专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09426897B2 Electronic component and method for manufacturing electronic component 有权
标题翻译：电子元器件及其制造方法
公开(公告)号：US09426897B2
公开(公告)日：2016-08-23
申请号：US13405380
申请日：2012-02-27
申请人： Yuji Toyota
发明人： Yuji Toyota
IPC分类号： H05K3/30 , H03H3/08 , H03H9/10
CPC分类号： H05K3/305 , H01L2224/16225 , H03H3/08 , H03H9/1071 , H03H9/1085 , Y10T29/4913
摘要： A method for manufacturing an electronic component includes a step of preparing a plurality of electrical elements, a step of preparing a base including a plurality of boards on which the plurality of electrical elements are to be mounted, respectively, a step of forming a resin on the base, a step of pressing the plurality of electrical elements against the resin to join portions of side surfaces of the plurality of electrical elements to the resin, a step of grinding the plurality of electrical elements to thin the plurality of electrical elements, and a step of dividing the base to form the plurality of board into individual pieces.
摘要翻译：一种电子部件的制造方法，包括：准备多个电气元件的步骤，分别制备包括多个电路板的多个电路板的基板的步骤，分别形成树脂的工序所述基座，将所述多个电气元件压靠在所述树脂上以将所述多个电气元件的侧表面的部分连接到所述树脂的步骤，研磨所述多个电气元件以使所述多个电气元件变薄的步骤，以及将基座分割以形成多个板的步骤为单独的部件。

2. 发明授权

US08875362B2 Method of manufacturing piezoelectric device 有权
标题翻译：制造压电元件的方法
公开(公告)号：US08875362B2
公开(公告)日：2014-11-04
申请号：US12968303
申请日：2010-12-15
申请人： Takashi Miyake , Yuji Toyota
发明人： Takashi Miyake , Yuji Toyota
IPC分类号： H03H3/02 , H03H9/15 , H03H9/02 , H03H9/10
CPC分类号： H03H3/02 , H03H9/02574 , H03H9/1014 , H03H9/1071 , Y10T29/42 , Y10T29/49126 , Y10T29/49165 , Y10T156/1056 , Y10T156/1057
摘要： A method of manufacturing a piezoelectric device includes the steps of bonding a first substrate to a second substrate having a toughness greater than that of the first substrate, forming a first though-hole through the first substrate from the side opposite to the side on which the second substrate is bonded, and forming a second through-hole through the second substrate at a location corresponding to the first through-hole by a formation method different from that used to form the first through-hole from the side opposite to the side on which the first substrate is bonded.
摘要翻译：一种制造压电器件的方法包括以下步骤：将第一衬底接合到具有比第一衬底的韧性大的韧性的第二衬底，从与第一衬底相反的一侧的第一衬底形成第一通孔，第二基板被接合，并且在与第一通孔相对应的位置处形成第二通孔，该第二通孔的形成方法与从第一通孔的与其侧面相反的一侧形成第一通孔的形成方法不同第一衬底被粘合。

3. 发明申请

US20110146041A1 METHOD OF MANUFACTURING PIEZOELECTRIC DEVICE 有权
标题翻译：制造压电器件的方法
公开(公告)号：US20110146041A1
公开(公告)日：2011-06-23
申请号：US12968303
申请日：2010-12-15
申请人： Takashi MIYAKE , Yuji TOYOTA
发明人： Takashi MIYAKE , Yuji TOYOTA
IPC分类号： H01L41/22
CPC分类号： H03H3/02 , H03H9/02574 , H03H9/1014 , H03H9/1071 , Y10T29/42 , Y10T29/49126 , Y10T29/49165 , Y10T156/1056 , Y10T156/1057
摘要： A method of manufacturing a piezoelectric device includes the steps of bonding a first substrate to a second substrate having a toughness greater than that of the first substrate, forming a first though-hole through the first substrate from the side opposite to the side on which the second substrate is bonded, and forming a second through-hole through the second substrate at a location corresponding to the first through-hole by a formation method different from that used to form the first through-hole from the side opposite to the side on which the first substrate is bonded.
摘要翻译：一种制造压电器件的方法包括以下步骤：将第一衬底接合到具有比第一衬底的韧性大的韧性的第二衬底，从与第一衬底相反的一侧的第一衬底形成第一通孔，第二基板被接合，并且在与第一通孔相对应的位置处形成第二通孔，该第二通孔的形成方法与从第一通孔的与其侧面相反的一侧形成第一通孔的形成方法不同第一衬底被粘合。

