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1. 发明授权

US09062011B2 Benzoxazine intermediate and preparation method thereof 有权
标题翻译：苯并嗪中间体及其制备方法
公开(公告)号：US09062011B2
公开(公告)日：2015-06-23
申请号：US14235374
申请日：2011-10-18
申请人： Shiguo Su , Yueshan He
发明人： Shiguo Su , Yueshan He
IPC分类号： C07D265/12
CPC分类号： C07D265/12
摘要： The present invention relates to a benzoxazine intermediate and a preparation method thereof. The structural formula of the benzoxazine intermediate is shown by formula (1), R1 in formula represents O, C═O, S, SO2, alicyclic hydrocarbon with 3 to 30 carbon atoms and derivatives thereof, aliphatic hydrocarbon with 1 to 20 carbon atoms and derivatives thereof, or unsaturated aliphatic hydrocarbon with 2 to 20 carbon atoms and derivatives thereof; R2 is alicyclic hydrocarbon with 3 to 20 carbon atoms and derivatives thereof, aliphatic hydrocarbon with 1 to 20 carbon atoms and derivatives thereof, or unsaturated aliphatic hydrocarbon with 2 to 20 carbon atoms and derivatives thereof. The benzoxazine intermediate of the present invention contains a naphthalene ring structure segment, has desirable heat resistance performance and flame retarding performance, and can be widely applied in composite materials.
摘要翻译：本发明涉及苯并恶嗪中间体及其制备方法。苯并恶嗪中间体的结构式如式（1）所示，式中的R 1表示O，C = O，S，SO 2，碳原子数3〜30的脂环族烃及其衍生物，碳原子数1〜20的脂肪族烃，其衍生物或具有2至20个碳原子的不饱和脂族烃及其衍生物; R2为碳原子数为3〜20的脂环族烃及其衍生物，碳原子数1〜20的脂肪族烃及其衍生物，碳原子数2〜20的不饱和脂肪族烃及其衍生物。本发明的苯并嗪中间体含有萘环结构段，具有理想的耐热性能和阻燃性能，可广泛应用于复合材料中。

2. 发明授权

US08445605B2 Halogen-free flame retardant resin composition, and, prepreg, laminate, and laminate for printed circuit made therefrom 有权
标题翻译：无卤阻燃树脂组合物，以及由其制成的印刷电路用预浸料，层压板和层叠体
公开(公告)号：US08445605B2
公开(公告)日：2013-05-21
申请号：US12861742
申请日：2010-08-23
申请人： Yueshan He , Tao Cheng , Shiguo Su , Biwu Wang , Jie Li
发明人： Yueshan He , Tao Cheng , Shiguo Su , Biwu Wang , Jie Li
IPC分类号： B32B15/08 , B32B17/04 , B32B27/04 , B32B27/38 , C08K3/20 , C08K3/36 , C08L61/06 , C08L63/02 , C08L63/04 , C08K7/14
CPC分类号： C08K5/357 , C08G59/5073 , C08G59/621 , C08G59/686 , C08J5/24 , C08J2385/02 , C08J2463/00 , C08K5/5399 , C08L63/00 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K2201/012 , H05K2201/0209 , Y10T428/24994 , Y10T428/31511 , Y10T428/31529
摘要： The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator. The prepreg, the laminate, and the laminate for printed circuit that are made from the halogen-free flame retardant resin composition provided by the present invention, have excellent flame retardancy, as well as has high glass transition temperature (Tg), high thermal resistance, high flexural strength, high reliability, low dielectric dissipation factor, low moisture, low C.T.E, good chemical resistance, and good processability.
摘要翻译：本发明提供一种无卤阻燃树脂组合物，以及由无卤阻燃树脂组合物制成的无卤阻燃树脂组合物，预浸料，层压材料和印刷电路用层压材料。无卤阻燃树脂组合物包含：（A）40-80重量份的苯氧基磷腈化合物（A1）和含二氢苯并恶嗪环的化合物（A2）的混合物，以及苯氧基磷腈化合物（ A1）和含二氢苯并恶嗪环的化合物（A2）为1:10至1:2之间; （B）15-45重量份聚环氧化合物; （C）5-25重量份酚醛树脂型固化剂; 和（D）0.1-1重量份作为固化促进剂的咪唑型化合物。由本发明提供的无卤阻燃树脂组合物制成的预浸料，层压板和印刷电路用层压板具有优异的阻燃性，并且具有高玻璃化转变温度（Tg），高耐热性抗弯强度高，可靠性高，介电损耗因数低，水分低，CTE低，耐化学性好，加工性好。

