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    • 8. 发明申请
    • COMS image sensors and methods of manufacturing the same
    • COMS图像传感器及其制造方法
    • US20110163363A1
    • 2011-07-07
    • US13064289
    • 2011-03-16
    • Ui-Sik KimYoung-Hoon ParkWon-Je ParkDae-Cheol SeongYeo-Ju YoonBo-Bae Kang
    • Ui-Sik KimYoung-Hoon ParkWon-Je ParkDae-Cheol SeongYeo-Ju YoonBo-Bae Kang
    • H01L27/146
    • H01L27/14689H01L27/14603H01L27/14612H01L27/1463H01L27/14636
    • Complementary metal-oxide semiconductor (CMOS) image sensors (CIS) and methods of manufacturing the same are provided, the sensors include an epitaxial layer on a substrate in which a first, second, third and fourth region are defined. A photodiode may be formed at an upper portion of the epitaxial layer in the first region. A plurality of gate structures may be formed on the epitaxial layer in the second, third and fourth regions. A first blocking layer may be formed on the gate structures and the epitaxial layer in the first and second regions. A first impurity layer may be formed at an upper portion of the epitaxial layer adjacent to the gate structures in the second region, and a second impurity layer at upper portions of the epitaxial layer adjacent to the gate structures in the third and fourth regions. A color filter layer may be formed over the photodiode. A microlens may be formed on the color filter layer.
    • 提供互补金属氧化物半导体(CMOS)图像传感器(CIS)及其制造方法,传感器包括在其中限定了第一,第二,第三和第四区域的基板上的外延层。 可以在第一区域中的外延层的上部形成光电二极管。 可以在第二,第三和第四区域中的外延层上形成多个栅极结构。 可以在栅极结构和第一和第二区域中的外延层上形成第一阻挡层。 可以在与第二区域中的栅极结构相邻的外延层的上部形成第一杂质层,并且在第三和第四区域中与栅极结构相邻的外延层的上部处形成第二杂质层。 可以在光电二极管上方形成滤色器层。 可以在滤色器层上形成微透镜。
    • 9. 发明申请
    • Methods of fabricating image sensors and image sensors fabricated thereby
    • 制造图像传感器和图像传感器的方法
    • US20110163362A1
    • 2011-07-07
    • US13064176
    • 2011-03-09
    • Won-je ParkChan ParkYoung-hoon ParkJae-ho SongJong-wook HongKeo-sung Park
    • Won-je ParkChan ParkYoung-hoon ParkJae-ho SongJong-wook HongKeo-sung Park
    • H01L31/14
    • H01L27/14643H01L27/14603H01L27/14609H01L27/14641H01L27/14689
    • A method of fabricating an image sensor may include providing a substrate including light-receiving and non-light-receiving regions; forming a plurality of gates on the non-light-receiving region; ion-implanting a first-conductivity-type dopant into the light-receiving region to form a first dopant region of a pinned photodiode; primarily ion-implanting a second-conductivity-type dopant, different from the first-conductivity-type dopant, into an entire surface of the substrate, using the gates as a first mask; forming spacers on both side walls of the gates; and secondarily ion-implanting the second-conductivity-type dopant into the entire surface of the substrate, using the plurality of gates including the spacers as a second mask, to complete a second dopant region of the pinned photodiode. An image sensor may include the substrate; a transfer gate formed on the non-light-receiving region; a first dopant region in the light-receiving region; and a second dopant region formed on a surface of the light-receiving region.
    • 制造图像传感器的方法可以包括提供包括光接收和非光接收区域的基板; 在非光接收区域上形成多个栅极; 将第一导电型掺杂剂离子注入到光接收区域中以形成钉扎光电二极管的第一掺杂区域; 主要使用栅极作为第一掩模,将与第一导电类型掺杂剂不同的第二导电型掺杂剂离子注入基板的整个表面; 在门的两个侧壁上形成间隔物; 并且其次使用包括间隔物的多个栅极作为第二掩模将第二导电型掺杂剂离子注入到基板的整个表面中,以完成被钉扎的光电二极管的第二掺杂区域。 图像传感器可以包括基板; 形成在非光接收区域上的传输门; 在所述光接收区域中的第一掺杂剂区域; 以及形成在光接收区域的表面上的第二掺杂剂区域。