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1. 发明授权

US5831248A Heat-controlling device 失效
标题翻译：热控装置
公开(公告)号：US5831248A
公开(公告)日：1998-11-03
申请号：US859576
申请日：1997-05-21
申请人： Yoshiyuki Hojyo , Tohru Okuda , Shigeaki Kakiwaki
发明人： Yoshiyuki Hojyo , Tohru Okuda , Shigeaki Kakiwaki
IPC分类号： H01L21/677 , F27D11/02 , H01L21/205 , H01L21/26 , H05B3/00 , F27B9/06 , F27D11/00
CPC分类号： F27D11/02 , H05B3/0047
摘要： A heat-controlling device is provided with a transporting carriage for supporting and transporting a semiconductor substrate and a heating device having a plurality of heaters which apply heat in the width-wise direction of the heat-receiving member that is perpendicular to the transporting direction thereof and which are individually controlled by a controller. The controller only operates a set of the heaters that are adjacent the semiconductor substrate. Among the heaters being operated, those heaters, which are located at at least the leading end and the rear end in the transporting direction, have their outputs successively varied in accordance with the movement of the semiconductor substrate. Thus, it becomes possible to easily narrow the temperature distribution of the semiconductor substrate merely by controlling the output of the heaters.
摘要翻译：一种热控装置设有用于支撑和运输半导体衬底的运输托架和具有多个加热器的加热装置，所述多个加热器沿着与传送方向垂直的热接收构件的宽度方向施加热量并由控制器单独控制。控制器仅操作与半导体衬底相邻的一组加热器。在正在操作的加热器中，位于传送方向上的至少前端和后端的那些加热器的输出根据半导体基板的移动而依次变化。因此，仅通过控制加热器的输出就可以容易地使半导体衬底的温度分布变窄。

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