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1. 发明授权

US06565732B1 Gold plating solution and plating process 有权
标题翻译：镀金液和电镀工艺
公开(公告)号：US06565732B1
公开(公告)日：2003-05-20
申请号：US09830567
申请日：2001-05-07
申请人： Katsutsugu Kitada , Yoshiro Shindo
发明人： Katsutsugu Kitada , Yoshiro Shindo
IPC分类号： C25D348
CPC分类号： C25D3/48
摘要： The present invention provides a non-cyanide electrolytic gold plating solution comprising a gold compound, as a source material for gold, selected from the group consisting of a gold salt and a gold complex, a buffering agent, an organic brightener, and a conductive salt, wherein 1,2-ethanediamine is contained in the gold plating solution. The gold plating solution has excellent liquid stability in a bath and causes no change in the physical properties of the deposited gold or no decomposition of the solution during the operation of gold plating. The gold plating solutions include both a type in which a bis(1,2-ethanediamine) gold complex is used as a source material for gold, and a type in which a gold salt is used as a source material for gold. The gold plating solution is an unprecedentedly good electrolytic gold plating solution in which the hardness, purity, state of the deposited crystals and so on can be controlled.
摘要翻译：本发明提供了一种非氰化物电解金镀液，其包含金化合物作为金的源材料，其选自金盐和金络合物，缓冲剂，有机增白剂和导电盐其中，在镀金液中含有1,2-乙二胺。金镀液在浴中具有优异的液体稳定性，并且在镀金操作期间不会沉积金的物理性质或溶液的分解。镀金液包括使用双（1,2-乙二胺）金络合物作为金的原料的类型，以及使用金盐作为金的原料的类型。镀金液是能够控制硬度，纯度，沉积晶体的状态等的前所未有的良好的电解镀金液。

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