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1. 发明授权

US06590479B2 Integrated microcontact pin and method for manufacturing the same 失效
标题翻译：集成微接针及其制造方法
公开(公告)号：US06590479B2
公开(公告)日：2003-07-08
申请号：US09877953
申请日：2001-06-08
申请人： Haruo Yoshida , Yasuhiro Maeda , Yoshihide Miyagawa
发明人： Haruo Yoshida , Yasuhiro Maeda , Yoshihide Miyagawa
IPC分类号： H01P104
CPC分类号： G01R1/0408 , G01R1/06772 , G01R1/07314
摘要： The invention allows for testing by high velocity signals of high density LSIs prior to being packaged having an electrode spacing on the odder of 150 &mgr;m, for example. Coaxial transmission lines 13 for termination formed through a terminal support 11 are arranged in a two-dimensional array. Connected to one ends of the transmission lines 13 are one ends of contact pins 18 such as conductive whiskers while the other ends of the transmission lines 13 are connected to a transmission line block 61 of a three-dimensionally upwardly gradually broadening configuration through a connection plate 72 similar in construction to the terminal support 11. The transmission line block 61 holds high frequency transmission lines 62 for relay connected at one ends to the other ends of the coaxial transmission lines 13 and having spacings between the adjacent lines broadened at the other upper ends. The widely spaced upper ends of the transmission lines 62 are connected to a performance board (not shown). The contact pins 18 are about 0.3 to 0.5 mm in length and the characteristics impedance is maintained uniform over all the transmission lines 62. The terminal support 11 is replaceable.
摘要翻译：本发明允许例如在具有150μm之外的电极间隔的封装之前通过高密度LSI的高速度信号进行测试。通过端子支撑件11形成的用于端接的同轴传输线13被布置成二维阵列。连接到传输线13的一端的是接触引脚18的一端，例如导电晶须，而传输线13的另一端通过连接板连接到三维向上逐渐变宽的传输线块61 72类似于结构与终端支撑11.传输线块61保持用于一端连接到同轴传输线13的另一端的继电器的高频传输线62，并且在另一个上端扩展的相邻线之间的间隔。传输线62的间隔较宽的上端连接到执行板（未示出）。接触销18的长度为约0.3至0.5mm，并且特性阻抗在所有传输线62上保持均匀。终端支撑件11是可更换的。

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