4. 发明授权

US6156672A Method of forming dielectric thin film pattern and method of forming laminate pattern comprising dielectric thin film and conductive thin film 失效
标题翻译：形成电介质薄膜图案的方法和形成包括电介质薄膜和导电薄膜的叠层图案的方法
公开(公告)号：US6156672A
公开(公告)日：2000-12-05
申请号：US443671
申请日：1999-11-19
申请人： Yoshihiro Koshido , Kei Fujibayashi , Yuji Toyota , Tadayuki Okawa , Ryoichiro Takahashi
发明人： Yoshihiro Koshido , Kei Fujibayashi , Yuji Toyota , Tadayuki Okawa , Ryoichiro Takahashi
IPC分类号： H05K3/46 , H01L21/02 , H01L21/027 , H01L21/302 , H01L21/3065 , H01L21/316 , H01P3/16 , H05K1/02 , H05K3/04 , H01L21/31
CPC分类号： H01L28/40 , H01L21/0272 , H01L21/31604 , H05K1/024 , H05K3/048 , Y10S438/951
摘要： A method of forming a dielectric thin film pattern, comprises the steps of: depositing a dielectric thin film on a substrate having a resist pattern thereon by a vapor deposition method, wherein as a material for the dielectric thin film, at least one of CeO.sub.2, Sm.sub.2 O.sub.3, Dy.sub.2 O.sub.3, Y.sub.2 O.sub.3, TiO.sub.2, Al.sub.2 O.sub.3, and MgO is used; and removing the resist pattern whereby the dielectric thin film is patterned.
摘要翻译：一种形成电介质薄膜图案的方法包括以下步骤：通过气相沉积方法在其上具有抗蚀剂图案的基板上沉积电介质薄膜，其中作为电介质薄膜的材料，CeO 2，使用Sm2O3，Dy2O3，Y2O3，TiO2，Al2O3和MgO; 并去除抗蚀剂图案，由此电介质薄膜被图案化。

5. 发明申请

US20130309434A1 RELEASE AGENT, RELEASE MATERIAL, AND ADHESIVE TAPE 审中-公开
标题翻译：发行代理人，发布材料和胶带
公开(公告)号：US20130309434A1
公开(公告)日：2013-11-21
申请号：US13983403
申请日：2012-01-20
申请人： Tsuyoshi Hiramatsu , Yuji Toyota
发明人： Tsuyoshi Hiramatsu , Yuji Toyota
IPC分类号： C09J123/08 , C09J7/02 , C09J175/14
CPC分类号： C09J123/0807 , B32B7/12 , B32B27/10 , B32B27/18 , B32B27/32 , B32B2405/00 , B32B2457/00 , B32B2605/00 , B32B2605/003 , C09J7/401 , C09J123/0815 , C09J175/14 , C09J2423/005 , Y10T428/1438 , Y10T428/2839
摘要： The present invention provides a release agent containing polyolefin, isocyanate, polyolefin polyol and a metal complex catalyst, wherein the metal complex catalyst is a non-organotin compound.
摘要翻译：本发明提供了含有聚烯烃，异氰酸酯，聚烯烃多元醇和金属络合物催化剂的脱模剂，其中金属络合物催化剂是非有机锡化合物。

