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1. 发明申请

WO2009079892A1 一种LED引线框架及利用该引线框架制造LED的方法审中-公开
公开(公告)号：WO2009079892A1
公开(公告)日：2009-07-02
申请号：PCT/CN2008/000380
申请日：2008-02-22
申请人：佛山市国星光电股份有限公司 , 余彬海 , 李军政 , 夏勋力 , 缪来虎
发明人：余彬海 , 李军政 , 夏勋力 , 缪来虎
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/52 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A LED lead frame is a plate frame structure. The plate frame comprises bulges extending inward from an outer frame and separated each other. The bulges act as a chip mounting portion (301), a connection portion of an inner lead (302), an outer electrode portion (303), and a body supporter (304). The outer frame forms a connection base (305). The connection portion of an inner lead (302) and the chip-mounting portion (301) are located in the front end of the outer electrode portion (303). The chip-mounting portion (301) has a reflecting cup (306). A manufacturing method of a LED comprises that the LED chip is encapsulated by injection moldingmethod; the outer pins of the LED are buckled; and the LED is detached from the connection base (305) to form an independent device.

2. 发明申请

WO2008138183A1 侧面发光型LED 审中-公开
公开(公告)号：WO2008138183A1
公开(公告)日：2008-11-20
申请号：PCT/CN2007/002949
申请日：2007-10-15
申请人：佛山市国星光电股份有限公司 , 余彬海 , 缪来虎 , 李军政 , 李友民 , 潘利兵
发明人：余彬海 , 缪来虎 , 李军政 , 李友民 , 潘利兵
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L25/167 , H01L33/62 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2924/00
摘要： A side emission type LED comprises a frame, a die (4), a binder, a bonding wire (5), and sealant (8). The side emission type LED uses a metal substrate (1) as the frame. The metal substrate (1) is divided into two electrodes insulated each other. Binder mounts the die (4) on one electrode of the metal substrate (1). Another electrode (6) of the metal substrate (1) is connected to electrode of the die (4) by the bonding wire (5). The sealant (8) encapsulates the die (4), the bonding wire (5), and the metal substrate (1).

3. 发明申请

WO2008138182A1 一种片式发光二极管审中-公开
公开(公告)号：WO2008138182A1
公开(公告)日：2008-11-20
申请号：PCT/CN2007/002948
申请日：2007-10-15
申请人：佛山市国星光电股份有限公司 , 余彬海 , 李军政 , 夏勋力 , 潘利兵 , 李绪峰
发明人：余彬海 , 李军政 , 夏勋力 , 潘利兵 , 李绪峰
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A chip type light-emitting diode comprises a frame, a die (1), a binder, a bonding wire (2), and sealant (3). The chip type light-emitting diode uses a metal substrate (4) as the frame. The metal substrate (4) is divided into two electrodes insulated each other. Binder mounts the die on one electrode of the metal substrate. Another electrode (5) of the metal substrate is connected to a electrode of the die (1) by the bonding wire (2). The sealant (3) encapsulates the die (1), the bonding wire (2), and the metal substrate (4).

4. 发明申请

WO2009052702A1 功率LED散热基板结构及由其制造的器件审中-公开
公开(公告)号：WO2009052702A1
公开(公告)日：2009-04-30
申请号：PCT/CN2008/001740
申请日：2008-10-15
申请人：佛山市国星光电股份有限公司 , 余彬海 , 李军政 , 夏勋力
发明人：余彬海 , 李军政 , 夏勋力
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/483 , H01L2224/48091 , H01L2924/00014
摘要： A structure of heat dissipation substrate for power LED and a device manufactured by it. The present invention overcomes the deficiencies of the complex structure, the difficulty of manufacturing process, the low productivity, the high cost and the unreliability of quality of the power LED product. The structure includes: the circuit board of integral construction which has counter bore and metal line, the counter bore has the structure of connected combination of two holes with different size. The small hole is a through hole and the large hole is a blind hole, the axis directions of the two holes are the same. The structure of the heat sink is an integral construction of trapezoidal column shape that is composed of an upper step and a lower step. The heat sink and the counter bore are correspondingly matched, and they are firmly fit with each other. A plurality of counter bores are setting on the circuit board, and the circuit board also includes a plurality of lines for positioning and cutting, and grooves and/or holes. An LED device manufactured by the structure of heat dissipating substrate, includes: heat sink, circuit board with the counter bore, LED IC, lead and encapsulation glue. The encapsulation glue covers the surface of the circuit board that has the IC and the lead, and retains the outer electrode, the encapsulation glue is both as an encapsulation layer for the IC and the lead, and as an integrated optical lens for the device.

5. 发明申请

WO2010115296A1 功率LED散热基板、功率LED产品及其制造方法审中-公开
公开(公告)号：WO2010115296A1
公开(公告)日：2010-10-14
申请号：PCT/CN2009/000388
申请日：2009-04-10
申请人：佛山市国星光电股份有限公司 , 余彬海 , 李军政 , 夏勋力
发明人：余彬海 , 李军政 , 夏勋力
IPC分类号： H01L25/075 , H01L25/13 , H01L23/367 , H01L33/00
CPC分类号： H01L33/486 , H01L23/3677 , H01L25/0753 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2924/01322 , H01L2924/181 , H01L2924/1815 , H01L2933/0075 , Y10T29/49124 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

