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1. 发明申请

US20110183467A1 PACKAGING METHOD INVOLVING REARRANGEMENT OF DICE 有权
公开(公告)号：US20110183467A1
公开(公告)日：2011-07-28
申请号：US13082160
申请日：2011-04-07
申请人： Yu-Ren CHEN , Geng-Shin Shen , Tz-Cheng Chiu
发明人： Yu-Ren CHEN , Geng-Shin Shen , Tz-Cheng Chiu
IPC分类号： H01L21/56
CPC分类号： H01L21/561 , H01L21/568 , H01L23/3107 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/92 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10158 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2224/96 , H01L2224/82 , H01L2924/00
摘要： A packaging method is disclosed that comprises attaching a plurality of dice, each having a plurality of bonding pads disposed on an active surface, to an adhesive layer on a substrate. A polymer material is formed over at least a portion of both the substrate and the plurality of dice and a molding apparatus is used on the substrate to force the polymer material to substantially fill around the plurality of dice. The molding apparatus is removed to expose a surface of the polymer material and a plurality of cutting streets is formed on an exposed surface of the polymer material. The substrate is removed to expose the active surface of the plurality of dice.

2. 发明授权

US07932531B2 Chip package 有权
标题翻译：芯片封装
公开(公告)号：US07932531B2
公开(公告)日：2011-04-26
申请号：US12506255
申请日：2009-07-21
申请人： Chun-Ying Lin , Ya-Chi Chen , Yu-Ren Chen , I-Hsin Mao
发明人： Chun-Ying Lin , Ya-Chi Chen , Yu-Ren Chen , I-Hsin Mao
IPC分类号： H01L33/00
CPC分类号： H01L21/563 , H01L23/3135 , H01L24/97 , H01L33/642 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/07802 , H01L2924/12041 , H01L2924/12044 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A chip package includes a thermal enhanced plate, contacts around the thermal enhanced plate and electrically insulated from the thermal enhanced plate, a film-like circuit layer disposed on the contacts and the thermal enhanced plate, a conductive adhesive layer, a first molding, and at least one chip disposed on the film-like circuit layer. The conductive adhesive layer is disposed between the contacts and the film-like circuit layer electrically connected to the contacts through the conductive adhesive layer. The chip has a back surface, an active surface and many bumps disposed thereon, and the chip is electrically connected to the film-like circuit layer via the bumps. The first molding at least encapsulates a portion of the thermal enhanced plate, the conductive adhesive layer, parts of the contacts and at least a portion of the film-like circuit layer. Therefore, heat dissipation efficiency of the light emitting chip package is improved.
摘要翻译：芯片封装包括热增强板，围绕热增强板接触并与热增强板电绝缘，设置在触点和热增强板上的膜状电路层，导电粘合剂层，第一模制件和设置在膜状电路层上的至少一个芯片。导电性粘合剂层设置在触点和通过导电粘合剂层与触点电连接的膜状电路层之间。芯片具有背面，有源表面和设置在其上的许多凸块，并且芯片经由凸块电连接到膜状电路层。第一模制品至少封装热增强板的一部分，导电粘合剂层，触点的一部分和膜状电路层的至少一部分。因此，提高了发光芯片封装的散热效率。

3. 发明申请

US20100060330A1 POWER ON RESET GENERATING CIRCUIT AND METHOD THEREOF 有权
标题翻译：上电复位电路及其方法
公开(公告)号：US20100060330A1
公开(公告)日：2010-03-11
申请号：US12250640
申请日：2008-10-14
申请人： YU-REN CHEN
发明人： YU-REN CHEN
IPC分类号： H03L7/00
CPC分类号： H03K17/223
摘要： The invention mainly relates to a power on reset signal generating circuit and method thereof wherein said reset signal remains as a constant being independent of rising or descending power or repeated switching. The power on reset signal circuit can be implemented by a conventional RC power on reset circuit together with a coupled N-type transistor switch to charge or discharge the capacitor inside the conventional RC power on reset circuit.
摘要翻译：本发明主要涉及一种上电复位信号发生电路及其方法，其中所述复位信号保持恒定，独立于上升或下降功率或重复切换。上电复位信号电路可以通过常规RC电源复位电路与耦合的N型晶体管开关一起实现，以对复位电路中的常规RC电源进行充电或放电。

