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1. 发明授权

US09730320B2 Prepreg, laminate, metal foil-clad laminate, circuit board and LED module 有权
公开(公告)号：US09730320B2
公开(公告)日：2017-08-08
申请号：US13882126
申请日：2011-10-27
申请人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Naoyuki Tani , Yoshito Kitagawa
发明人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Naoyuki Tani , Yoshito Kitagawa
IPC分类号： H05K1/03 , C08J5/24 , C08K3/00 , C08K3/22
CPC分类号： H05K1/038 , C08J5/24 , C08K3/013 , C08K3/22 , C08K2003/2217 , C08K2003/2227 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , Y10T442/20 , Y10T442/3415 , Y10T442/3472 , Y10T442/656 , Y10T442/659
摘要： A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 μm, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

2. 发明申请

US20130215628A1 PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, CIRCUIT BOARD AND LED MODULE 有权
标题翻译： PREPREG，层压板，金属箔层压板，电路板和LED模组
公开(公告)号：US20130215628A1
公开(公告)日：2013-08-22
申请号：US13882126
申请日：2011-10-27
申请人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Naoyuki Tani , Yoshito Kitagawa
发明人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Naoyuki Tani , Yoshito Kitagawa
IPC分类号： H05K1/03
CPC分类号： H05K1/038 , C08J5/24 , C08K3/013 , C08K3/22 , C08K2003/2217 , C08K2003/2227 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , Y10T442/20 , Y10T442/3415 , Y10T442/3472 , Y10T442/656 , Y10T442/659
摘要： A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 μm, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.
摘要翻译：提供了具有优良的导热性，耐热性，钻孔加工性和阻燃性的层压材料。在通过用热固性树脂组合物浸渍织造或非织造布基材而获得的预浸料中，热固性树脂组合物每100体积份的热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）平均粒径（D50）为2〜15μm的三水铝矿型氢氧化铝粒子和（B）平均粒径（D50）为0.5〜15μm的氧化镁和三水铝矿型配合比（体积比）氢氧化铝粒子（A）与氧化镁（B）的摩尔比为1:0.3〜3。

3. 发明授权

US08603624B2 Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting 有权
标题翻译：预浸料，层压板，金属复合层压板，电路板和LED安装电路板
公开(公告)号：US08603624B2
公开(公告)日：2013-12-10
申请号：US13510770
申请日：2010-10-29
申请人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Yoshito Kitagawa , Naoyuki Tani
发明人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Yoshito Kitagawa , Naoyuki Tani
IPC分类号： B32B15/00
CPC分类号： H05K1/0373 , B32B5/28 , B32B15/14 , C08G59/38 , C08G59/4021 , C08G59/621 , C08J5/24 , H05K1/0366 , H05K2201/012 , H05K2201/0209 , H05K2201/0266 , Y10T428/24917 , Y10T428/24994 , Y10T428/25 , Y10T428/252 , Y10T428/254 , Y10T428/257 , Y10T442/20 , Y10T442/3455
摘要： Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 μm and inorganic particles that have an average particle diameter (D50) of 2 to 15 μm and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.
摘要翻译：公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热硬化性树脂组合物每100体积份热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）三水铝矿平均粒径（D50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D50）为2〜15μm的勃姆石粒子的无机成分和无机粒子，平均粒径（D50）为2〜15μm，并且含有剥离开始温度为400℃以上或不含结晶水的结晶水，（C）平均粒径（D50）的氧化铝粒子）为1.5μm以下，三水铝石氢氧化铝粒子（A），至少一种选自一组的无机成分（B）的配合比（体积比）勃姆石粒子和无机粒子，氧化铝粒子（C）的比例为1:0.1〜2.5:0.1:1。

4. 发明申请

US20120228010A1 PREPREG, LAMINATE, METAL-FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND CIRCUIT BOARD FOR LED MOUNTING 有权
标题翻译： PREPREG，层压板，金属箔层压板，电路板和LED电路板电路板
公开(公告)号：US20120228010A1
公开(公告)日：2012-09-13
申请号：US13510770
申请日：2010-10-29
申请人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Yoshito Kitagawa , Naoyuki Tani
发明人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Yoshito Kitagawa , Naoyuki Tani
IPC分类号： H05K1/03 , B32B15/08 , B32B5/28
CPC分类号： H05K1/0373 , B32B5/28 , B32B15/14 , C08G59/38 , C08G59/4021 , C08G59/621 , C08J5/24 , H05K1/0366 , H05K2201/012 , H05K2201/0209 , H05K2201/0266 , Y10T428/24917 , Y10T428/24994 , Y10T428/25 , Y10T428/252 , Y10T428/254 , Y10T428/257 , Y10T442/20 , Y10T442/3455
摘要： Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 μm and inorganic particles that have an average particle diameter (D50) of 2 to 15 μm and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.
摘要翻译：公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热硬化性树脂组合物每100体积份热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）三水铝矿平均粒径（D50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D50）为2〜15μm的勃姆石粒子的无机成分和无机粒子，具有2〜15μm的平均粒径（D50），含有剥离开始温度为400℃以上或不含结晶水的结晶水，（C）平均粒径（D50）的氧化铝粒子）为1.5μm以下，三水铝石氢氧化铝粒子（A），至少一种选自基团的无机成分（B）的配合比（体积比）勃姆石粒子和无机粒子，氧化铝粒子（C）的比例为1:0.1〜2.5:0.1:1。

