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1. 发明申请

WO2013180696A1 DEVICE INCLUDING SUBSTRATE THAT ABSORBS STRESSES 审中-公开
标题翻译：装置，包括吸收器压力的衬底
公开(公告)号：WO2013180696A1
公开(公告)日：2013-12-05
申请号：PCT/US2012/039926
申请日：2012-05-30
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , WALMSLEY, Robert G. , WU, Jennifer , ZHANG, Zhuqing , BERNARD, Sheldon A.
发明人： WALMSLEY, Robert G. , WU, Jennifer , ZHANG, Zhuqing , BERNARD, Sheldon A.
IPC分类号： H01L23/02
CPC分类号： H01L23/562 , B81B7/0048 , H01L24/32 , H01L2224/83385 , H01L2924/1461 , H01L2924/15787 , H01L2924/00
摘要： A device including a semiconductor and a substrate. The substrate has a membrane and at least one structure that supports the semiconductor. The membrane surrounds the at least one structure and is thinner than the at least one structure to absorb stresses between the semiconductor and the substrate.
摘要翻译：一种包括半导体和衬底的器件。衬底具有膜和支撑半导体的至少一种结构。膜围绕至少一个结构并且比至少一个结构更薄以吸收半导体和衬底之间的应力。

2. 发明申请

WO2010098771A1 MICRO DEVICE PACKAGING 审中-公开
标题翻译：微型设备包装
公开(公告)号：WO2010098771A1
公开(公告)日：2010-09-02
申请号：PCT/US2009/035542
申请日：2009-02-27
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , ZHANG, Zhuqing , HANSON, Steve P. , CHEN, Chien-Hua
发明人： ZHANG, Zhuqing , HANSON, Steve P. , CHEN, Chien-Hua
IPC分类号： H01L23/10 , H01L23/15 , G02B5/26 , G02B5/28
CPC分类号： G02B5/284 , B81B2201/0292 , B81B2201/047 , B81C1/00888 , G02B1/11 , H01L2924/16235
摘要： In one embodiment, a method for making an optical micro device package includes: providing a substrate wafer having a plurality of solid state light sensors integrate therein; providing a transparent cover wafer coated with a material that alters the transparency characteristics of the cover wafer; forming a layer of light sensitive, photo definable adhesive material on the substrate wafer; selectively removing part of the layer of adhesive material in a pattern for a plurality of adhesive spacers between the substrate wafer and the cover wafer with each spacer surrounding a corresponding one of the light sensors; bonding the substrate wafer and the cover wafer together at the spacers to form a wafer assembly in which each spacer surrounds and seals a corresponding one of the light sensors within a cavity bounded by a spacer and the two wafers; and singulating individual device packages from the wafer assembly.
摘要翻译：在一个实施例中，一种用于制造光学微器件封装的方法包括：提供具有集成在其中的多个固态光传感器的衬底晶片; 提供涂覆有改变覆盖晶片的透明特性的材料的透明盖晶片; 在衬底晶片上形成一层光敏的可光定义粘合剂材料; 在衬底晶片和覆盖晶片之间的多个粘合剂间隔物的图案中选择性地去除粘合剂材料层的一部分，每个间隔物环绕相应的一个光传感器; 将衬底晶片和覆盖晶片在间隔件处结合在一起以形成晶片组件，其中每个间隔件在由间隔件和两个晶片限定的空腔内围绕并密封相应的一个光传感器; 以及从晶片组件分离单个器件封装。

3. 发明申请

WO2014021868A1 DEVICE INCLUDING INTERPOSER BETWEEN SEMICONDUCTOR AND SUBSTRATE 审中-公开
标题翻译：包括半导体和衬底之间的间隔器的器件
公开(公告)号：WO2014021868A1
公开(公告)日：2014-02-06
申请号：PCT/US2012/049048
申请日：2012-07-31
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , WALMSLEY, Robert G. , ZHANG, Zhuqing , WU, Jennifer , BERNARD, Sheldon A. , CHOY, Silam J.
发明人： WALMSLEY, Robert G. , ZHANG, Zhuqing , WU, Jennifer , BERNARD, Sheldon A. , CHOY, Silam J.
IPC分类号： B81B3/00 , B81B7/00 , B81C1/00 , G01P15/02 , G01P15/08
CPC分类号： H05K1/18 , B81B7/0048 , B81B2201/0235 , G01P15/0802 , H01L24/32 , H01L2224/32014 , H05K13/0469 , H05K2203/06 , Y10T156/10
摘要： A device including a semiconductor, a substrate, and an interposer. The interposer is attached between the semiconductor and the substrate to absorb stresses between the semiconductor and the substrate.
摘要翻译：一种包括半导体，衬底和中介层的器件。插入器附接在半导体和衬底之间以吸收半导体和衬底之间的应力。

