner and outer boxes is PN 2 in >PN 2 out . In this case, preferably, the organic binder is an acrylic resin and the formed body is formed by extrusion molding. COPYRIGHT: (C)2003,JPO

5. 发明专利

JP3827605B2 Solder wettability improvement method of the circuit board and the circuit board 有权
公开(公告)号：JP3827605B2
公开(公告)日：2006-09-27
申请号：JP2002108856
申请日：2002-04-11
申请人：電気化学工業株式会社
发明人：信行吉野 , 豪岩元 , 好彦辻村
IPC分类号： C23C18/32 , H05K3/26 , C23G1/20 , H01L23/12 , H05K3/34

6. 发明专利

JP3537320B2 Circuit board 有权
公开(公告)号：JP3537320B2
公开(公告)日：2004-06-14
申请号：JP22790298
申请日：1998-08-12
申请人：電気化学工業株式会社
发明人：康人伏井 , 信行吉野 , 克典寺野 , 勝喜湯本 , 好彦辻村
IPC分类号： H05K1/02 , H01L23/12 , H01L23/14 , H01L23/36 , H01L23/373

7. 发明专利

JP3532092B2 Based on plate 失效
公开(公告)号：JP3532092B2
公开(公告)日：2004-05-31
申请号：JP5047998
申请日：1998-03-03
申请人：電気化学工業株式会社
发明人：美幸中村 , 康人伏井 , 好彦辻村
IPC分类号： B32B15/04 , B32B9/00 , H05K1/02 , H05K1/03 , H05K3/38
CPC分类号： H05K1/0306 , H05K3/38

8. 发明专利

JP5073894B2 Nitride silicon steel plate spring material, the manufacturing methods and uses 有权
公开(公告)号：JP5073894B2
公开(公告)日：2012-11-14
申请号：JP2001286908
申请日：2001-09-20
申请人：電気化学工業株式会社
发明人：信行吉野 , 勝喜湯本 , 好彦辻村
IPC分类号： F16F1/18 , C04B35/584
摘要： PROBLEM TO BE SOLVED: To provide a disc spring material made of a silicon nitride plate large in a spring constant, especially a favorable disc spring material as a tool to pressurize a metal plate and a ceramic plate and its manufacturing method. SOLUTION: This disc spring material is made of the silicon nitride plate the spring constant of which is more than 2 N/mm. It is made of the silicon nitride plate plate thickness of which is 4-1 mm, warp quantity in the longitudinal direction at temperature 500-1000 degrees C of which is 3-5 mm as it is converted per 50 mm length, three- point flexural strength of which is more than 600 MPa and the spring constant of which is more than 2 N/mm. A tool for pressurization is constituted of a metal plate made of the disc spring material and the ceramic plate. The manufacturing method is of the disc spring material made of the silicon nitride plate of the spring constant of more than 2 N/mm constituting a characteristic feature of sintering a silicon nitride green sheet after degreasing it in a state of further adding a load by clamping it with the tool having the part curved by 3-5 mm per 50 mm length in the warp quantity in the longitudinal direction. It is favorable that the tool is made of boron nitride under this manufacturing method.

9. 发明专利

JPWO2010084824A1 アルミニウム−黒鉛複合体、それを用いた放熱部品及びＬＥＤ発光部材有权
公开(公告)号：JPWO2010084824A1
公开(公告)日：2012-07-19
申请号：JP2010547475
申请日：2010-01-15
申请人：電気化学工業株式会社
发明人：廣津留　秀樹 , 秀樹廣津留 , 智志日隈 , 智志日隈 , 真也成田 , 真也成田 , 好彦辻村 , 好彦辻村
IPC分类号： C04B41/88 , C22C1/00 , H01L23/373 , H01L33/64
CPC分类号： C04B41/009 , C04B41/5155 , C04B41/88 , C22C21/02 , H01L33/641 , H01L2933/0075 , C04B41/4521 , C04B41/4523 , C04B35/522
摘要： (1)温度25℃の熱伝導率が100〜200W/mK、直交する3方向の熱伝導率の最大値/最小値が1〜1.3、温度25℃〜150℃の熱膨張係数が2×10−6〜5×10−6/K、直交する3方向の熱膨張係数の最大値/最小値が1〜1.3、並びに、気孔率が10〜20体積%である等方性黒鉛材料を、板厚0.5〜3mmの板状に加工する工程、(2)板状の等方性黒鉛材料を離型板で挟み込んで積層し、等方性黒鉛材料の板面に対して垂直方向の締め付けトルクが1〜50Nmとなるように加圧する工程、(3)溶湯鍛造法により、珪素3〜20質量%を含有するアルミニウム合金を20MPa以上の圧力で加圧含浸して、等方性黒鉛材料の気孔の70%以上をアルミニウム合金で含浸させると共に、平均厚みが10〜300μmのアルミニウム合金層を板状等方性黒鉛材料の両主面に設ける工程、を順次含むアルミニウム−黒鉛複合体の製造方法。

10. 发明专利

JP4914284B2 Circuit board composition and the circuit board using the same 有权
公开(公告)号：JP4914284B2
公开(公告)日：2012-04-11
申请号：JP2007115125
申请日：2007-04-25
申请人：電気化学工業株式会社
发明人：奨猪又 , 好彦辻村
IPC分类号： C08G59/50 , C08G59/24 , C08L63/00 , H05K1/03 , H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide a circuit board excellent in stress relaxation, heat resistance, moisture resistance and heat radiating properties. SOLUTION: The composition for the circuit board comprises an epoxy resin having a polyether skeleton in the main chain, a curing agent having an aromatic ring and ≥2 primary amino groups on terminals of the main chain and an inorganic filler as essential components. Preferably, the composition for circuit boards includes ≥1 species epoxy resins selected from a group consisting of high molecular weight epoxy resins having a straight main chain and a bisphenol F type or a bisphenol A type skeleton having 800-4,000 epoxy equivalent, polypropylene glycol type epoxy resins, polyethylene glycol type epoxy resins and polytetramethylene glycol type epoxy resins. More preferably, the resin composition after curing has 100-5,000 MPa storage modulus at 300 K. COPYRIGHT: (C)2009,JPO&INPIT

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