4. 发明申请

US20090072361A1 Multi-Chip Stacked Package Structure 审中-公开
标题翻译：多芯片堆叠封装结构
公开(公告)号：US20090072361A1
公开(公告)日：2009-03-19
申请号：US12122779
申请日：2008-05-19
申请人： Geng-Shin SHEN , Yu-Ren Chen
发明人： Geng-Shin SHEN , Yu-Ren Chen
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00015 , H01L2924/00012
摘要： A multi-chip stacked package structure, comprising: a lead-frame having a top surface a back surface, the inner leads comprising a plurality of first inner leads and a plurality of second inner leads in parallel; a first chip fixedly connected to the back surface of the lead-frame, and the first chip having an active surface and a plurality of first pads adjacent to the central area of the active surface; a plurality of first metal wires electrically connected the first inner leads and the second inner leads and the first pads on the active surface of the first chip; a second chip fixedly connected to the top surface of the lead-frame, and the second chip having an active surface and a plurality of second pads adjacent to the central area of the active surface; a pair of the spacers provided on the thermal fin of the lead-frame; a plurality of second metal wires electrically connected to the top surface of first inner leads and the second inner leads and the second pads on the active surface of the second chip; and a package body encapsulated the first chip, the plurality of metal wires the second chip, the plurality of pads, the first inner leads and the second inner leads and to expose the outer leads.
摘要翻译：一种多芯片堆叠封装结构，包括：具有顶表面的后表面的引线框架，所述内引线包括多个第一内引线和多个第二内引线并联; 第一芯片固定地连接到引线框架的背面，并且第一芯片具有活性表面和与活性表面的中心区域相邻的多个第一焊盘; 多个第一金属线，电连接第一内引线和第二内引线以及第一芯片的有效表面上的第一焊盘; 固定地连接到引线框架的顶表面的第二芯片，并且第二芯片具有活动表面和与活动表面的中心区域相邻的多个第二焊盘; 设置在引线框架的散热片上的一对间隔件; 多个第二金属线，电连接到第一内引线的顶表面，第二内引线和第二芯片的有效表面上的第二焊盘; 以及封装体，其包封所述第一芯片，所述多个金属线，所述第二芯片，所述多个焊盘，所述第一内引线和所述第二内引线，以及露出所述外引线。

5. 发明申请

US20080268908A1 Antenna and wireless network device having the same 有权
标题翻译：天线和无线网络设备具有相同的功能
公开(公告)号：US20080268908A1
公开(公告)日：2008-10-30
申请号：US11790467
申请日：2007-04-25
申请人： Yu Ren Chen
发明人： Yu Ren Chen
IPC分类号： H04M1/00
CPC分类号： H01Q21/28 , H01Q1/243 , H01Q9/0421
摘要： An antenna applied to a wireless network device comprises a base, a pair of embedded portions, and an antenna portion. The base has two sides opposite to each other. Each of the embedded portions has a side wall portion and a locking wing portion. The side wall portion is substantially vertical to the base and connected to the sides of the base, while the locking wing portion is connected to the side wall portion, substantially parallel to the base, and spaced apart from the base with a first height. The antenna portion is provided with a ground member, a radiation member, and a signal member. The ground member is substantially vertical to the base, connected to one of the two sides of the base, and spaced apart from the embedded portion with an interval. The radiation member is connected to the ground member, substantially parallel to the base, and spaced apart from the base with a second height. The signal member is connected to the radiation member, substantially vertical to the base, and formed with a free end separated from the base. When the antenna is positioned in at least one slot formed on a substrate of the wireless network device, the radiation member is spaced apart from the substrate with a height difference between the second height and the first height.
摘要翻译：应用于无线网络设备的天线包括基站，一对嵌入部分和天线部分。底座的两边彼此相对。每个嵌入部分具有侧壁部分和锁定翼部分。侧壁部分基本上垂直于基部并且连接到基部的侧面，而锁定翼部分连接到侧壁部分，基本上平行于基部并且与基部间隔开第一高度。天线部分设置有接地部件，辐射部件和信号部件。接地构件基本上垂直于基座，连接到基座的两侧之一，并且间隔开与嵌入部分间隔开。辐射构件连接到接地构件，基本上平行于基座，并且与基座间隔开第二高度。信号构件连接到辐射构件，基本上垂直于基座，并且形成有与基部分离的自由端。当天线位于形成在无线网络设备的基板上的至少一个槽中时，辐射构件与第二高度和第一高度之间的高度差与基板隔开。