5. 发明申请

US20120152599A1 PRINTED WIRING BOARD, BUILD-UP MULTI-LAYER BOARD, AND PRODUCTION METHOD THEREFOR 有权
标题翻译：印刷线路板，建筑多层板及其生产方法
公开(公告)号：US20120152599A1
公开(公告)日：2012-06-21
申请号：US13392554
申请日：2010-09-02
申请人： Yoshito Kitagawa , Naoyuki Tani , Toshiyuki Asahi
发明人： Yoshito Kitagawa , Naoyuki Tani , Toshiyuki Asahi
IPC分类号： H05K1/09 , H05K3/06
CPC分类号： H05K3/381 , H05K3/4644 , H05K3/4652 , H05K2201/0209 , H05K2201/2072 , H05K2203/0773 , Y10T29/49128
摘要： A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor. By providing pores in substantially the same plane as wiring patterns in the printed-wiring-board including insulating layers, wiring pattern layers made of copper foil alternately laminated on the insulating layers, and pores provided between the wiring patterns, a printed-wiring-board having high connection reliability free from delamination or cracks during heating or in heat cycle conditions.
摘要翻译：多层印刷电路板用于密封地包装具有改进功能的半导体的电子部件及其制造方法，更具体地说，实现了具有优异的铜箔剥离性的多层印刷电路板 - 防止出现分层（层间剥离）等结构缺陷的强度和高连接可靠性及其制造方法。由于印刷电路板的薄化或构成印刷电路板的绝缘层的多样化，可能会在绝缘层之间或绝缘层与电镀导体之间的界面中发生分层剥离。通过在包括绝缘层的印刷电路板中的布线图案的基本相同的平面上设置孔，在交替层叠在绝缘层上的由铜箔制成的布线图案层和设置在布线图案之间的孔，印刷布线板具有高的连接可靠性，在加热或热循环条件下不会发生分层或裂纹。

6. 发明授权

US08866022B2 Printed wiring board, build-up multi-layer board, and production method therefor 有权
标题翻译：印刷线路板，积层多层板及其制造方法
公开(公告)号：US08866022B2
公开(公告)日：2014-10-21
申请号：US13392554
申请日：2010-09-02
申请人： Yoshito Kitagawa , Naoyuki Tani , Toshiyuki Asahi
发明人： Yoshito Kitagawa , Naoyuki Tani , Toshiyuki Asahi
IPC分类号： H05K1/00 , H05K3/00 , H05K3/38 , H05K3/46
CPC分类号： H05K3/381 , H05K3/4644 , H05K3/4652 , H05K2201/0209 , H05K2201/2072 , H05K2203/0773 , Y10T29/49128
摘要： A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor. By providing pores in substantially the same plane as wiring patterns in the printed-wiring-board including insulating layers, wiring pattern layers made of copper foil alternately laminated on the insulating layers, and pores provided between the wiring patterns, a printed-wiring-board having high connection reliability free from delamination or cracks during heating or in heat cycle conditions.
摘要翻译：多层印刷电路板用于密封地包装具有改进功能的半导体的电子部件及其制造方法，更具体地说，实现了具有优异的铜箔剥离性的多层印刷电路板 - 防止出现分层（层间剥离）等结构缺陷的强度和高连接可靠性及其制造方法。由于印刷电路板的薄化或构成印刷电路板的绝缘层的多样化，可能会在绝缘层之间或绝缘层与电镀导体之间的界面中发生分层剥离。通过在包括绝缘层的印刷电路板中的布线图案的基本相同的平面上设置孔，在交替层叠在绝缘层上的由铜箔制成的布线图案层和设置在布线图案之间的孔，印刷布线板具有高的连接可靠性，在加热或热循环条件下不会发生分层或裂纹。

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