6. 发明申请

US20120229991A1 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 有权
标题翻译：电子元件和制造电子元件的方法
公开(公告)号：US20120229991A1
公开(公告)日：2012-09-13
申请号：US13405380
申请日：2012-02-27
申请人： Yuji TOYOTA
发明人： Yuji TOYOTA
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K3/305 , H01L2224/16225 , H03H3/08 , H03H9/1071 , H03H9/1085 , Y10T29/4913
摘要： A method for manufacturing an electronic component includes a step of preparing a plurality of electrical elements, a step of preparing a base including a plurality of boards on which the plurality of electrical elements are to be mounted, respectively, a step of forming a resin on the base, a step of pressing the plurality of electrical elements against the resin to join portions of side surfaces of the plurality of electrical elements to the resin, a step of grinding the plurality of electrical elements to thin the plurality of electrical elements, and a step of dividing the base to form the plurality of board into individual pieces.
摘要翻译：一种电子部件的制造方法，包括：准备多个电气元件的步骤，分别制备包括多个电路板的多个电路板的基板的步骤，分别形成树脂的工序所述基座，将所述多个电气元件压靠在所述树脂上以将所述多个电气元件的侧表面的部分连接到所述树脂的步骤，研磨所述多个电气元件以使所述多个电气元件变薄的步骤，以及将基座分割以形成多个板的步骤为单独的部件。

7. 发明授权

US06340635B1 Resist pattern, process for the formation of the same, and process for the formation of wiring pattern 失效
标题翻译：抗蚀剂图案，形成相同的工艺，以及形成布线图案的工艺
公开(公告)号：US06340635B1
公开(公告)日：2002-01-22
申请号：US09433891
申请日：1999-11-04
申请人： Yuji Toyota , Yoshihiro Koshido , Masayuki Hasegawa
发明人： Yuji Toyota , Yoshihiro Koshido , Masayuki Hasegawa
IPC分类号： H01L2144
CPC分类号： H05K3/108 , G03F7/00 , H01L21/0272 , H01L21/0274 , H05K3/0082 , H05K3/048 , H05K2203/056 , Y10S438/947 , Y10S438/948 , Y10S438/949 , Y10S438/951 , Y10S438/952
摘要： A process for the formation of a wiring pattern, which includes the steps of: exposing a resist through a photomask, the photomask having a pattern whose line width is equal to or less than a resolution limit; and developing the exposed resist to form a resist pattern having groove depressions on the surface thereof, the depressions not reaching the back of the resist pattern. The resist may be a positive resist in which case the resist pattern is formed on an underplate feed film; a plating metal is precipitated on the feed film in a region not covered by the resist pattern; the resist pattern is stripped after the precipitation; and the feed film is selectively removed in a region not covered by the plating metal. Alternatively, the resist may be a negative resist in which case the resist pattern is formed on a substrate; a metallic material is deposited on the resist pattern and the substrate; and the resist is stripped from the substrate to remove the overlying metallic material.
摘要翻译：一种用于形成布线图案的方法，其包括以下步骤：通过光掩模曝光抗蚀剂，所述光掩模具有线宽度等于或小于分辨率限度的图案; 并且显影所述曝光的抗蚀剂以在其表面上形成具有凹槽凹陷的抗蚀剂图案，所述凹陷未到达所述抗蚀剂图案的背面。抗蚀剂可以是正性抗蚀剂，在这种情况下，抗蚀剂图案形成在底板进料膜上; 电镀金属在未被抗蚀剂图案覆盖的区域中在进料膜上沉淀; 沉淀后去除抗蚀剂图案; 并且在未被电镀金属覆盖的区域中选择性地除去进料膜。或者，抗蚀剂可以是负性抗蚀剂，在这种情况下，抗蚀剂图案形成在基材上; 在抗蚀剂图案和基板上沉积金属材料; 并且将抗蚀剂从衬底剥离以除去上覆的金属材料。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式