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1. 发明申请

US20070069748A1 Probe assembly 审中-公开
标题翻译：探头装配
公开(公告)号：US20070069748A1
公开(公告)日：2007-03-29
申请号：US11585416
申请日：2006-10-23
申请人： Hidehiro Kiyofuji , Yutaka Minato , Akihisa Akahira
发明人： Hidehiro Kiyofuji , Yutaka Minato , Akihisa Akahira
IPC分类号： G01R31/02
CPC分类号： G01R31/2887
摘要： A probe assembly comprises a probe base plate with a plurality of probes to be used for electrical inspection of a plurality of semiconductor chip regions continuously formed in alignment in the directions orthogonal to each other on a substantially circular semiconductor wafer, and capable of contacting the electrical connecting portions of each semiconductor chip region. The tips of a plurality of probe groups are arranged in the X and Y directions orthogonal to each other on the surface of the probe base plate in correspondence to predetermined chip region groups including the predetermined number of semiconductor chip regions. The arrangement regions of the probe groups are formed discontinuously in both of the X and Y directions. The relative feeding movement of the semiconductor wafer in either of the X and Y directions enables the electrical inspection of all the chip region groups on the semiconductor wafer.
摘要翻译：探针组件包括具有多个探针的探针基板，用于对在大致圆形的半导体晶片上彼此正交的方向上连续形成的多个半导体芯片区域进行电气检查，并且能够接触电气连接各半导体芯片区域的部分。多个探针组的尖端相对应于包括预定数量的半导体芯片区域的预定芯片区域组，在探针基板的表面上彼此正交的X和Y方向上排列。探针组的排列区域在X方向和Y方向都不连续地形成。半导体晶片在X和Y方向中的相对馈送运动使得能够对半导体晶片上的所有芯片区域组进行电检查。

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