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    • 2. 发明授权
    • Method and apparatus of uninterrupted slurry supply
    • 不间断泥浆供应的方法和装置
    • US5993299A
    • 1999-11-30
    • US150948
    • 1998-09-10
    • Yu-Hao ChenKwo-An ChiangDaniel Chiu
    • Yu-Hao ChenKwo-An ChiangDaniel Chiu
    • B24B37/04B24B57/02B24B1/00
    • B24B37/04B24B57/02
    • A method and an apparatus of uninterrupted slurry supply. A plurality of polishers are provided. A slurry supply system comprises a slurry supply source, a plurality of valve boxes having a corresponding number as the polishers, a plurality of pipes to connect the valve boxes and the slurry supply source and the valve boxes and the polishers, a plurality of bypasses to connect between an inlet and an outlet of each of the valve boxes, and a plurality elbow type manually controlled three-way valve at a plurality of joints of the pipes and the bypasses. A slurry is supplied from the slurry supply source. A flowing direction of the slurry is selected by adjusting the three-way valve to supply the polishers for polishing.
    • 一种不间断泥浆供应的方法和装置。 提供多个抛光机。 浆料供应系统包括浆料供应源,具有相应数量的多个阀箱作为抛光机,连接阀箱和浆料供应源以及阀箱和抛光机的多个管道,多个旁路 连接在每个阀箱的入口和出口之间,以及在管道和旁路的多个接头处的多个弯头型手动控制三通阀。 从浆料供给源供给浆料。 通过调节三通阀来选择浆料的流动方向,以提供用于抛光的抛光机。
    • 4. 发明授权
    • Multi-step high density plasma chemical vapor deposition process
    • 多级高密度等离子体化学气相沉积工艺
    • US5968610A
    • 1999-10-19
    • US959407
    • 1997-10-28
    • Chih-Chien LiuKuen-Jian ChenYu-Hao ChenJ. Y. WuWater LurShih-Wei Sun
    • Chih-Chien LiuKuen-Jian ChenYu-Hao ChenJ. Y. WuWater LurShih-Wei Sun
    • H01L21/316H01L21/762B05D3/06H01L21/76
    • H01L21/02112H01L21/02274H01L21/02304H01L21/31612H01L21/76224
    • A method for depositing dielectric material into gaps between wiring lines in the formation of a semiconductor device includes the deposition of three oxide layers using high density plasma chemical vapor deposition (HDPCVD). A first HDPCVD step is carried out while keeping the substrate unbiased to form an oxide layer over the lines and in the gap. A second HDPCVD step in which the substrate is biased deposits a second oxide layer over the first oxide layer. During the second HDPCVD step some etching occurs and a portion of the first oxide layer is removed. A third HDPCVD step is carried out at a greater etch and sputtering rate than the second step to complete filling of the gap with dielectric material. The first oxide layer acts to protect the underlying structures from etching damage during the third step. Gaps between wiring lines can be filled with dielectric material without forming voids, even for high aspect ratio gaps.
    • 在形成半导体器件时,将介电材料沉积在布线之间的间隙中的方法包括使用高密度等离子体化学气相沉积(HDPCVD)沉积三个氧化物层。 进行第一HDPCVD步骤,同时保持衬底不偏差以在线和间隙中形成氧化物层。 衬底被偏置的第二HDPCVD步骤在第一氧化物层上沉积第二氧化物层。 在第二HDPCVD步骤期间,发生一些蚀刻,并且去除第一氧化物层的一部分。 以比用第二步骤更大的蚀刻和溅射速率进行第三HDPCVD步骤,以完成用电介质材料填充间隙。 第一氧化物层用于在第三步骤期间保护下面的结构免受蚀刻损伤。 布线之间的间隙可以填充介电材料,而不会形成空隙,即使对于高纵横比的间隙也是如此。