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1. 发明授权

US08836208B2 Light-emitting device including LED element whose upper surface is free from white resin and method of manufacturing the same 有权
标题翻译：包含上表面不含白色树脂的LED元件的发光元件及其制造方法
公开(公告)号：US08836208B2
公开(公告)日：2014-09-16
申请号：US13525934
申请日：2012-06-18
申请人： Ishihara Kazuya , Yuki Suto , Yusuke Watanabe
发明人： Ishihara Kazuya , Yuki Suto , Yusuke Watanabe
IPC分类号： H01J1/62 , H01J9/00
CPC分类号： H01L33/505 , H01L33/52 , H01L33/54 , H01L33/56 , H01L2224/16
摘要： A light-emitting device includes a substrate that includes at least a pair of electrodes, an LED element electrically mounted on the substrate, a phosphor plate adhered to an upper surface of the LED element and including an upper surface and a lower surface each having an area larger than that of the upper surface of the LED element, a white resin provided on an upper surface of the substrate and seamlessly covering a peripheral side surface of the LED element and a peripheral side surface of the phosphor plate. A lower surface of the phosphor plate is adhered to the upper surface of the LED element through a transparent adhesive.
摘要翻译：发光装置包括至少包括一对电极的基板，电气安装在基板上的LED元件，粘附到LED元件的上表面的荧光体板，并且包括上表面和下表面，每个具有面积大于LED元件的上表面的面积，设置在基板的上表面上的白色树脂，并且无缝地覆盖LED元件的周边表面和荧光体板的周边侧表面。荧光体板的下表面通过透明粘合剂粘合到LED元件的上表面。

2. 发明授权

US08330268B2 Semiconductor package and manufacturing method thereof 失效
标题翻译：半导体封装及其制造方法
公开(公告)号：US08330268B2
公开(公告)日：2012-12-11
申请号：US12648172
申请日：2009-12-28
申请人： Yuki Suto
发明人： Yuki Suto
IPC分类号： H01L23/12
CPC分类号： H01L31/0203 , H01L21/568 , H01L23/055 , H01L23/16 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L27/14618 , H01L27/14621 , H01L27/14683 , H01L2224/04105 , H01L2224/12105 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01073 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , H01L2924/181 , H01L2924/3025 , H01L2224/82 , H01L2924/00
摘要： A semiconductor package includes a semiconductor substrate having a semiconductor device arranged on one surface thereof; a cap substrate having one surface that opposes the one surface of the semiconductor substrate via a gap; a spacer that is arranged between the one surface of the semiconductor substrate and the one surface of the cap substrate, and that joins the semiconductor substrate and the cap substrate; and a filter that is provided on the cap substrate so as to overlap with the semiconductor device without overlapping with the spacer. The semiconductor package and method of manufacture can suppress exfoliation of the filter caused by chipping during the dicing step.
摘要翻译：半导体封装包括：半导体衬底，具有布置在其一个表面上的半导体器件; 盖基板，其具有经由间隙与所述半导体基板的所述一个表面相对的一个表面; 布置在半导体衬底的一个表面和盖衬底的一个表面之间并且连接半导体衬底和盖衬底的间隔物; 以及设置在盖基板上以与半导体器件重叠而不与间隔物重叠的滤波器。半导体封装和制造方法可以抑制在切割步骤期间由于切屑引起的过滤器的剥离。

3. 发明授权

US08530979B2 Semiconductor package and method for manufacturing the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US08530979B2
公开(公告)日：2013-09-10
申请号：US12896500
申请日：2010-10-01
申请人： Shingo Ogura , Yuki Suto
发明人： Shingo Ogura , Yuki Suto
IPC分类号： H01L21/02
CPC分类号： H01L31/0203 , H01L23/16 , H01L23/3114 , H01L2924/0002 , H01L2924/00
摘要： Provided is a semiconductor package which includes: a semiconductor substrate; a functional element that is disposed on one surface of the semiconductor substrate; a protection substrate that is disposed in an opposite side of that surface of the semiconductor substrate with a predetermined gap from a surface of the semiconductor substrate; and a junction member that is disposed to surround the functional element and bonds the semiconductor substrate and the protection substrate together, wherein the functional element has a shape different from a shape of a plane surrounded by the junction member in that surface of the semiconductor substrate, or is disposed in a region deviated from a central region of the plane surrounded by the junction member in that surface of the semiconductor substrate.
摘要翻译：提供一种半导体封装，其包括：半导体衬底; 设置在所述半导体衬底的一个表面上的功能元件; 保护基板，与半导体基板的与该半导体基板的表面相反的一侧以与半导体基板的表面隔开规定的间隔设置; 以及连接部件，其被设置为围绕所述功能元件并将所述半导体基板和所述保护基板接合在一起，其中所述功能元件具有与所述半导体基板的所述表面中的所述接合部件所包围的平面的形状不同的形状，或者设置在偏离由半导体衬底的该表面中的接合部件围绕的平面的中心区域的区域中。

