专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2005095359A Knife and manufacturing method thereof 审中-公开
标题翻译：其制作及制造方法
公开(公告)号：JP2005095359A
公开(公告)日：2005-04-14
申请号：JP2003332744
申请日：2003-09-25
申请人： Yoshinori Niwa , 義典丹羽
发明人： NIWA YOSHINORI
IPC分类号： B26B3/00
摘要： PROBLEM TO BE SOLVED: To provide a knife capable of selecting a form of a grip of the knife, having a high productivity and improving the usability and to provide a manufacturing method thereof.
SOLUTION: This knife is provided with a knife body 11 formed by integrating a part 22 served as a handle with an edge body, and a plurality of holes 18a, 18b and 18c bored in the part served as the handle at a predetermined interval so that a member (handle material) 12 served as a grip is detachably attached to the part served as the handle. At least, two of the plurality of holes, when the member served as the grip is detached, are used for inserting the end parts of a slip prevention cord wound around the part served as the handle.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够选择刀具形式的刀具，具有高生产率并提高其可用性并提供其制造方法。解决方案：该刀具有刀身11，刀体11通过将用作手柄的部分22与边缘体相结合而形成，并且多个孔18a，18b和18c以预定的角度钻在作为手柄的部分中间隔使得用作手柄的构件（手柄材料）12可拆卸地附接到用作手柄的部分。当拆卸用作手柄的构件时，多个孔中的至少两个用于插入卷绕在作为把手的部分周围的防滑线的端部。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005066090A Cutter and manufacturing method thereof 审中-公开
标题翻译：切割机及其制造方法
公开(公告)号：JP2005066090A
公开(公告)日：2005-03-17
申请号：JP2003301397
申请日：2003-08-26
申请人： Yoshinori Niwa , 義典丹羽
发明人： NIWA YOSHINORI , TAKANO JUN
IPC分类号： B24B3/54 , B23K20/00 , B23K20/24 , B23K101/20 , B23K103/24 , B26B9/00
摘要： PROBLEM TO BE SOLVED: To provide a cutter firmly connecting a titanium or titanium alloy plate to a stainless plate, being hardly rusted and lightweight, securing a predetermined thickness in its trunk part and having high operability and to provide its manufacturing method. SOLUTION: This cutter is provided with bond alloy layers 2 on the both front/rear surfaces of a stainless plate, the trunk part 1 formed by bonding the titanium plate or the titanium alloy plate to the stainless plate via the bond alloy layers 2, and a tip part 4 composed of a part of the stainless plate cut from the trunk part. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供将钛或钛合金板牢固地连接到不锈钢板的切割器，几乎不生锈和重量轻，在其主体部分中确保预定厚度并具有高可操作性并提供其制造方法。
解决方案：该切割器在不锈钢板的两个前/后表面上设置有接合合金层2，主体部分1通过接合合金层将钛板或钛合金板接合到不锈钢板上而形成以及由从主体部分切割的不锈钢板的一部分构成的末端部分4。版权所有（C）2005，JPO＆NCIPI

3. 发明授权

US07646089B2 Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic device 失效
标题翻译：半导体封装，半导体封装的制造方法，电子器件，电子器件的制造方法
公开(公告)号：US07646089B2
公开(公告)日：2010-01-12
申请号：US12121508
申请日：2008-05-15
申请人： Futoshi Fukaya , Yuichi Asano , Yoshinori Niwa
发明人： Futoshi Fukaya , Yuichi Asano , Yoshinori Niwa
IPC分类号： H01L23/22 , H01L23/24 , H01L23/14 , H01L23/29
CPC分类号： H05K3/305 , B23K2103/42 , B23K2103/50 , H01L23/3107 , H01L23/49555 , H01L23/49582 , H01L23/544 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L24/97 , H01L2223/54486 , H01L2224/05624 , H01L2224/29139 , H01L2224/29339 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83851 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/15788 , H01L2924/181 , H01L2924/1815 , H05K2201/09036 , H05K2201/10689 , Y02P70/613 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package including a substrate with a semiconductor device mounted on the substrate and a resin member sealing the substrate and semiconductor device. The resin member includes a first surface and a second surface located on the other side of the first surface and a plurality of leads electrically connected with the semiconductor device. The leads project from the resin member and extend to the second surface side; wherein the second surface of the resin member includes a first area having a first concave portion and a second area having a second concave portion which is different from the first area, and the second concave portion is deeper than the first concave portion.
摘要翻译：一种半导体封装，其包括具有安装在基板上的半导体器件的基板和密封基板和半导体器件的树脂部件。树脂构件包括位于第一表面的另一侧的第一表面和第二表面以及与半导体器件电连接的多个引线。引线从树脂构件突出并延伸到第二表面侧; 其特征在于，所述树脂部件的所述第二面包括具有第一凹部的第一区域和与所述第一区域不同的第二凹部的第二区域，所述第二凹部比所述第一凹部更深。

4. 发明申请

US20090283897A1 SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE, AN ELECTRONIC DEVICE, METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE 失效
标题翻译：半导体封装，制造半导体封装的方法，电子器件，制造电子器件的方法
公开(公告)号：US20090283897A1
公开(公告)日：2009-11-19
申请号：US12121508
申请日：2008-05-15
申请人： Futoshi FUKAYA , Yuichi ASANO , Yoshinori NIWA
发明人： Futoshi FUKAYA , Yuichi ASANO , Yoshinori NIWA
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H05K3/305 , B23K2103/42 , B23K2103/50 , H01L23/3107 , H01L23/49555 , H01L23/49582 , H01L23/544 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L24/97 , H01L2223/54486 , H01L2224/05624 , H01L2224/29139 , H01L2224/29339 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83851 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/15788 , H01L2924/181 , H01L2924/1815 , H05K2201/09036 , H05K2201/10689 , Y02P70/613 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package including a substrate with a semiconductor device mounted on the substrate and a resin member sealing the substrate and semiconductor device. The resin member includes a first surface and a second surface located on the other side of the first surface and a plurality of leads electrically connected with the semiconductor device. The leads project from the resin member and extend to the second surface side; wherein the second surface of the resin member includes a first area having a first concave portion and a second area having a second concave portion which is different from the first area, and the second concave portion is deeper than the first concave portion.
摘要翻译：一种半导体封装，其包括具有安装在基板上的半导体器件的基板和密封基板和半导体器件的树脂部件。树脂构件包括位于第一表面的另一侧的第一表面和第二表面以及与半导体器件电连接的多个引线。引线从树脂构件突出并延伸到第二表面侧; 其特征在于，所述树脂部件的所述第二面包括具有第一凹部的第一区域和与所述第一区域不同的第二凹部的第二区域，所述第二凹部比所述第一凹部更深。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式