6. 发明申请

WO2009070950A1 一种通过注胶成型透镜的功率LED及其制造方法审中-公开
公开(公告)号：WO2009070950A1
公开(公告)日：2009-06-11
申请号：PCT/CN2008/000590
申请日：2008-03-26
申请人：佛山市国星光电股份有限公司 , 余彬海 , 李军政 , 夏勋力
发明人：余彬海 , 李军政 , 夏勋力
IPC分类号： H01L33/00 , H01L21/56 , B44C1/20 , B29C45/26
CPC分类号： B29C45/14655 , H01L33/483 , H01L33/52 , H01L2224/48091 , H01L2924/00014
摘要： A power LED and a method of manufacture thereof. The method includes the following steps: arranging a glue injecting hole (306) and an air exhaust hole (307) on a substrate (305); providing a LED chip (308) on the substrate (305) and finishing electrical connection; then pressing a mold (301) which is applied to a molding lens (312) on the substrate (305); injecting a packaging colloid (311) to the glue injecting hole (306) from the bottom of the substrate (305); finishing the glue injection and the colloid being solidified; then detaching the mold (301); finishing the mold for packaging lens (312) of the LED chip.

7. 发明申请

WO2009049453A1 功率发光二极管封装结构审中-公开
公开(公告)号：WO2009049453A1
公开(公告)日：2009-04-23
申请号：PCT/CN2007/003740
申请日：2007-12-24
申请人：佛山市国星光电股份有限公司 , 余彬海 , 李军政 , 夏勋力
发明人：余彬海 , 李军政 , 夏勋力
IPC分类号： H01L33/00 , H01L23/367 , F21V29/00
CPC分类号： H01L33/642 , H01L33/483 , H01L2224/48091 , H01L2924/00014
摘要： A power LED encapsulation structure, comprising a heat sink (1), a circuit board, a LED chip (3), inner leads (4) and an encapsulated colloid (8). The circuit board has a counter bore (10), the heat sink (1) is inserted in the counter bore (10), the LED chip (3) is placed on the heat sink (1), and the bottom of the heat sink (1) directly contacts with the outer. The electrodes of the LED chip (3) are connected to the interior metal electrodes (7) of the circuit board by the inner leads (4), and the encapsulated colloid (8) covers the inner leads (4) and the LED chip (3).

8. 发明授权

CN102270734B 表面贴装型功率LED支架制造方法及其产品有权
公开(公告)号：CN102270734B
公开(公告)日：2013-08-21
申请号：CN201010191873.7
申请日：2010-06-04
申请人：佛山市国星光电股份有限公司 , 珠海荣盈电子科技有限公司
发明人：余彬海 , 孙百荣 , 李伟平 , 夏勋力 , 李程 , 龙孟华 , 梁丽芳
IPC分类号： H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要：本发明涉及表面贴装型功率LED支架方法及其产品，其方法步骤为：1)准备双面覆金属层线路板；2)形成孔；3)设置孔壁金属层；4)增加金属层厚度；5)金属层蚀刻；6)分离功率LED支架单元。本发明克服了现有技术偏见，采用普通绝缘板作为制造功率LED支架的基板，本发明的工艺方法简单、生产效率高。本发明还提供上述方法制造的表面贴装型功率LED支架，其结构是由一双面覆金属层线路板为支架基板，其上设置有孔以及支架线路层一和支架线路层二，组成所述表面贴装型功率LED支架。本发明方法制造的产品其结构设计独特，可靠性高、出光性好、散热效果良好，其应用范围广、普及性强，适于工业化批量生产，取得了十分突出的技术效果。

9. 发明公开

CN102324460A 基于图形化封装基板的LED封装装置无效
公开(公告)号：CN102324460A
公开(公告)日：2012-01-18
申请号：CN201110326992.3
申请日：2011-10-24
申请人：佛山市国星光电股份有限公司
发明人：李宗涛 , 余彬海 , 汤勇 , 何志宏 , 李宏浩
IPC分类号： H01L33/48 , H01L33/58 , H01L33/60 , H01L33/54
摘要：本发明公开一种基于图形化封装基板的LED封装装置，包括图形化基板、设置在图形化基板上的至少一个LED芯片，覆盖在LED芯片上的封装胶体，所述图形化基板的表面具有凸起或凹槽，所述凸起或凹槽纵向截面的侧边与图形化基板水平面所成的线面角α与封装胶体的折射率n满足：或者本发明能够使光效提高35％左右，大大提高了LED封装装置的出光效率，同时结构简单；此外，在半角宽度上比传统的基于镜面基板的LED装置要窄45度，光线相对集中，便于进行二次配光。最后，由于线面角α可根据需要自由设置，而勿需设置复杂的曲面透镜，有利于实现封装的薄型化，有利于下游安装使用。

10. 发明公开

CN102064267A 显示屏用的LED支架单元、LED支架及LED支架单元的制造方法无效
公开(公告)号：CN102064267A
公开(公告)日：2011-05-18
申请号：CN201010533995.X
申请日：2010-11-02
申请人：佛山市国星光电股份有限公司 , 珠海市荣盈电子科技有限公司
发明人：余彬海 , 孙百荣 , 李伟平 , 李程 , 梁丽芳 , 夏勋力
IPC分类号： H01L33/48 , H01L33/60 , H01L33/56 , H01L33/00 , H01L25/075
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要：本发明涉及一种显示屏用的LED支架单元，包括第一基板和第二基板。其中，第一基板中间设有一中空的反光杯；第二基板与第一基板下表面接合，该第二基板相对两侧设置有电极。该第一基板的宽度大于该第二基板上两电极之间的宽度与两侧电极的厚度之和。相对于现有技术，本发明由于第一基板的宽度大于该第二基板上两侧电极之间的宽度与两侧电极的厚度之和，在焊接时锡膏将不会裸露在该LED支架单元外，即锡膏将不额外占据安装空间，从而提高显示屏的分辨率。

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