6. 发明授权

US07888783B2 Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers 有权
标题翻译：芯片封装结构及其方法，将芯片粘附到框架上并形成UBM层
公开(公告)号：US07888783B2
公开(公告)日：2011-02-15
申请号：US12715778
申请日：2010-03-02
申请人： Geng-Shin Shen , Yu-Ren Chen
发明人： Geng-Shin Shen , Yu-Ren Chen
IPC分类号： H01L21/44 , H01L21/302 , H01L21/461 , H01L21/31 , H01L21/469
CPC分类号： H01L23/49541 , H01L21/565 , H01L21/568 , H01L24/19 , H01L24/97 , H01L2224/04105 , H01L2224/20 , H01L2224/32245 , H01L2224/73267 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2924/01033 , H01L2924/01082 , H01L2924/01094 , H01L2924/181 , H01L2224/82 , H01L2924/00 , H01L2224/03
摘要： A chip package structure includes a chip-placed frame that having an adhesive layer thereon; a chip includes a plurality of pads on an active surface thereon, and is provided on the adhesive layer; a package structure is covered around the four sides of the chip-placed frame, and the height of the package structure is larger than the height of the chips; a plurality of patterned metal traces is electrically connected to the plurality of pads, another end is extended out to cover the surface of the package structure; a patterned protective layer is covered on the patterned metal traces and another end of the patterned metal traces is exposed; a plurality of patterned UBM layer is formed on the extended surface of the patterned metal traces; and a plurality of conductive elements is formed on the patterned UBM layer and is electrically connected to one end of the exposed portion of the patterned metal traces.
摘要翻译：芯片封装结构包括其上具有粘合剂层的芯片放置的框架; 芯片包括在其上的活性表面上的多个焊盘，并且设置在粘合剂层上; 封装结构被覆盖在芯片放置的框架的四边周围，并且封装结构的高度大于芯片的高度; 多个图案化的金属迹线电连接到多个焊盘，另一端延伸以覆盖封装结构的表面; 图案化的保护层被覆盖在图案化的金属迹线上，并且图案化的金属迹线的另一端被暴露; 在图案化的金属迹线的延伸表面上形成多个图案化的UBM层; 并且多个导电元件形成在图案化的UBM层上并且电连接到图案化金属迹线的暴露部分的一端。

7. 发明授权

US07839335B2 Antenna and wireless network device having the same 有权
标题翻译：天线和无线网络设备具有相同的功能
公开(公告)号：US07839335B2
公开(公告)日：2010-11-23
申请号：US11790467
申请日：2007-04-25
申请人： Yu Ren Chen
发明人： Yu Ren Chen
IPC分类号： H01Q1/38
CPC分类号： H01Q21/28 , H01Q1/243 , H01Q9/0421
摘要： An antenna applied to a wireless network device comprises a base, a pair of embedded portions, and an antenna portion. The base has two sides opposite to each other. Each of the embedded portions has a side wall portion and a locking wing portion. The side wall portion is substantially vertical to the base and connected to the sides of the base, while the locking wing portion is connected to the side wall portion, substantially parallel to the base, and spaced apart from the base with a first height. The antenna portion is provided with a ground member, a radiation member, and a signal member. The ground member is substantially vertical to the base, connected to one of the two sides of the base, and spaced apart from the embedded portion with an interval. The radiation member is connected to the ground member, substantially parallel to the base, and spaced apart from the base with a second height. The signal member is connected to the radiation member, substantially vertical to the base, and formed with a free end separated from the base. When the antenna is positioned in at least one slot formed on a substrate of the wireless network device, the radiation member is spaced apart from the substrate with a height difference between the second height and the first height.
摘要翻译：应用于无线网络设备的天线包括基站，一对嵌入部分和天线部分。底座的两边彼此相对。每个嵌入部分具有侧壁部分和锁定翼部分。侧壁部分基本上垂直于基部并且连接到基部的侧面，而锁定翼部分连接到侧壁部分，基本上平行于基部并且与基部间隔开第一高度。天线部分设置有接地部件，辐射部件和信号部件。接地构件基本上垂直于基座，连接到基座的两侧之一，并且间隔开与嵌入部分间隔开。辐射构件连接到接地构件，基本上平行于基座，并且与基座间隔开第二高度。信号构件连接到辐射构件，基本上垂直于基座，并且形成有与基部分离的自由端。当天线位于形成在无线网络设备的基板上的至少一个槽中时，辐射构件与第二高度和第一高度之间的高度差与基板隔开。

