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1. 发明授权

US08092961B2 Position aligning apparatus, position aligning method, and semiconductor device manufacturing method 有权
标题翻译：位置对位装置，位置对准方法以及半导体装置制造方法
公开(公告)号：US08092961B2
公开(公告)日：2012-01-10
申请号：US12385991
申请日：2009-04-27
申请人： Yoshiaki Yanagawa , Yuki Okada
发明人： Yoshiaki Yanagawa , Yuki Okada
IPC分类号： G03F9/00
CPC分类号： G01B11/002 , G03B27/52 , G03F9/7003 , G03F9/7011 , G03F9/7019
摘要： A position aligning apparatus performs position alignment of a pattern in a current process of a pattern exposure process by using a pattern formed before the current process. The position aligning apparatus includes: a correction calculating section configured to calculate a correction value set of a current lot about each of misalignments in scale and rotation of a pattern in a chip in the current process based on a correction value set in an immediately-preceding lot in the current process, a completeness value set in the immediately-preceding lot in the current process, a summation of completeness value sets in the immediately-preceding lot to a process immediately-preceding to the current process, and a summation of completeness value sets in the current lot to the immediately-preceding process; and a correction control unit configured to control correction of the scale and the rotation of the pattern in the chip by using the correction value sets.
摘要翻译：位置对位装置通过使用在当前处理之前形成的图案，在图案曝光处理的当前处理中执行图案的位置对准。位置对位装置包括：校正计算部，被配置为基于在前一处设定的校正值，计算当前处理中的芯片中的图案的比例和旋转中的每个不对准的当前批次的校正值集在当前流程中，在当前流程中紧接在前的批次中设置的完整性值，将紧接在前的批次中的完整性值集合的总和与当前流程之前的流程相加，以及完整性值的总和将当前批次设置为紧接在前的过程; 以及校正控制单元，其被配置为通过使用所述校正值集来控制所述刻度的所述图案的校正和所述图案的旋转。

2. 外观设计

USD517384S1 Wire solder applicator 失效
标题翻译：焊丝焊接机
公开(公告)号：USD517384S1
公开(公告)日：2006-03-21
申请号：US29209789
申请日：2004-07-21
申请人： Kou Ishii , Yoshiaki Yanagawa
设计人： Kou Ishii , Yoshiaki Yanagawa

3. 发明申请

US20090269685A1 Position aligning apparatus, position aligning method, and semiconductor device manufacturing method 有权
标题翻译：位置对位装置，位置对准方法以及半导体装置制造方法
公开(公告)号：US20090269685A1
公开(公告)日：2009-10-29
申请号：US12385991
申请日：2009-04-27
申请人： Yoshiaki Yanagawa , Yuki Okada
发明人： Yoshiaki Yanagawa , Yuki Okada
IPC分类号： G03F7/20 , G06F19/00 , G01B11/00 , G03B27/52
CPC分类号： G01B11/002 , G03B27/52 , G03F9/7003 , G03F9/7011 , G03F9/7019
摘要： A position aligning apparatus performs position alignment of a pattern in a current process of a pattern exposure process by using a pattern formed before the current process. The position aligning apparatus includes: a correction calculating section configured to calculate a correction value set of a current lot about each of misalignments in scale and rotation of a pattern in a chip in the current process based on a correction value set in an immediately-preceding lot in the current process, a completeness value set in the immediately-preceding lot in the current process, a summation of completeness value sets in the immediately-preceding lot to a process immediately-preceding to the current process, and a summation of completeness value sets in the current lot to the immediately-preceding process; and a correction control unit configured to control correction of the scale and the rotation of the pattern in the chip by using the correction value sets.
摘要翻译：位置对位装置通过使用在当前处理之前形成的图案，在图案曝光处理的当前处理中执行图案的位置对准。位置对位装置包括：校正计算部，被配置为基于在前一处设定的校正值，计算当前处理中的芯片中的图案的比例和旋转中的每个不对准的当前批次的校正值集在当前流程中，在当前流程中紧接在前的批次中设置的完整性值，将紧接在前的批次中的完整性值集合的总和与当前流程之前的流程相加，以及完整性值的总和将当前批次设置为紧接在前的过程; 以及校正控制单元，其被配置为通过使用所述校正值集来控制所述刻度的所述图案的校正和所述图案的旋转。

4. 发明申请

US20060243851A1 Wire material payout device and wire solder 审中-公开
标题翻译：电线材料支付装置和焊丝
公开(公告)号：US20060243851A1
公开(公告)日：2006-11-02
申请号：US10555856
申请日：2004-06-24
申请人： Kou Ishii , Yoshiaki Yanagawa , Shigeki Maruyama
发明人： Kou Ishii , Yoshiaki Yanagawa , Shigeki Maruyama
IPC分类号： B23K3/06 , B65H49/20 , B65H51/18
CPC分类号： B23K3/06
摘要： An object of the present invention is to provide a wire rod feeding device in which a soft wire rod can be inserted easily. To achieve this object, in the wire rod feeding device in accordance with the present invention, the wire rod is gripped and released, and is run out by a chuck body (7) which is movable back and forth, and opening means for keeping an opened state of the chuck body is provided.
摘要翻译：本发明的目的是提供一种能够容易地插入软线的线材供给装置。为了达到上述目的，在本发明的线材供给装置中，将线材夹持并释放，并且能够前后移动的卡盘体（7）使其脱离，提供卡盘体的打开状态。

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