3. 发明授权

US09139750B2 Halogen-free resin composition and method for preparation of copper clad laminate with same 有权
标题翻译：无卤素树脂组合物及其制备方法
公开(公告)号：US09139750B2
公开(公告)日：2015-09-22
申请号：US14239045
申请日：2011-09-02
申请人： Yueshan He
发明人： Yueshan He
IPC分类号： C09D163/10 , B32B15/08 , C08K5/5399 , C08K5/00 , H05K1/03 , B32B37/10 , B32B38/08 , C09D143/02 , C09D145/00 , C09D171/12 , B32B15/14 , B32B15/20 , C08K3/00 , H05K3/02
CPC分类号： C09D163/10 , B32B15/08 , B32B15/14 , B32B15/20 , B32B37/10 , B32B38/08 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2305/076 , C08K3/013 , C08K5/0025 , C08K5/5399 , C09D143/02 , C09D145/00 , C09D171/12 , H05K1/0346 , H05K1/0373 , H05K3/022 , H05K2201/012 , H05K2201/0209 , Y10T156/1075 , C08L63/00
摘要： A halogen-free resin composition and a method for preparation of copper clad laminate with the same, wherein based on total parts by weight of solid components, the halogen-free resin composition comprises a reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene of 5-50 parts, a thermosetting resin of 15-85 parts, a crosslinking curing agent of 1-35 parts, a crosslinking curing accelerant of 0-5 parts and a filler of 0-100 parts. In the present invention, the reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene having very low water absorption is introduced into the thermosetting resin, satisfying both the halogen-free and antiflaming requirements and improving the electrical properties of the system, and making it possible to prepare the halogen-free high-frequency high-speed substrate material. The resulted copper clad laminate satisfies the halogen-free requirement, and has advantages such as excellent resistance to heat and moisture, and low dielectric loss.
摘要翻译：无卤素树脂组合物及其制备方法，其中基于总重量份的固体组分，无卤树脂组合物包含5-50的反应性烯丙基苯氧基环三磷腈或乙烯基苯氧基环三磷腈部件，15-85份的热固性树脂，1-35份交联固化剂，0-5份交联固化促进剂和0-100份填料。在本发明中，具有非常低吸水性的反应性烯丙基苯氧基环三磷腈或乙烯基苯氧基环三磷腈引入到热固性树脂中，满足无卤素和抗泡沫性要求，并且改善了体系的电性能，并且使得可以制备无卤素高频高速基板材料。所得到的覆铜层压板满足无卤素要求，具有优异的耐热湿性和低介电损耗。

4. 发明申请

US20110045303A1 HALOGEN-FREE FLAME RETARDANT RESIN COMPOSITION, AND, PREPREG, LAMINATE, AND LAMINATE FOR PRINTED CIRCUIT MADE THEREFROM 有权
标题翻译：无卤素阻燃树脂组合物，和PREPREG，层压板和层压板用于印刷电路
公开(公告)号：US20110045303A1
公开(公告)日：2011-02-24
申请号：US12861742
申请日：2010-08-23
申请人： Yueshan He , Tao Cheng , Shiguo Su , Biwu Wang , Jie Li
发明人： Yueshan He , Tao Cheng , Shiguo Su , Biwu Wang , Jie Li
IPC分类号： B32B15/08 , C08K5/5399 , B32B27/38
CPC分类号： C08K5/357 , C08G59/5073 , C08G59/621 , C08G59/686 , C08J5/24 , C08J2385/02 , C08J2463/00 , C08K5/5399 , C08L63/00 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K2201/012 , H05K2201/0209 , Y10T428/24994 , Y10T428/31511 , Y10T428/31529
摘要： The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator. The prepreg, the laminate, and the laminate for printed circuit that are made from the halogen-free flame retardant resin composition provided by the present invention, have excellent flame retardancy, as well as has high glass transition temperature (Tg), high thermal resistance, high flexural strength, high reliability, low dielectric dissipation factor, low moisture, low C.T.E, good chemical resistance, and good processability.
摘要翻译：本发明提供一种无卤阻燃树脂组合物，以及由无卤阻燃树脂组合物制成的无卤阻燃树脂组合物，预浸料，层压材料和印刷电路用层压材料。无卤阻燃树脂组合物包含：（A）40-80重量份的苯氧基磷腈化合物（A1）和含二氢苯并恶嗪环的化合物（A2）的混合物，以及苯氧基磷腈化合物（ A1）和含二氢苯并恶嗪环的化合物（A2）为1:10至1:2之间; （B）15-45重量份聚环氧化合物; （C）5-25重量份酚醛树脂型固化剂; 和（D）0.1-1重量份作为固化促进剂的咪唑型化合物。由本发明提供的无卤阻燃树脂组合物制成的预浸料，层压板和印刷电路用层压板具有优异的阻燃性，并且具有高玻璃化转变温度（Tg），高耐热性抗弯强度高，可靠性高，介电损耗因数低，水分低，CTE低，耐化学性好，加工性好。