8. 发明授权

US07816957B2 Power on reset generating circuit and method thereof 有权
标题翻译：上电复位发生电路及其方法
公开(公告)号：US07816957B2
公开(公告)日：2010-10-19
申请号：US12250640
申请日：2008-10-14
申请人： Yu-Ren Chen
发明人： Yu-Ren Chen
IPC分类号： H03L7/00
CPC分类号： H03K17/223
摘要： The invention mainly relates to a power on reset signal generating circuit and method thereof wherein said reset signal remains as a constant being independent of rising or descending power or repeated switching. The power on reset signal circuit can be implemented by a conventional RC power on reset circuit together with a coupled N-type transistor switch to charge or discharge the capacitor inside the conventional RC power on reset circuit.
摘要翻译：本发明主要涉及一种上电复位信号发生电路及其方法，其中所述复位信号保持恒定，独立于上升或下降功率或重复切换。上电复位信号电路可以通过常规RC电源复位电路与耦合的N型晶体管开关一起实现，以对复位电路中的常规RC电源进行充电或放电。

9. 发明授权

US07663425B2 Fuse option circuit 有权
标题翻译：保险丝选项电路
公开(公告)号：US07663425B2
公开(公告)日：2010-02-16
申请号：US12313874
申请日：2008-11-24
申请人： Yu-Ren Chen , Chun-Yao Liao
发明人： Yu-Ren Chen , Chun-Yao Liao
IPC分类号： H01H37/76
CPC分类号： G11C17/16 , G11C17/18 , G11C29/789
摘要： A fuse option circuit including a fuse, a control switch, a latch, and a logical operational controller is provided. The latch stores a selected level. The logical operational controller outputs a selected result signal and feedbacks a control signal to the control switch. The level of the control signal determines whether the control switch is on or off. Therefore, the required level is input to the latch and the working mode having an ultra low current is selected. Furthermore, when the fuse is in an untrimmed state, the level of the selected result signal could be selected by a reset pulse signal of the latch in order to test a product. Afterward, it is determined whether the fuse is trimmed or not. When the fuse is in a trimmed state, the level of the selected result signal is established by a rising edge of the reset pulse signal.
摘要翻译：提供了包括保险丝，控制开关，锁存器和逻辑运算控制器的保险丝选择电路。锁存器存储所选的电平。逻辑运算控制器输出选定的结果信号并将控制信号反馈给控制开关。控制信号的电平决定控制开关是开或关。因此，所需的电平被输入到锁存器，并且选择具有超低电流的工作模式。此外，当保险丝处于未修复状态时，可以通过锁存器的复位脉冲信号来选择所选择的结果信号的电平，以便测试产品。之后，确定保险丝是否被修剪。当保险丝处于调整状态时，所选择的结果信号的电平由复位脉冲信号的上升沿建立。

10. 发明授权

US07663246B2 Stacked chip packaging with heat sink structure 有权
标题翻译：堆叠芯片封装采用散热片结构
公开(公告)号：US07663246B2
公开(公告)日：2010-02-16
申请号：US11882551
申请日：2007-08-02
申请人： Yu-Ren Chen , Geng-Shin Shen , Hung Tsun Lin
发明人： Yu-Ren Chen , Geng-Shin Shen , Hung Tsun Lin
IPC分类号： H01L23/02 , H01L23/48
CPC分类号： H01L23/3121 , H01L23/49517 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/32145 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/4911 , H01L2224/73265 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/10161 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012
摘要： A stacked package structure with leadframe having bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, in which the die pad is provided between the inner leads and is vertically distant from the inner leads; a bus bar being provided between the inner leads and the die pad; an offset chip-stacked structure stacked by a plurality of chips, the offset chip-stacked structure being fixedly connected to a first surface of the die pad and electrically connected to the inner leads; and an encapsulant covering the offset chip-stacked structure, the inner leads, the first surface of die pad, and the upper surface of bus bar, the second surface of die pad and the lower surface of bus bar being exposed and the outer leads extending out of the encapsulant.
摘要翻译：一种具有引线框架的堆叠封装结构，具有汇流条，包括：引线框架，由相互排列成行的多个内部引线，多个外部引线和管芯焊盘组成，其中管芯焊盘设置在内部引线之间并且与内引线垂直; 在所述内引线和所述管芯焊盘之间设置母线; 由多个芯片堆叠的偏移芯片堆叠结构，所述偏移芯片堆叠结构固定地连接到所述管芯焊盘的第一表面并电连接到所述内部引线; 以及覆盖偏移芯片堆叠结构的密封剂，内引线，管芯焊盘的第一表面和母线的上表面，裸片焊盘的第二表面和母线的下表面被暴露，并且外引线延伸从密封剂出来。

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