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1. 发明授权

US06554464B1 Apparatus for and method of reducing or eliminating interference effects in a light tunnel illuminator 有权
标题翻译：用于减轻或消除光隧道照明器中的干扰影响的装置和方法
公开(公告)号：US06554464B1
公开(公告)日：2003-04-29
申请号：US09505268
申请日：2000-02-16
申请人： Andrew M. Hawryluk , Yu Chue Fong , David G. Stites , Weijian Wang
发明人： Andrew M. Hawryluk , Yu Chue Fong , David G. Stites , Weijian Wang
IPC分类号： F21V800
CPC分类号： G02B27/0994 , G02B27/09
摘要： A light tunnel (24) comprising a hollow light tunnel body (30) or a solid light tunnel body (80) having a central axis (A1 or A2), a reflective surface (42 or 84) facing the axis, and an output end (54 or 94) having an edge (60 or 106) with a chamfered surface (120 or 130) formed on the edge. The chamfered surface is designed to alter the reflective properties of the reflective surfaces of the light tunnel body near the output end so as to reduce or eliminate edge ringing from the light tunnel body edge. In the case of a knife-edge (340) placed at the output end of the light tunnel body, knife-edge ringing is eliminated by providing a light source (310) in the form of a laser with a large number of spatial modes (M2>30). The present invention is expected to be most useful in cases where time-averaging or other interference-eliminating means prove impossible or impractical, such as with applications requiring only one or a few high-irradiance light pulses that need to uniformly irradiate a workpiece.
摘要翻译：包括中空光通道体（30）或具有中心轴线（A1或A2）的固体光通道体（80）的光通道（24），面向轴线的反射表面（42或84）和输出端（54或94）具有边缘（60或106），其边缘上形成有倒角表面（120或130）。倒角表面被设计成改变在输出端附近的光通道体的反射表面的反射特性，以便减少或消除从光通道体边缘的边缘振铃。在设置在光通道体的输出端的刀刃（340）的情况下，通过提供具有大量空间模式的激光器形式的光源（310）来消除刀刃振铃（ M2> 30）。在时间平均或其他干扰消除装置证明是不可能或不切实际的情况下，预期本发明是最有用的，例如需要仅需要一个或几个需要均匀照射工件的高辐照光脉冲的应用。

2. 发明授权

US06617600B1 Radiation shield device and method 有权
标题翻译：辐射屏蔽装置及方法
公开(公告)号：US06617600B1
公开(公告)日：2003-09-09
申请号：US09505595
申请日：2000-02-16
申请人： Andrew M. Hawryluk , Joe Gortych , Yu Chue Fong
发明人： Andrew M. Hawryluk , Joe Gortych , Yu Chue Fong
IPC分类号： G21F100
CPC分类号： B23K26/706
摘要： A radiation shield device (100) and method, the apparatus comprising either an absorbing shield (130), a scattering shield (200) or an absorbing and scattering shield (300) arranged in a processing tool (50) that irradiates a workpiece (70) with high-irradiance radiation (80) from a light source (78). The processing tool has a tool portion (66) having an irradiance damage threshold (IDT). The radiation shield device is designed to intercept a portion of the high-irradiance radiation that would otherwise be incident the tool portion, and to ensure that radiation exiting the particular shield comprising the radiation shield device and incident the tool portion has an irradiance below the tool portion irradiance damage threshold. The method includes using the radiation shield device in processing a workpiece using a processing tool.
摘要翻译：一种辐射屏蔽装置（100）和方法，该装置包括布置在照射工件（70）的处理工具（50）中的吸收屏蔽（130），散射屏蔽（200）或吸收和散射屏蔽（300））具有来自光源（78）的高辐照度辐射（80）。处理工具具有具有辐照损伤阈值（IDT）的工具部分（66）。辐射屏蔽装置被设计成拦截否则将入射到工具部分的高辐射辐射的一部分，并且确保离开包括辐射屏蔽装置并入射到工具部分的特定屏蔽的辐射在工具下方具有辐照度部分辐照损伤阈值。该方法包括使用辐射屏蔽装置使用加工工具处理工件。

3. 发明授权

US06366308B1 Laser thermal processing apparatus and method 有权
标题翻译：激光热处理装置及方法
公开(公告)号：US06366308B1
公开(公告)日：2002-04-02
申请号：US09505605
申请日：2000-02-16
申请人： Andrew M. Hawryluk , Weijian Wang , David G. Stites , Yu Chue Fong
发明人： Andrew M. Hawryluk , Weijian Wang , David G. Stites , Yu Chue Fong
IPC分类号： B41J2700
CPC分类号： B23K26/0853 , B23K26/0622 , B23K2101/40 , H01L21/268
摘要： An method of and apparatus (10) for performing laser thermal processing (LTP) of a workpiece (74) having one or more workpiece fields (78). The apparatus includes a pulsed, solid state laser light source (14) having more than 1000 spatial modes (M) and capable of emitting one or more pulses of radiation with a temporal pulse length between 1 nanosecond and 1 microsecond, a workpiece stage (70) for supporting the workpiece, and an illumination optical system having an exposure field (64). The system is arranged between the laser light source and the workpiece stage so as to illuminate within the exposure field at least one of the one or more workpiece fields with the one or more pulses of radiation, with an irradiance uniformity of less than ±5%. The method and apparatus is particularly well-suited for LTP processing of workpieces which require a single pulse or only a few pulses of high-irradiance radiation. Other applications of the present invention include rapid thermal annealing of semiconductor devices in semiconductor device manufacturing and processing, recording information in storage media, and, in general, conditioning surfaces.
摘要翻译：一种用于执行具有一个或多个工件区域（78）的工件（74）的激光热处理（LTP）的方法和装置（10）。该装置包括具有超过1000个空间模式（M）并且能够发射具有1纳秒至1微秒的时间脉冲长度的一个或多个辐射脉冲的脉冲固态激光源（14），工件台（70 ）和具有曝光场（64）的照明光学系统。该系统布置在激光光源和工件台之间，以便利用一个或多个辐射脉冲在一个或多个工件区域中的至少一个曝光区域内照射辐射均匀度小于±5％。该方法和装置特别适用于需要单个脉冲或只有几个高辐射辐射脉冲的工件的LTP处理。本发明的其它应用包括半导体器件制造和处理中的半导体器件的快速热退火，在存储介质中记录信息，以及通常的调节表面。

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