5. 发明申请

US20130284358A1 Halogen-Free Resin Composition And Method For Fabricating Halogen-Free Copper Clad Laminate Using The Same 有权
标题翻译：无卤素树脂组合物及使用其制造无卤铜包覆层压板的方法
公开(公告)号：US20130284358A1
公开(公告)日：2013-10-31
申请号：US13997542
申请日：2011-09-03
申请人： Yueshan He , Shiguo Su
发明人： Yueshan He , Shiguo Su
IPC分类号： H01B3/40 , H01B19/04
CPC分类号： H01B3/40 , B32B5/024 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/101 , C08J5/24 , C08J2363/00 , C08J2371/12 , C08J2379/04 , C08L63/00 , H01B19/04 , Y10T156/1062 , C08L71/02 , C08L79/04
摘要： The present invention relate to a halogen-free resin composition and a method for fabricating a halogen-free copper clad laminate using the same. The halogen-free resin composition comprises the following components: reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000, a polybenzoxazine resin, a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, a filler, and a benzene or ketone solvent. The method for fabricating a halogen-free copper clad laminate comprises: Step 1: dissolving reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000 in a benzene or ketone solvent, adding a polybenzoxazine resin after dissolution, and mixing by stirring, to prepare a solution for use; Step 2: adding a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, and a filler to the solution for use, and stirring uniformly, to obtain a colloidal solution; Step 3: evenly coating the prepared colloidal solution to E-glass cloth with an even surface and baking, to produce a B-stage partially cured prepreg; and Step 4: cutting the B-stage partially cured prepreg into a suitable size according to the size of a compressor, precisely overlaying, placing a copper foil on and under the laminated B-stage partially cured Prepregs, and pressing in a vacuum hot pressing machine, to obtain a halogen-free copper clad laminate.
摘要翻译：本发明涉及无卤素树脂组合物和使用其制造无卤铜箔层压板的方法。无卤树脂组合物包含数均分子量为500-3000的反应性小分子聚苯醚，聚苯并恶嗪树脂，含磷环氧树脂，复合固化剂，固化促进剂，填料，和苯或酮溶剂。制造无卤铜箔层叠体的方法包括：步骤1：在苯或酮溶剂中溶解数均分子量为500-3000的反应性小分子聚苯醚，在溶解后加入聚苯并恶嗪树脂，并通过搅拌混合，准备使用解决方案; 步骤2：向该溶液中加入含磷环氧树脂，复合固化剂，固化促进剂和填料，均匀搅拌，得到胶体溶液; 步骤3：均匀地将制备的胶体溶液涂布到具有均匀表面的E玻璃布上并烘烤，以制备B阶部分固化的预浸料; 和步骤4：根据压缩机的尺寸将B阶段部分固化的预浸料坯切割成合适的尺寸，精确地覆盖，将铜箔放置在层压的B阶段部分固化的预浸料坯上和下方，并在真空热压机器，得到无卤铜箔层压板。

