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1. 发明专利

CH711877B1 Gonfleur. 未知
公开(公告)号：CH711877B1
公开(公告)日：2021-02-26
申请号：CH4762017
申请日：2014-10-28
申请人： ZHIMING LIU
发明人： ZHIMING LIU
IPC分类号： F04B33/00 , F04B39/10 , F04B45/02
摘要： L'invention concerne un gonfleur comprenant une vanne et un sac aérien (2), ladite vanne comportant un orifice d'entrée (101), un orifice de sortie (102) et une chambre à air (103), ledit orifice d'entrée (101) comportant une soupape d'admission (400), ledit orifice de sortie (102) comportant une soupape de purge (300) et la chambre à air (103) communiquant avec le sac aérien (2). Les orifices de sortie (102) et d'entrée (101) sont reliés par une cavité (104) de la vanne et la chambre à air (103) communique avec la cavité (104). Le gonfleur selon l'invention permet de gonfler manuellement par exemple aux jouets, bouées, oreillers et matelas gonflables. Il se veut compact, de structure simple, facile à utiliser et hygiénique.

2. 发明授权

US11689122B2 Nonlinear magnetic force-based arched piezoelectric ceramic energy harvesting deceleration strip 有权
公开(公告)号：US11689122B2
公开(公告)日：2023-06-27
申请号：US16992141
申请日：2020-08-13
申请人： Jun Wang , Zhiming Liu , Yaguang Ding , Yuanqiang Cai , Hongtao Fu , Peng Wang , Guohui Yuan , Junfeng Ni , Ziyang Ggao
发明人： Jun Wang , Zhiming Liu , Yaguang Ding , Yuanqiang Cai , Hongtao Fu , Peng Wang , Guohui Yuan , Junfeng Ni , Ziyang Ggao
IPC分类号： H02N2/18 , H10N30/853
CPC分类号： H02N2/183 , H02N2/181 , H10N30/853
摘要： A nonlinear magnetic force-based arched piezoelectric ceramic energy harvesting deceleration strip, which comprises an outer case and an internal generating mechanism. The outer case structure comprises an upper deceleration strip and a casing. The casing is embedded in the pavement structure by excavating the upper part of surface course. A rebounding mechanism is located between the upper deceleration strip and casing to restore the pressed upper deceleration strip. Features: the generating mechanism comprises a rack, a gear set and generating discs. The rack is disposed at the bottom of the upper deceleration strip and moving up and down therewith. The rack can drive the gear set to generate acceleration, and the transmission shafts drive the left and right generating discs to rotate. The gear set is combined with three transmission shafts.

3. 发明授权

US07348206B2 Formation of self-assembled monolayers of redox SAMs on silicon for molecular memory applications 失效
标题翻译：在硅上形成用于分子记忆应用的氧化还原SAM的自组装单层
公开(公告)号：US07348206B2
公开(公告)日：2008-03-25
申请号：US10040059
申请日：2001-10-26
申请人： David F. Bocian , Werner G. Kuhr , Jonathan S. Lindsey , Rajeeve Balkrishna Dabke , Zhiming Liu
发明人： David F. Bocian , Werner G. Kuhr , Jonathan S. Lindsey , Rajeeve Balkrishna Dabke , Zhiming Liu
IPC分类号： H01L51/40
CPC分类号： G11C13/0019 , B05D1/185 , B82Y10/00 , B82Y30/00 , B82Y40/00 , G11B9/14 , G11B9/149 , G11C13/0014 , G11C13/025 , H01L51/0075 , H01L51/0077 , H01L51/0595
摘要： This invention provides a new method of forming a self-assembling monolayer (SAM) of alcohol-terminated or thiol-terminated organic molecules (e.g. ferrocenes, porphyrins, etc.) on a silicon or other group IV element surface. The assembly is based on the formation of an E-O— or an E-S— bond where E is the group IV element (e.g. Si, Ge, etc.). The procedure has been successfully used on both P- and n-type group IV element surfaces. The assemblies are stable under ambient conditions and can be exposed to repeated electrochemical cycling.
摘要翻译：本发明提供了一种在硅或其它IV族元素表面上形成醇封端或硫醇封端的有机分子（例如二茂铁，卟啉等）的自组装单层（SAM）的新方法。该组合基于形成E-O-或E-S-键，其中E是IV族元素（例如Si，Ge等）。该程序已经成功地用于P型和N型IV族元件表面。组件在环境条件下是稳定的并且可以暴露于重复的电化学循环。