4. 发明申请

US20130127328A2 LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20130127328A2
公开(公告)日：2013-05-23
申请号：US13525934
申请日：2012-06-18
申请人： Kazuya ISHIHARA , Yuki SUTO , Yusuke WATANABE
发明人： Kazuya ISHIHARA , Yuki SUTO , Yusuke WATANABE
IPC分类号： H01J1/62 , H01J9/00
CPC分类号： H01L33/505 , H01L33/52 , H01L33/54 , H01L33/56 , H01L2224/16
摘要： A light-emitting device includes a substrate that includes at least a pair of electrodes, an LED element electrically mounted on the substrate, a phosphor plate adhered to an upper surface of the LED element and including an upper surface and a lower surface each having an area larger than that of the upper surface of the LED element, a white resin provided on an upper surface of the substrate and seamlessly covering a peripheral side surface of the LED element and a peripheral side surface of the phosphor plate. A lower surface of the phosphor plate is adhered to the upper surface of the LED element through a transparent adhesive.
摘要翻译：发光装置包括至少包括一对电极的基板，电气安装在基板上的LED元件，粘附到LED元件的上表面的荧光体板，并且包括上表面和下表面，每个具有面积大于LED元件的上表面的面积，设置在基板的上表面上的白色树脂，并且无缝地覆盖LED元件的周边表面和荧光体板的周边侧表面。荧光体板的下表面通过透明粘合剂粘合到LED元件的上表面。

5. 发明申请

US20120319563A1 LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20120319563A1
公开(公告)日：2012-12-20
申请号：US13525934
申请日：2012-06-18
申请人： Kazuya ISHIHARA , Yuki Suto , Yusuke Watanabe
发明人： Kazuya ISHIHARA , Yuki Suto , Yusuke Watanabe
IPC分类号： H01J1/62 , H01J9/00
CPC分类号： H01L33/505 , H01L33/52 , H01L33/54 , H01L33/56 , H01L2224/16
摘要： A light-emitting device includes a substrate that includes at least a pair of electrodes, an LED element electrically mounted on the substrate, a phosphor plate adhered to an upper surface of the LED element and including an upper surface and a lower surface each having an area larger than that of the upper surface of the LED element, a white resin provided on an upper surface of the substrate and seamlessly covering a peripheral side surface of the LED element and a peripheral side surface of the phosphor plate. A lower surface of the phosphor plate is adhered to the upper surface of the LED element through a transparent adhesive.
摘要翻译：发光装置包括至少包括一对电极的基板，电气安装在基板上的LED元件，粘附到LED元件的上表面的荧光体板，并且包括上表面和下表面，每个具有面积大于LED元件的上表面的面积，设置在基板的上表面上的白色树脂，并且无缝地覆盖LED元件的周边表面和荧光体板的周边侧表面。荧光体板的下表面通过透明粘合剂粘合到LED元件的上表面。

6. 发明申请

US20110018112A1 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20110018112A1
公开(公告)日：2011-01-27
申请号：US12896500
申请日：2010-10-01
申请人： Shingo OGURA , Yuki SUTO
发明人： Shingo OGURA , Yuki SUTO
IPC分类号： H01L23/00 , H01L21/71
CPC分类号： H01L31/0203 , H01L23/16 , H01L23/3114 , H01L2924/0002 , H01L2924/00
摘要： Provided is a semiconductor package which includes: a semiconductor substrate; a functional element that is disposed on one surface of the semiconductor substrate; a protection substrate that is disposed in an opposite side of that surface of the semiconductor substrate with a predetermined gap from a surface of the semiconductor substrate; and a junction member that is disposed to surround the functional element and bonds the semiconductor substrate and the protection substrate together, wherein the functional element has a shape different from a shape of a plane surrounded by the junction member in that surface of the semiconductor substrate, or is disposed in a region deviated from a central region of the plane surrounded by the junction member in that surface of the semiconductor substrate.
摘要翻译：提供一种半导体封装，其包括：半导体衬底; 设置在所述半导体衬底的一个表面上的功能元件; 保护基板，与半导体基板的与该半导体基板的表面相反的一侧以与半导体基板的表面隔开规定的间隔设置; 以及接合部件，其设置成围绕所述功能元件并将所述半导体基板和所述保护基板接合在一起，其中所述功能元件具有与所述半导体基板的所述表面中的所述接合部件所包围的平面的形状不同的形状，或者设置在偏离由半导体衬底的该表面中的接合部件围绕的平面的中心区域的区域中。

7. 发明申请

US20100102437A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF 失效
标题翻译：半导体封装及其制造方法
公开(公告)号：US20100102437A1
公开(公告)日：2010-04-29
申请号：US12648172
申请日：2009-12-28
申请人： Yuki SUTO
发明人： Yuki SUTO
IPC分类号： H01L23/498 , H01L21/78
CPC分类号： H01L31/0203 , H01L21/568 , H01L23/055 , H01L23/16 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L27/14618 , H01L27/14621 , H01L27/14683 , H01L2224/04105 , H01L2224/12105 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01073 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , H01L2924/181 , H01L2924/3025 , H01L2224/82 , H01L2924/00
摘要： A semiconductor package includes a semiconductor substrate having a semiconductor device arranged on one surface thereof; a cap substrate having one surface that opposes the one surface of the semiconductor substrate via a gap; a spacer that is arranged between the one surface of the semiconductor substrate and the one surface of the cap substrate, and that joins the semiconductor substrate and the cap substrate; and a filter that is provided on the cap substrate so as to overlap with the semiconductor device without overlapping with the spacer. The semiconductor package and method of manufacture can suppress exfoliation of the filter caused by chipping during the dicing step.
摘要翻译：半导体封装包括：半导体衬底，具有布置在其一个表面上的半导体器件; 盖基板，其具有经由间隙与所述半导体基板的所述一个表面相对的一个表面; 布置在半导体衬底的一个表面和盖衬底的一个表面之间并且连接半导体衬底和盖衬底的间隔物; 以及设置在盖基板上以与半导体器件重叠而不与间隔物重叠的滤波器。半导体封装和制造方法可以抑制在切割步骤期间由于切屑引起的过滤器的剥离。

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