6. 发明授权

US08518527B2 Method for improving flame retardant efficiency of phenoxyphosphazene compound, and prepreg. laminate for printed circuit made by the method 有权
标题翻译：提高苯氧基磷腈化合物和预浸料的阻燃效率的方法。通过该方法制作的印刷电路层压板
公开(公告)号：US08518527B2
公开(公告)日：2013-08-27
申请号：US12870830
申请日：2010-08-29
申请人： Yueshan He , Tao Cheng , Shiguo Su , Biwu Wang , Jie Li
发明人： Yueshan He , Tao Cheng , Shiguo Su , Biwu Wang , Jie Li
IPC分类号： B32B27/12 , B32B27/18 , B32B27/38 , C08L63/00
CPC分类号： B32B15/20 , B32B5/022 , B32B5/22 , B32B5/26 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/02 , B32B2262/06 , B32B2262/08 , B32B2262/10 , B32B2307/20 , B32B2307/306 , B32B2307/3065 , B32B2307/50 , B32B2307/546 , B32B2307/714 , B32B2307/7246 , B32B2307/7265 , B32B2457/08 , C08K5/357 , C08K5/5399 , C08L63/00 , C08L85/02 , C08L2203/20 , Y10T428/249952 , Y10T428/31511 , Y10T428/31529 , Y10T428/31678 , C08L2666/14
摘要： The present invention provides a method for improving the flame retardant efficiency of a phenoxyphosphazene compound, and provides a prepreg, a laminate, and a laminate for printed circuit that are made by the method. The present invention compounds a phenoxyphosphazene compound and a dihydrobenzoxazine ring-containing compound in a halogen-free flame retardant resin composition, so as to effectively improve the flame-retardant efficiency of the phenoxyphosphazene compound. Besides, the prepreg, the laminate and the laminate for printed circuit that are made by the method for improving the flame retardant efficiency of a phenoxyphosphazene compound have excellent flame retardancy, chemical resistance, anti-CAF property, high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low moisture, and low C.T.E, etc. Furthermore, epoxy resins are interfused to greatly overcome the brittleness of the benzoxazine resin, so, the cured resin has comparatively high flexural strength and good processability.
摘要翻译：本发明提供了一种提高苯氧基磷腈化合物的阻燃效率的方法，并提供了通过该方法制备的预浸料，层压材料和印刷电路用层压材料。本发明在无卤阻燃树脂组合物中化合苯氧基磷腈化合物和二氢苯并恶嗪环化合物，以有效提高苯氧基磷腈化合物的阻燃效率。此外，通过提高苯氧基磷腈化合物的阻燃效率的方法制备的预浸料，层压体和印刷电路用层压体具有优异的阻燃性，耐化学性，抗CAF性，高玻璃化转变温度（Tg），高耐热性，低介电损耗因子，低水分和低CTE等。此外，环氧树脂被连接以大大克服苯并恶嗪树脂的脆性，因此，固化树脂具有较高的弯曲强度和良好的加工性能。

7. 发明授权

US09076573B2 Halogen-free resin composition and method for fabricating halogen-free copper clad laminate using the same 有权
标题翻译：无卤素树脂组合物及其制造方法
公开(公告)号：US09076573B2
公开(公告)日：2015-07-07
申请号：US13997542
申请日：2011-09-03
申请人： Yueshan He , Shiguo Su
发明人： Yueshan He , Shiguo Su
IPC分类号： C08K5/07 , H01B3/40 , B32B5/02 , B32B15/14 , C08J5/24 , H01B19/04
CPC分类号： H01B3/40 , B32B5/024 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/101 , C08J5/24 , C08J2363/00 , C08J2371/12 , C08J2379/04 , C08L63/00 , H01B19/04 , Y10T156/1062 , C08L71/02 , C08L79/04
摘要： The present invention relate to a halogen-free resin composition and a method for fabricating a halogen-free copper clad laminate using the same. The halogen-free resin composition comprises the following components: reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000, a polybenzoxazine resin, a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, a filler, and a benzene or ketone solvent. The method for fabricating a halogen-free copper clad laminate comprises: Step 1: dissolving reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000 in a benzene or ketone solvent, adding a polybenzoxazine resin after dissolution, and mixing by stirring, to prepare a solution for use; Step 2: adding a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, and a filler to the solution for use, and stirring uniformly, to obtain a colloidal solution; Step 3: evenly coating the prepared colloidal solution to E-glass cloth with an even surface and baking, to produce a B-stage partially cured prepreg; and Step 4: cutting the B-stage partially cured prepreg into a suitable size according to the size of a compressor, precisely overlaying, placing a copper foil on and under the laminated B-stage partially cured Prepregs, and pressing in a vacuum hot pressing machine, to obtain a halogen-free copper clad laminate.
摘要翻译：本发明涉及无卤素树脂组合物和使用其制造无卤铜箔层压板的方法。无卤树脂组合物包含数均分子量为500-3000的反应性小分子聚苯醚，聚苯并恶嗪树脂，含磷环氧树脂，复合固化剂，固化促进剂，填料，和苯或酮溶剂。制造无卤铜箔层叠体的方法包括：步骤1：在苯或酮溶剂中溶解数均分子量为500-3000的反应性小分子聚苯醚，在溶解后加入聚苯并恶嗪树脂，并通过搅拌混合，准备使用解决方案; 步骤2：向该溶液中加入含磷环氧树脂，复合固化剂，固化促进剂和填料，均匀搅拌，得到胶体溶液; 步骤3：均匀地将制备的胶体溶液涂布到具有均匀表面的E玻璃布上并烘烤，以制备B阶部分固化的预浸料; 和步骤4：根据压缩机的尺寸将B阶段部分固化的预浸料坯切割成合适的尺寸，精确地覆盖，将铜箔放置在层压的B阶段部分固化的预浸料坯上和下方，并在真空热压机器，得到无卤铜箔层压板。

