会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明申请
    • METHODS AND APPARATUSES FOR LITHOGRAPHY OF SPARSE ARRAYS OF SUB-MICROMETER FEATURES
    • 亚微米特征稀疏阵列算法的方法和装置
    • WO1996026468A1
    • 1996-08-29
    • PCT/US1996002526
    • 1996-02-23
    • UNIVERSITY OF NEW MEXICOBRUECK, Steven, R., J.CHEN, XiaolanZAIDI, SaleemDEVINE, Daniel, J.
    • UNIVERSITY OF NEW MEXICO
    • G03F07/20
    • G03F7/70408G03F7/70466
    • Methods and apparatuses are disclosed for the exposure of sparse hole and/or mesa arrays with line:space ratios of 1:3 or greater and sub-micrometer hole and/or mesa diameters in a layer of photosensitive material atop a layered material. Methods disclosed inlude: double exposure interferometric lithography pairs in which only those areas near the overlapping maxima of each single-period exposure pair receive a clearing exposure dose; double interferometric lithography exposure pairs with additional processing steps to transfer the array from a first single-period interferometric lithography exposure pair into an intermediate mask layer and a second single-period interferometric lithography exposure to further select a subset of the first array of holes; a double exposure of a single period interferometric lithography exposure pair to define a dense array of sub-micrometer holes and an optical lithography exposure in which only those holes near maxima of both exposures receive a clearing exposure dose, combination of a singgle-period interferometric exposure pair, processing to transfer resulting dense array of sub-micrometer holes into an intermediate etch mask, and an optical lithography exposure to select a subset of initial array to form a sparse array; combination of an optical exposure, transfer of exposure pattern into an intermediate mask layer, and a single-period interferometric lithography exposure pair; three-beam interferometric exposure pairs to form sparse arrays of sub-micrometer holes; five- and four-beam interferometric exposures to form a sparse array of sub-micrometer holes in a single exposure. Apparatuses disclosed include arrangements for the three-beam, five-beam and four-beam interferometric exposures.
    • 公开了用于暴露具有1:3或更大的线:空间比的稀疏孔和/或台面阵列的方法和装置,并且在分层材料的顶层中的感光材料层中的亚微米孔和/或台面直径。 包括的方法:双曝光干涉光刻对,其中仅每个单周期曝光对的重叠最大值附近的那些区域接收清除曝光剂量; 双重干涉光刻曝光对,其具有附加处理步骤,以将阵列从第一单周期干涉光刻曝光对转移到中间掩模层和第二单周期干涉光刻曝光中,以进一步选择第一阵列孔的子集; 单周期干涉光刻曝光对的双重曝光以限定亚微米孔的密集阵列和光学曝光曝光,其中仅两个曝光的最大值附近的那些孔接收清除曝光剂量,单周期干涉测量曝光的组合 对,将所产生的密集的亚微米孔阵列转移到中间蚀刻掩模中的处理,以及光学曝光以选择初始阵列的子集以形成稀疏阵列; 光学曝光的组合,曝光图案转印到中间掩模层中,以及单周期干涉光刻曝光对; 三光束干涉曝光对形成亚微米孔的稀疏阵列; 五光束和四光束干涉曝光以在单次曝光中形成稀疏阵列的亚微米孔。 公开的装置包括用于三光束,五光束和四光束干涉曝光的布置。