4. 发明申请

US20060081950A1 Molehole embedded 3-D crossbar architecture used in electrochemical molecular memory device 审中-公开
标题翻译：用于电化学分子存储器件的Molehole嵌入式3-D交叉结构架构
公开(公告)号：US20060081950A1
公开(公告)日：2006-04-20
申请号：US11112359
申请日：2005-04-22
申请人： Werner Kuhr , David Bocian , Zhiming Liu , Amir Yasseri
发明人： Werner Kuhr , David Bocian , Zhiming Liu , Amir Yasseri
IPC分类号： H01L29/82 , H01L27/14 , H01L29/84
CPC分类号： H01L29/82 , B82Y10/00 , G01N27/3278 , G01N33/5438 , G11C11/5664 , G11C13/0009 , G11C13/0014 , G11C13/0016 , G11C2213/77 , H01M2/02 , H01M4/38 , H01M4/602 , H01M6/40 , H01M10/0436
摘要： This invention provides a new design and fabrication for a three-dimensional crossbar architecture embedding a sub-micron or nanometer sized hole (called a molehole) in each cross-region. Each molehole is an electrochemical cell consisting of two or more sectional surfaces separated by a non-conductor (e.g., a dialectric layer and solid electrolyte). When used in electrochemical molecular memory device (EMMD), the architecture provides unique features such as a nano-scale electroactive surface, no interaction between memory elements, and easier miniaturization and integration.
摘要翻译：本发明提供了一种用于在每个横截面中嵌入亚微米或纳米尺寸的孔（称为痣孔）的三维交叉结构的新设计和制造。每个孔是由两个或更多个由非导体（例如，方形层和固体电解质）隔开的截面的组成的电化学电池。当用于电化学分子存储器件（EMMD）时，该体系结构提供了独特的特征，例如纳米级电活性表面，不存在记忆元件之间的相互作用，并且更容易的小型化和集成。

5. 发明申请

US20050048691A1 High temperature attachment of organic molecules to substrates 失效
标题翻译：将有机分子高温附着于底物
公开(公告)号：US20050048691A1
公开(公告)日：2005-03-03
申请号：US10742596
申请日：2003-12-19
申请人： David Bocian , Jonathan Lindsey , Zhiming Liu , Amir Yasseri , Veen Misra , Qian Zhao , Qiliang Li , Shyam Surthi , Robert Loewe
发明人： David Bocian , Jonathan Lindsey , Zhiming Liu , Amir Yasseri , Veen Misra , Qian Zhao , Qiliang Li , Shyam Surthi , Robert Loewe
IPC分类号： G11C13/02 , H01L21/477 , H01L51/00 , H01L51/30 , H01L51/40 , H01M4/60 , H01M14/00 , H01L21/26
CPC分类号： H01L51/0002 , B82Y10/00 , G11B9/14 , G11B9/149 , G11C13/0014 , G11C13/0016 , H01L51/0008 , H01L51/001 , H01L51/0026 , H01L51/0075 , H01L51/0077 , H01L51/0595 , H01L51/4213 , H01M4/60 , H01M14/005 , Y02E10/549
摘要： This invention provides a new procedure for attaching molecules to semiconductor surfaces, in particular silicon. The molecules, which include, but are not limited to porphyrins and ferrocenes, have been previously shown to be attractive candidates for molecular-based information storage. The new attachment procedure is simple, can be completed in short times, requires minimal amounts of material, is compatible with diverse molecular functional groups, and in some instances affords unprecedented attachment motifs. These features greatly enhance the integration of the molecular materials into the processing steps that are needed to create hybrid molecular/semiconductor information storage devices.
摘要翻译：本发明提供了一种将分子连接到半导体表面，特别是硅的新方法。以前已经显示出包括但不限于卟啉和二茂铁的分子是用于基于分子的信息存储的有吸引力的候选物。新的附件程序简单，可以在短时间内完成，需要最少量的材料，与不同的分子官能团相容，并在某些情况下提供前所未有的附着图案。这些特征大大增强了分子材料与创建混合分子/半导体信息存储设备所需的处理步骤的集成。

6. 发明申请

US20180320675A1 INFLATING DEVICE 审中-公开
公开(公告)号：US20180320675A1
公开(公告)日：2018-11-08
申请号：US16033130
申请日：2018-07-11
申请人： Zhiming Liu
发明人： Zhiming Liu
IPC分类号： F04B33/00 , F04B45/02 , F04B45/00 , F04B45/04 , F04B39/10
CPC分类号： F04B33/00 , F04B39/10 , F04B45/00 , F04B45/02 , F04B45/04
摘要： An inflating device comprises a valve body and a gasbag, the valve body being provided with a gas inlet, a gas outlet and a gas storage chamber; the gas inlet has a gas intake valve device provided therein, and the gas outlet has a gas exhaust valve device provided therein; the gas storage chamber is communicated with the gasbag; and the gas inlet is communicated with the gas outlet through a chamber body of the valve body, and the gas storage chamber is communicated with the chamber body. In the invention, gas can be fed into an inflatable product by continually pressing with hands, without requiring electricity or blowing with mouth. The inflating device of the invention is convenient to operate, clean and sanitary. The inflating device of the invention has a small volume and is thus convenient to carry.