8. 发明申请

US20140206864A1 BENZOXAZINE INTERMEDIATE AND PREPARATION METHOD THEREOF 有权
标题翻译：苯并吖嗪中间体及其制备方法
公开(公告)号：US20140206864A1
公开(公告)日：2014-07-24
申请号：US14235374
申请日：2011-10-18
申请人： Shiguo Su , Yueshan He
发明人： Shiguo Su , Yueshan He
IPC分类号： C07D265/12
CPC分类号： C07D265/12
摘要： The present invention relates to a benzoxazine intermediate and a preparation method thereof. The structural formula of the benzoxazine intermediate is shown by formula (1), R1 in formula represents o, C═O, S, SO2, alicyclic hydrocarbon with 3 to 30 carbon atoms and derivatives thereof, aliphatic hydrocarbon with 1 to 20 carbon atoms and derivatives thereof, or unsaturated aliphatic hydrocarbon with 2 to 20 carbon atoms and derivatives thereof; R2 is alicyclic hydrocarbon with 3 to 20 carbon atoms and derivatives thereof, aliphatic hydrocarbon with 1 to 20 carbon atoms and derivatives thereof, or unsaturated aliphatic hydrocarbon with 2 to 20 carbon atoms and derivatives thereof. The benzoxazine intermediate of the present invention contains a naphthalene ring structure segment, has desirable heat resistance performance and flame retarding performance, and can be widely applied in composite materials.
摘要翻译：本发明涉及苯并恶嗪中间体及其制备方法。苯并恶嗪中间体的结构式如式（1）所示，式中的R 1表示o，C = O，S，SO 2，碳原子数为3〜30的脂环族烃及其衍生物，碳原子数1〜20的脂肪族烃，其衍生物或具有2至20个碳原子的不饱和脂族烃及其衍生物; R2为碳原子数为3〜20的脂环族烃及其衍生物，碳原子数1〜20的脂肪族烃及其衍生物，碳原子数2〜20的不饱和脂肪族烃及其衍生物。本发明的苯并嗪中间体含有萘环结构段，具有理想的耐热性能和阻燃性能，可广泛应用于复合材料中。