4. 发明申请

WO2014011167A1 SEMICONDUCTOR SECURED TO SUBSTRATE VIA HOLE IN SUBSTRATE 审中-公开
标题翻译：半导体通过基板保护通孔
公开(公告)号：WO2014011167A1
公开(公告)日：2014-01-16
申请号：PCT/US2012/046263
申请日：2012-07-11
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , WU, Jennifer , ZHANG, Zhuqing , DINGMAN, Wallace Andrew
发明人： WU, Jennifer , ZHANG, Zhuqing , DINGMAN, Wallace Andrew
IPC分类号： H01L23/48 , H01L23/12
CPC分类号： B81C1/00357 , B81B7/0006 , B81B7/0048 , B81B2201/0242 , B81C2203/032 , H01L23/13 , H01L24/32 , H01L2224/2919 , H01L2224/3224 , H01L2224/83385 , H01L2924/1461 , H01L2924/1515 , H01L2924/15787 , H01L2924/00 , H01L2924/00014
摘要： A device including a semiconductor and a substrate. The substrate has a first surface and a second surface that opposes the first surface. The substrate has a hole that extends from the first surface to the second surface and the semiconductor is secured to the substrate via adhesive in the hole.
摘要翻译：一种包括半导体和衬底的器件。基板具有与第一表面相对的第一表面和第二表面。衬底具有从第一表面延伸到第二表面的孔，并且半导体通过孔中的粘合剂固定到衬底。

5. 发明申请

WO2009078881A1 IMPRINT LITHOGRAPHY APPARATUS AND METHOD 审中-公开
标题翻译： IMPRINT LITHOGRAPHY APPARATUS和方法
公开(公告)号：WO2009078881A1
公开(公告)日：2009-06-25
申请号：PCT/US2007/088250
申请日：2007-12-19
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , ZHANG, Zhuqing
发明人： ZHANG, Zhuqing
IPC分类号： H01L21/027
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： An imprint lithography stamp (101, 201, 401, 501, 617) includes a base layer (301, 619); a functional layer (303, 621) of lithography features (307, 309, 403, 405, 503, 505) protruding from the base layer (301, 619); and a support layer (305, 623) comprising a regular pattern of sub-features (311, 313, 407, 409, 507, 509, 613, 615, 625) protruding from the lithography features (307, 309, 403, 405, 503, 505). An imprint lithography system (100, 200, 300) includes a substrate (104, 205, 513, 601) having a layer of resin material (511) deposited thereon; a stamp (101, 201, 401, 501, 617) having a base layer (301, 619), a functional layer (303, 621) of lithography features (307, 309, 403, 405, 503, 505) protruding from the base layer (301, 619) and a support layer (305, 623) comprising a regular pattern of sub-features (311, 313, 407, 409, 507, 509, 613, 615, 625) protruding from the lithography features (307, 309, 403, 405, 503, 505); and an imprinting device configured to press the stamp (101, 201, 401, 501, 617) into the resin material (511).
摘要翻译：压印光刻印模（101,201,401,501,617）包括基层（301,619）; 从所述基底层（301,619）突出的光刻特征（307,309,403,405,503,505）的功能层（303,621）; 以及包括从光刻特征（307,309,403,405,607）突出的子特征（311,313,407,409,507,509,613,615,625）的规则图案的支撑层（305,623） 503,505）。压印光刻系统（100,200,300）包括其上沉积有树脂材料层（511）的衬底（104,205,513,601）; 具有基底层（301,619）的印模（101,201,401,501,617），从所述印刷电路板的凸起部分突出的光刻特征（307,309,403,405,503,505）的功能层（303,621）基底层（301,619）和支撑层（305,623），其包括从光刻特征突出的子特征（311,313,407,409,507,509,613,615,625）的规则图案，309,403,405,503,505）; 以及构造成将印模（101,201,401,501,617）压入树脂材料（511）的压印装置。

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