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    • 3. 发明授权
    • High voltage booster circuit for use in EEPROMs
    • 用于EEPROM的高压升压电路
    • US4916334A
    • 1990-04-10
    • US226312
    • 1988-07-29
    • Hidenobu MinagawaYuuichi TatsumiHiroshi IwahashiMasamichi AsanoMizuho Imai
    • Hidenobu MinagawaYuuichi TatsumiHiroshi IwahashiMasamichi AsanoMizuho Imai
    • G11C16/30H02M3/07H03K5/02
    • G11C16/30H02M3/07H03K5/023
    • A semiconductor integrated circuit includes a CMOS circuit operated on a voltage of a first voltage level to set an output node thereof to a voltage of the first voltage level or a reference voltage; an output circuit for controlling supply of a voltage of a second voltage level which is higher than the first voltage level to a signal output node; and an isolation MOS transistor having a current path connected between the output node of the CMOS circuit and the signal output node and a gate connected to receive a control signal. The output node of the CMOS circuit is set to the reference voltage with the conduction resistance of the isolation MOS transistor kept high after the lapse of period in which the voltage of the second voltage level is kept supplied to the signal output node. After this, the conduction resistance of the isolation MOS transistor is reduced in response to the control signal.
    • 半导体集成电路包括以第一电压电平工作的CMOS电路,以将其输出节点设置为第一电压电平或参考电压的电压; 输出电路,用于控制向信号输出节点提供高于第一电压电平的第二电压电平的电压; 以及隔离MOS晶体管,其具有连接在CMOS电路的输出节点和信号输出节点之间的电流路径以及连接以接收控制信号的栅极。 CMOS电路的输出节点被设定为参考电压,其中隔离MOS晶体管的导通电阻保持高电平,其中第二电压电平的电压被保持提供给信号输出节点。 此后,隔离MOS晶体管的导通电阻响应于控制信号而减小。
    • 4. 发明申请
    • Method for manufacturing industrial products and combination of masks for manufacturing the same
    • 制造工业产品的方法和制造掩模的组合
    • US20060166384A1
    • 2006-07-27
    • US11325545
    • 2006-01-05
    • Yuuichi Tatsumi
    • Yuuichi Tatsumi
    • H01L21/66G01R31/26
    • H01L22/22G01R31/2853H01L22/32H01L2224/05553
    • A method for manufacturing an industrial product encompasses: forming a intermediate product pattern, which implements a part of a intermediate product of the industrial product by a sequence of processes corresponds to a part of a procedure for manufacturing the industrial product; forming an interconnect-changing insulator on the intermediate product pattern; boring sampling contact holes in the interconnect-changing insulator so as to make bare a part of the intermediate product pattern to define sampling sites; delineating evaluation interconnects on the interconnect-changing insulator so that each of the evaluation interconnects can electrically connected to at least one of the sampling sites of intermediate product pattern; and measuring an electrical resistance between subject sampling sites through the evaluation interconnects so as to detect a product defect in the intermediate product pattern.
    • 一种制造工业产品的方法包括:形成中间产品图案,其通过一系列工艺实现工业产品的中间产品的一部分对应于制造工业产品的程序的一部分; 在所述中间产品图案上形成互连变换绝缘体; 在互连变换绝缘体中的无孔采样接触孔,以便露出中间产品图案的一部分以限定取样位置; 描绘互连变换绝缘体上的评估互连,使得每个评估互连可以电连接到中间产品图案的至少一个采样点; 以及通过评估互连测量被检体取样部位之间的电阻,以便检测中间产品图案中的产品缺陷。
    • 7. 发明授权
    • Method for manufacturing a semiconductor memory device with a fine structure
    • 具有精细结构的半导体存储器件的制造方法
    • US06376295B1
    • 2002-04-23
    • US09631977
    • 2000-08-03
    • Kiyomi NarukeMinoru KurataYuuichi TatsumiYasumasa Sawada
    • Kiyomi NarukeMinoru KurataYuuichi TatsumiYasumasa Sawada
    • H01L218238
    • H01L27/11568G11C16/0491H01L27/115H01L27/11521H01L27/11526H01L27/11546
    • There is disclosed a memory cell which has a diffusion layers constituting source/drain areas formed on a p-type silicon substrate surface, and a channel area formed between the diffusion layers. Above the channel area, an insulating film of a laminated structure is formed of a silicon oxide film, a silicon nitride film and a silicon oxide film. A gate electrode is formed on the upper surface of the insulating film of the laminated structure. The gate electrode is used as a word line. Moreover, an interlayer insulating film is formed between the diffusion layer and the gate electrode. By injecting hot electrons from the substrate to the silicon nitride film in the insulating film of the laminated structure, data is written. The silicon nitride film and the diffusion layer are partially overlapped in a vertical direction, and an offset portion is disposed between the silicon nitride film and the diffusion layer.
    • 公开了一种存储单元,其具有构成在p型硅衬底表面上形成的源/漏区的扩散层和形成在扩散层之间的沟道区。 在通道区域之上,层叠结构的绝缘膜由氧化硅膜,氮化硅膜和氧化硅膜形成。 在层叠结构体的绝缘膜的上表面上形成栅电极。 栅电极用作字线。 此外,在扩散层和栅电极之间形成层间绝缘膜。 通过将层叠结构的绝缘膜中的热电子从基板注入氮化硅膜,写入数据。 氮化硅膜和扩散层在垂直方向上部分重叠,偏移部分设置在氮化硅膜和扩散层之间。
    • 10. 发明授权
    • Semiconductor device having a protection pattern with two element separation regions
    • 具有具有两个元件分离区域的保护图案的半导体器件
    • US08241999B2
    • 2012-08-14
    • US12706056
    • 2010-02-16
    • Takafumi IkedaTakahito NakazawaHideaki MaekawaYuuichi TatsumiToshifumi Minami
    • Takafumi IkedaTakahito NakazawaHideaki MaekawaYuuichi TatsumiToshifumi Minami
    • H01L23/544H01L21/301
    • H01L23/585H01L2924/0002H01L2924/00
    • A semiconductor device has a circuit element region formed on a semiconductor substrate, and a protective pattern formed so as to surround the circuit element region. The protective pattern comprises a first element separation region formed on the semiconductor substrate, a second element separation region formed on the semiconductor substrate and having a width smaller than that of the first element separation region, a first element region formed between the first element separation region and the second element separation region, a first gate layer formed on the first element separation region, a wiring layer formed on the first gate layer, a passivation layer formed above the wiring layer, a second element region, an insulation film formed on the second element region, and a second gate layer formed on the insulation film, the first element separation region, the first element region, the second element separation region and the second element region being located in this order from the nearer side of the circuit element region.
    • 半导体器件具有形成在半导体衬底上的电路元件区域和形成为围绕电路元件区域的保护图案。 保护图案包括形成在半导体衬底上的第一元件分离区域,形成在半导体衬底上的第二元件分离区域,其宽度小于第一元件分离区域的宽度;第一元素区域,形成在第一元素分离区域 和第二元件分离区域,形成在第一元件分离区域上的第一栅极层,形成在第一栅极层上的布线层,形成在布线层上方的钝化层,第二元素区域,形成在第二栅极层上的绝缘膜 元件区域和形成在绝缘膜上的第二栅极层,第一元件分离区域,第一元件区域,第二元件分离区域和第二元件区域从电路元件区域的更靠近的方向定位。