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1. 发明授权

US08114302B2 Method of fabricating cantilever type probe and method of fabricating probe card using the same 有权
标题翻译：制造悬臂式探头的方法及使用其制造探针卡的方法
公开(公告)号：US08114302B2
公开(公告)日：2012-02-14
申请号：US12308012
申请日：2007-05-16
申请人： Han-Moo Lee , Yong-Hwi Jo
发明人： Han-Moo Lee , Yong-Hwi Jo
IPC分类号： B44C1/22
CPC分类号： G01R1/06744 , G01R1/06727 , G01R3/00
摘要： Disclosed is a method of fabricating a cantilever type probes. According to this method, after forming grooves each in tip portion and dummy tip portion regions of a substrate, the tip portion and dummy tip portion are formed with filling the grooves of the tip portion and dummy tip portion regions. A sacrificial layer is formed to cover the dummy tip portion region including dummy tip portion. A beam portion is formed in connection with the tip portion, extending upward the dummy tip portion including the sacrificial layer. The method includes steps of selectively etching the substrate of the tip portion and floating the tip portion from the substrate. Accordingly, it minimizes physical and chemical damages on the tip portion while fabricating a probe card, providing stability thereto with smaller defects of the tip portion.
摘要翻译：公开了制造悬臂型探针的方法。根据该方法，在基板的前端部分和虚设末端部分区域中形成沟槽之后，在尖端部分和虚拟顶端部分区域中填充尖端部分和虚拟顶端部分，形成凹槽。形成牺牲层以覆盖包括假顶端部分的假顶端部区域。梁部分与尖端部分形成，向上延伸包括牺牲层的虚拟顶端部分。该方法包括以下步骤：选择性地蚀刻尖端部分的基底并将尖端部分从衬底浮起。因此，在制造探针卡的同时，使尖端部分的物理和化学损伤最小化，从而在尖端部分的缺陷较小的情况下提供稳定性。

2. 发明申请

US20090173712A1 Method of fabricating cantilever type probe and method of fabricating probe card using the same 有权
标题翻译：制造悬臂式探头的方法及使用其制造探针卡的方法
公开(公告)号：US20090173712A1
公开(公告)日：2009-07-09
申请号：US12308012
申请日：2007-05-16
申请人： Han-Moo Lee , Yong-Hwi Jo
发明人： Han-Moo Lee , Yong-Hwi Jo
IPC分类号： B44C1/22
CPC分类号： G01R1/06744 , G01R1/06727 , G01R3/00
摘要： Disclosed is a method of fabricating a cantilever type probes. According to this method, after forming grooves each in tip portion and dummy tip portion regions of a substrate, the tip portion and dummy tip portion are formed with filling the grooves of the tip portion and dummy tip portion regions. A sacrificial layer is formed to cover the dummy tip portion region including dummy tip portion. A beam portion is formed in connection with the tip portion, extending upward the dummy tip portion including the sacrificial layer. The method includes steps of selectively etching the substrate of the tip portion and floating the tip portion from the substrate. Accordingly, it minimizes physical and chemical damages on the tip portion while fabricating a probe card, providing stability thereto with smaller defects of the tip portion.
摘要翻译：公开了制造悬臂型探针的方法。根据该方法，在基板的前端部分和虚设末端部分区域中形成沟槽之后，在尖端部分和虚拟顶端部分区域中填充尖端部分和虚拟顶端部分，形成凹槽。形成牺牲层以覆盖包括假顶端部分的假顶端部区域。梁部分与尖端部分形成，向上延伸包括牺牲层的虚拟顶端部分。该方法包括以下步骤：选择性地蚀刻尖端部分的基底并将尖端部分从衬底浮起。因此，在制造探针卡的同时，使尖端部分的物理和化学损伤最小化，从而在尖端部分的缺陷较小的情况下提供稳定性。