7. 发明授权

US09763336B2 Methods of treating metal surfaces and devices formed thereby 有权
公开(公告)号：US09763336B2
公开(公告)日：2017-09-12
申请号：US14009517
申请日：2010-07-06
申请人： Jen-Chieh Wei , Zhiming Liu , Steven Z. Shi , Werner G. Kuhr
发明人： Jen-Chieh Wei , Zhiming Liu , Steven Z. Shi , Werner G. Kuhr
IPC分类号： C23C8/12 , C23C22/63 , H05K3/38 , C23C8/16 , C23C22/83 , C09J5/02 , C08J5/12 , C23C8/40 , C23C8/80 , H05K3/46
CPC分类号： H05K3/385 , C08J5/12 , C08J2363/00 , C09J5/02 , C09J2400/163 , C09J2400/166 , C09J2400/20 , C23C8/12 , C23C8/16 , C23C8/40 , C23C8/80 , C23C22/63 , C23C22/83 , H05K3/389 , H05K3/4673 , H05K2203/0315 , H05K2203/065 , H05K2203/1157
摘要： Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

8. 发明授权

US09345149B2 Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards 有权
标题翻译：处理铜表面以增强对用于印刷电路板的有机基板的粘附性的方法
公开(公告)号：US09345149B2
公开(公告)日：2016-05-17
申请号：US13142588
申请日：2010-07-06
申请人： Jen-Chieh Wei , Zhiming Liu , Steven Z. Shi , Werner G. Kuhr
发明人： Jen-Chieh Wei , Zhiming Liu , Steven Z. Shi , Werner G. Kuhr
IPC分类号： B32B38/08 , B05D5/12 , B32B37/14 , B05D3/10 , H05K3/38 , H05K3/46
CPC分类号： H05K3/385 , H05K1/09 , H05K3/389 , H05K3/4652 , H05K2203/1157 , Y10T156/10
摘要： Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.
摘要翻译：本发明的实施例一般涉及印刷电路板（PCB）或印刷电路板（PWB）的制造，特别涉及用于处理光滑的铜表面以增加铜表面和有机基底之间的粘附性的方法。更具体地，本发明的实施例涉及在不使铜表面形貌粗糙化的情况下实现PCB的粘合强度的改善的方法。经处理的铜和PCB的树脂层之间的结合界面显示出优异的耐热性，湿气性和在层压后工艺步骤中涉及的化学物质。

9. 发明授权

US08323769B2 Methods of treating a surface to promote metal plating and devices formed 有权
标题翻译：处理表面以促进金属电镀和形成的器件的方法
公开(公告)号：US08323769B2
公开(公告)日：2012-12-04
申请号：US12628978
申请日：2009-12-01
申请人： Werner G. Kuhr , Steven Z. Shi , Jen-Chieh Wei , Zhiming Liu , Lingyun Wei
发明人： Werner G. Kuhr , Steven Z. Shi , Jen-Chieh Wei , Zhiming Liu , Lingyun Wei
IPC分类号： B32B3/10 , B32B15/04 , B32B15/08
CPC分类号： H05K3/389 , C23C18/1653 , C23C18/1844 , C23C18/1893 , C23C18/2086 , C23C18/40 , H05K3/181 , H05K3/182 , H05K2203/1105 , H05K2203/121 , Y10T428/24322 , Y10T428/31511 , Y10T428/31678 , Y10T428/31721
摘要： Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.
摘要翻译：本发明的实施方案提供了处理基材表面的方法。在一个特定方面，本发明的实施方案提供了处理促进一种或多种金属元素与表面结合的基材表面的方法。根据本发明的一些实施方案，通过在有机溶剂中或在水溶液中含有反应性基团的分子的热反应，在任何导电，半导体或非导电表面上形成膜。热反应可以在各种条件下生产。另一方面，本发明提供一种印刷电路板，包括：至少一个基板; 连接到所述至少一个基底的有机分子层; 以及在所述有机分子层顶上的金属层。

10. 发明授权

US08231941B2 Procedure for preparing redox-active polymers on surfaces 有权
标题翻译：在表面上制备氧化还原活性聚合物的方法
公开(公告)号：US08231941B2
公开(公告)日：2012-07-31
申请号：US12265990
申请日：2008-11-06
申请人： David F. Bocian , Zhiming Liu , Jonathan S. Lindsey
发明人： David F. Bocian , Zhiming Liu , Jonathan S. Lindsey
IPC分类号： B05D5/12 , B05D3/10
CPC分类号： H01L51/0089 , B82Y10/00 , H01L51/0003 , H01L51/0595
摘要： This invention provides novel methods for the formation of redox-active polymers attached to surfaces. In certain embodiments, the methods involve providing redox-active molecules bearing at least a first reactive site or group and a second reactive site or group; and contacting the surface with the redox-active molecules where the contacting is under conditions that result in attachment of said redox-active molecules to said surface via the first reactive site or group and attachment of redox-active molecules via the second reactive site or group, to the redox-active molecules attached to the surface thereby forming a polymer attached to said surface where the polymers comprise at least two of said redox-active molecules.
摘要翻译：本发明提供了形成附着于表面的氧化还原活性聚合物的新方法。在某些实施方案中，所述方法包括提供至少具有第一反应位点或基团和第二反应位点或基团的氧化还原活性分子; 以及使所述表面与所述氧化还原活性分子接触，其中所述接触在导致所述氧化还原活性分子经由所述第一反应位点或基团连接到所述表面的条件下，并且经由所述第二反应性位点或基团连接氧化还原活性分子附着于表面的氧化还原活性分子，从而形成连接到所述表面的聚合物，其中聚合物包含至少两种所述氧化还原活性分子。

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