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    • 2. 发明申请
    • Method of laser separation of the epitaxial film or the epitaxial film layer from the growth substrate of the epitaxial semiconductor structure (variations)
    • 从外延半导体结构的生长衬底激光分离外延膜或外延膜层的方法(变化)
    • US20160172228A1
    • 2016-06-16
    • US14907189
    • 2016-01-22
    • Yury Georgievich ShreterYury Toomasovich RebaneAleksey Vladimirovich Mironov
    • Yury Georgievich ShreterYury Toomasovich RebaneAleksey Vladimirovich Mironov
    • H01L21/683H01L21/268H01L21/02
    • H01L21/6835H01L21/02518H01L21/02527H01L21/02529H01L21/02532H01L21/0254H01L21/02546H01L21/02551H01L21/0257H01L21/02634H01L21/268H01L21/76254H01L33/0079H01L2221/68381
    • The present invention proposes variations of the laser separation method allowing separating homoepitaxial films from the substrates made from the same crystalline material as the epitaxial film. This new method of laser separation is based on using the selective doping of the substrate and epitaxial film with fine donor and acceptor impurities. In selective doping, concentration of free carries in the epitaxial film and substrate may essentially differ and this can lead to strong difference between the light absorption factors in the infrared region near the residual beams region where free carriers and phonon-plasmon interaction of the optical phonons with free carriers make an essential contribution to infrared absorption of the optical phonons. With the appropriate selection of the doping levels and frequency of infrared laser radiation, it is possible to achieve that laser radiation is absorbed in general in the region of strong doping near the interface substrate-homoepitaxial film. When scanning the interface substrate-homoepitaxial film with the focused laser beam of sufficient power, thermal decomposition of the semiconductor crystal takes place with subsequent separation of the homoepitaxial film. The advantage of the proposed variations of the method for laser separation of epitaxial films in comparison with the known ones is in that it allows the separation of homoepitaxial films from the substrates, i.e., homoepitaxial films having the same width of the forbidden gap as the initial semiconductor substrate has. The proposed variations of the method can be used for separation of the epitaxial films.
    • 本发明提出了激光分离方法的变化,其允许从与外延膜相同的结晶材料制成的基板上分离同质外延膜。 这种新的激光分离方法是基于使用具有精细施主和受主杂质的衬底和外延膜的选择性掺杂。 在选择性掺杂中,外延膜和衬底中的自由载流子的浓度可能基本上不同,并且这可能导致残余光束区域附近的红外区域中的光吸收因子之间的强烈差异,其中自由载流子和光子声子的声子等离子体相互作用 自由载体对光学声子的红外吸收作出重要贡献。 通过适当选择红外激光辐射的掺杂水平和频率,可以实现激光辐射通常在界面衬底 - 同质外延膜附近的强掺杂区域被吸收。 当用具有足够功率的聚焦激光束扫描界面基底 - 同轴外延膜时,半导体晶体的热分解随后进行同质外延膜的分离。 与已知的相比,所提出的用于激光分离外延膜的方法的变化的优点在于它允许从基板分离同质外延膜,即具有与初始的相同宽度的禁止间隙的同质外延膜 半导体衬底具有。 所提出的方法的变型可用于分离外延膜。