3. 发明授权

US07886957B2 Method of bonding probes and method of manufacturing a probe card using the same 有权
标题翻译：探针接合方法及其制造方法
公开(公告)号：US07886957B2
公开(公告)日：2011-02-15
申请号：US12097839
申请日：2007-03-19
申请人： Ki-Joon Kim , Yong-Hwi Jo
发明人： Ki-Joon Kim , Yong-Hwi Jo
IPC分类号： B23K31/02
CPC分类号： H05K3/3452 , G01R1/06727 , G01R3/00 , H05K3/341 , H05K3/4015 , H05K2201/2081 , H05K2203/0315
摘要： In a method of manufacturing bonding probes, bump layer patterns are formed on terminals of a multi-layered substrate. A first wetting layer pattern having a wettability with respect to a solder paste, and a non-wetting layer pattern having a non-wettability with respect to the solder paste are formed on the bump layer patterns. The solder paste is formed on the first wetting layer and the non-wetting layer pattern. The probes, which make contact with an object, are bonded to the solder paste. The solder paste on the non-wetting layer pattern reflows along a surface of the first wetting layer pattern to form an adhesive layer on the first wetting layer pattern. Thus, a sufficient amount of the solder paste, which is required for bonding the probes, may be provided to firmly bond the probes.
摘要翻译：在制造接合探针的方法中，在多层基板的端子上形成凸起层图案。在凸块层图案上形成有相对于焊膏具有润湿性的第一润湿层图案和相对于焊膏具有不润湿性的非润湿层图案。焊膏形成在第一润湿层和非润湿层图案上。与物体接触的探针与焊膏接合。非润湿层图案上的焊膏沿着第一润湿层图案的表面回流以在第一润湿层图案上形成粘合剂层。因此，可以提供足够量的用于粘合探针所需的焊膏，以牢固地结合探针。

4. 发明申请

US20090184727A1 Space Transformer, Manufacturing Method of the Space Transformer and Probe Card Having the Space Transformer 审中-公开
标题翻译：空间变压器，具有空间变压器的空间变压器和探头卡的制造方法
公开(公告)号：US20090184727A1
公开(公告)日：2009-07-23
申请号：US12223967
申请日：2007-02-13
申请人： Ki-Joon Kim , Yong-Hwi Jo , Dong Yeul Choi
发明人： Ki-Joon Kim , Yong-Hwi Jo , Dong Yeul Choi
IPC分类号： G01R31/02 , H05K3/10
CPC分类号： G01R1/07378 , G01R31/2889 , Y10T29/49155
摘要： Provided is a probe card of a semiconductor testing apparatus, including a printed circuit board to which an electrical signal is applied from external, a space transformer having a plurality of probes directly contacting with a test object, and interconnectors connecting the printed circuit board to the probes of the space transformer. The space transformer includes substrate pieces which the probes are installed on one sides of, and a combination member joining and unifying the substrate pieces together so as to form a large-area substrate with the substrate pieces on the same plane. This probe card is advantageous to improving flatness even with a large area, as well as testing semiconductor chips formed on a wafer in a lump.
摘要翻译：提供一种半导体测试装置的探针卡，包括从外部施加电信号的印刷电路板，具有与测试对象直接接触的多个探针的空间变压器以及将印刷电路板连接到测试对象的互连器空间变压器探头。空间变压器包括探针安装在其一侧的基片和将基片拼接在一起的组合件，以便形成具有基片的同一平面上的大面积基片。该探针卡有利于即使在大面积上提高平坦度，也有利于测试在一个晶片上形成的半导体芯片。

5. 发明申请

US20090128180A1 Cantilever-Type Probe and Method of Fabricating the Same 失效
标题翻译：悬臂式探头及其制造方法
公开(公告)号：US20090128180A1
公开(公告)日：2009-05-21
申请号：US11990275
申请日：2006-08-02
申请人： Ki-Joon Kim , Yong-Hwi Jo
发明人： Ki-Joon Kim , Yong-Hwi Jo
IPC分类号： G01R1/067 , G01R31/02 , C25F3/12
CPC分类号： G01R1/06727 , G01R3/00 , Y10T29/49004
摘要： Disclosed is a cantilever-type probe and methods of fabricating the same. The probe is comprised of a cantilever being longer lengthwise relative to the directions of width and height, and a tip extending from the bottom of the cantilever and formed at an end of the cantilever. A section of the tip parallel to the bottom of the cantilever is rectangular, having four sides slant to the lengthwise direction of the cantilever.
摘要翻译：公开了一种悬臂式探针及其制造方法。探头由相对于宽度和高度方向的纵向长度的悬臂组成，以及从悬臂的底部延伸并形成在悬臂的端部处的尖端。平行于悬臂底部的尖端的一部分是矩形的，具有沿着悬臂的长度方向倾斜的四个边。

