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    • 1. 发明专利
    • Wafer manufacturing method for ecological processing
    • 用于生态加工的波浪制造方法
    • JP2013172115A
    • 2013-09-02
    • JP2012036945
    • 2012-02-23
    • Zhihao Chen陳志豪
    • CHEN ZHIHAO
    • H01L21/301H01L21/304
    • PROBLEM TO BE SOLVED: To provide a wafer manufacturing method for ecological processing, which is capable of selecting and recycling indefectible chips among defective wafers to improve production yield and reduce manufacturing costs, is capable of reducing the quantity of waste wafers to achieve energy saving and the reduction of carbon dioxide, and is capable of meeting the needs for environment protection.SOLUTION: In the wafer manufacturing method for ecological processing, one defective wafer is processed. First, the defective damaged (or indefectible) wafer is cut to form a plurality of independent chips. Rear surfaces of the chips are polished into prescribed thicknesses in accordance with required chip thicknesses, and further, polished indefectible chips are sequentially laid out in arrangement grooves of a plate, whereby processing is completed.
    • 要解决的问题:为了提供一种生态处理的晶片制造方法,其能够选择和循环不良晶片中的不可缺少的芯片以提高生产成本并降低制造成本,能够减少废弃晶片的数量以实现节能和 减少二氧化碳,能够满足环保要求。解决方案:在生态处理的晶圆制造方法中,处理一个缺陷晶片。 首先,将有缺陷的(或不可缺少的)晶片切割成多个独立的芯片。 根据所需的芯片厚度将芯片的后表面抛光成规定的厚度,并且将抛光的不可靠的芯片依次布置在板的布置槽中,从而完成处理。