9. 发明申请

US20140154939A1 HALOGEN-FREE LOW-DIELECTRIC RESIN COMPOSITION, AND PREPREG AND COPPER FOIL LAMINATE MADE BY USING SAME 审中-公开
标题翻译：无卤素低介电树脂组合物，以及使用它们的制备和铜箔层压板
公开(公告)号：US20140154939A1
公开(公告)日：2014-06-05
申请号：US14235984
申请日：2011-10-18
申请人： Qianping Rong , Yueshan He , Shiguo Su
发明人： Qianping Rong , Yueshan He , Shiguo Su
IPC分类号： H05K1/03
CPC分类号： H05K1/038 , B32B5/022 , B32B15/14 , B32B15/20 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2307/204 , B32B2307/306 , B32B2457/08 , C08C19/06 , C08G59/34 , C08G73/0233 , C08K5/0066 , C08K5/5313 , C08L15/00 , C08L63/00 , C08L79/02 , H05K1/0366 , H05K1/0373 , H05K3/022 , H05K2201/012 , H05K2201/0209 , Y10T428/249921 , Y10T442/20 , Y10T442/656
摘要： A halogen-free low-dielectric resin composition, and a prepreg and a copper foil laminate made by using same. The halogen-free low-dielectric resin composition, based on parts by weight of the organic solid content, comprises: 5 to 90 parts by weight of epoxidized polybutadiene resin; 10 to 90 parts by weight of benzoxazine resin; 10 to 90 parts by weight of epoxy resin; 1 to 50 parts by weight of curing agent; 10 to 50 parts by weight of organic fire retardant; 0.01 to 1 part by weight of curing catalyst; 0.1 to 10 parts by weight of initiator; and 10 to 100 parts by weight of packing. The halogen-free low-dielectric resin composition of the present invention uses the epoxidized polybutadiene resin, so as to not only solve the defect of the polybutadiene but also maintain the advantages on the dielectric property and flexibility, thereby improving the adhesive force thereof with the copper foil. The prepreg and the copper foil laminate that are used for the printed circuit board and made by using the resin composition have the desirable dielectric property, desirable heat resistance, and a high glass-transition temperature, and can satisfy the requirements of high-frequency electronic signal transmission and high-speed information processing in the industry of printed circuit board copper foil plate.
摘要翻译：无卤低电介质树脂组合物和通过使用它们制备的预浸料和铜箔层压体。无卤低电介质树脂组合物以有机固体成分重量计含有：5〜90重量份的环氧化聚丁二烯树脂; 10〜90重量份苯并恶嗪树脂; 10〜90重量份的环氧树脂; 1〜50重量份固化剂; 10〜50重量份有机阻燃剂; 0.01〜1重量份固化催化剂; 0.1至10重量份引发剂; 和10至100重量份的包装。本发明的无卤低电介质树脂组合物使用环氧化聚丁二烯树脂，不仅可以解决聚丁二烯的缺点，而且还能够保持其介电性和柔软性的优点，从而提高其粘合力铜箔。用于印刷电路板并通过使用该树脂组合物制成的预浸料和铜箔层压板具有所需的介电性能，所需的耐热性和高玻璃化转变温度，并且可以满足高频电子信号传输和高速信息处理在印刷电路板铜箔板行业。

10. 发明申请

US20140150963A1 HALOGEN-FREE RESIN COMPOSITION AND METHOD FOR PREPARATION OF COPPER CLAD LAMINATE WITH SAME 有权
标题翻译：无卤素树脂组合物及其制备方法
公开(公告)号：US20140150963A1
公开(公告)日：2014-06-05
申请号：US14239045
申请日：2011-09-02
申请人： Yueshan He
发明人： Yueshan He
IPC分类号： C09D171/12 , B32B38/08 , C09D145/00 , B32B37/10 , C09D163/10 , C09D143/02
CPC分类号： C09D163/10 , B32B15/08 , B32B15/14 , B32B15/20 , B32B37/10 , B32B38/08 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2305/076 , C08K3/013 , C08K5/0025 , C08K5/5399 , C09D143/02 , C09D145/00 , C09D171/12 , H05K1/0346 , H05K1/0373 , H05K3/022 , H05K2201/012 , H05K2201/0209 , Y10T156/1075 , C08L63/00
摘要： A halogen-free resin composition and a method for preparation of copper clad laminate with the same, wherein based on total parts by weight of solid components, the halogen-free resin composition comprises a reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene of 5-50 parts, a thermosetting resin of 15-85 parts, a crosslinking curing agent of 1-35 parts, a crosslinking curing accelerant of 0-5 parts and a filler of 0-100 parts. In the present invention, the reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene having very low water absorption is introduced into the thermosetting resin, satisfying both the halogen-free and antiflaming requirements and improving the electrical properties of the system, and making it possible to prepare the halogen-free high-frequency high-speed substrate material. The resulted copper clad laminate satisfies the halogen-free requirement, and has advantages such as excellent resistance to heat and moisture, and low dielectric loss.
摘要翻译：无卤素树脂组合物及其制备方法，其中基于总重量份的固体组分，无卤树脂组合物包含5-50的反应性烯丙基苯氧基环三磷腈或乙烯基苯氧基环三磷腈部件，15-85份的热固性树脂，1-35份交联固化剂，0-5份交联固化促进剂和0-100份填料。在本发明中，具有非常低吸水性的反应性烯丙基苯氧基环三磷腈或乙烯基苯氧基环三磷腈引入到热固性树脂中，满足无卤素和抗泡沫性要求，并且改善了体系的电性能，并且使得可以制备无卤素高频高速基板材料。所得到的覆铜层压板满足无卤素要求，具有优异的耐热湿性和低介电损耗。

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