6. 发明授权

US08117740B2 Method and apparatus for manufacturing a probe card 有权
标题翻译：用于制造探针卡的方法和装置
公开(公告)号：US08117740B2
公开(公告)日：2012-02-21
申请号：US11996413
申请日：2006-07-24
申请人： Ki-Joon Kim , Yong-Hwi Jo , Sung-Young Oh , Jun-Tae Hwang
发明人： Ki-Joon Kim , Yong-Hwi Jo , Sung-Young Oh , Jun-Tae Hwang
IPC分类号： G01R3/00 , B23P19/00
CPC分类号： G01R3/00 , G01R1/07342 , Y10T29/49133 , Y10T29/49137 , Y10T29/49147 , Y10T29/49222 , Y10T29/53004 , Y10T29/53039 , Y10T29/53061 , Y10T29/53174 , Y10T29/53191 , Y10T29/53265
摘要： In a method of manufacturing a probe card, a plurality of probe modules, including a sacrificial substrate and probes on the sacrificial substrate, is prepared. The probe modules are mutually aligned to form a probe module assembly having the aligned probe modules and a desired size. The probe module assembly is then attached to a probe substrate. Thus, the probe card having a large size may be manufactured.
摘要翻译：在制造探针卡的方法中，准备了包括牺牲衬底和牺牲衬底上的探针的多个探针模块。探针模块相互对准以形成具有对准的探针模块和所需尺寸的探针模块组件。然后将探针模块组件附接到探针衬底。因此，可以制造具有大尺寸的探针卡。

7. 发明授权

US07678587B2 Cantilever-type probe and method of fabricating the same 失效
标题翻译：悬臂式探头及其制造方法
公开(公告)号：US07678587B2
公开(公告)日：2010-03-16
申请号：US11990275
申请日：2006-08-02
申请人： Ki-Joon Kim , Yong-Hwi Jo
发明人： Ki-Joon Kim , Yong-Hwi Jo
IPC分类号： G01R31/26 , G01R31/28
CPC分类号： G01R1/06727 , G01R3/00 , Y10T29/49004
摘要： Disclosed is a cantilever-type probe and methods of fabricating the same. The probe is comprised of a cantilever being longer lengthwise relative to the directions of width and height, and a tip extending from the bottom of the cantilever and formed at an end of the cantilever. A section of the tip parallel to the bottom of the cantilever is rectangular, having four sides slant to the lengthwise direction of the cantilever.
摘要翻译：公开了一种悬臂式探针及其制造方法。探头由相对于宽度和高度方向的纵向长度的悬臂组成，以及从悬臂的底部延伸并形成在悬臂的端部处的尖端。平行于悬臂底部的尖端的一部分是矩形的，具有沿着悬臂的长度方向倾斜的四个边。

8. 发明申请

US20080290139A1 Method of Bonding Probes and Method of Manufacturing a Probe Card Using the Same 有权
标题翻译：探针接合方法及其制作方法
公开(公告)号：US20080290139A1
公开(公告)日：2008-11-27
申请号：US12097839
申请日：2007-03-19
申请人： Ki-Joon Kim , Yong-Hwi Jo
发明人： Ki-Joon Kim , Yong-Hwi Jo
IPC分类号： B23K31/02
CPC分类号： H05K3/3452 , G01R1/06727 , G01R3/00 , H05K3/341 , H05K3/4015 , H05K2201/2081 , H05K2203/0315
摘要： In a method of manufacturing bonding probes, bump layer patterns are formed on terminals of a multi-layered substrate. A first wetting layer pattern having a wettability with respect to a solder paste, and a non-wetting layer pattern having a non-wettability with respect to the solder paste are formed on the bump layer patterns. The solder paste is formed on the first wetting layer and the non-wetting layer pattern. The probes, which make contact with an object, are bonded to the solder paste. The solder paste on the non-wetting layer pattern reflows along a surface of the first wetting layer pattern to form an adhesive layer on the first wetting layer pattern. Thus, a sufficient amount of the solder paste, which is required for bonding the probes, may be provided to firmly bond the probes.
摘要翻译：在制造接合探针的方法中，在多层基板的端子上形成凸起层图案。在凸块层图案上形成有相对于焊膏具有润湿性的第一润湿层图案和相对于焊膏具有不润湿性的非润湿层图案。焊膏形成在第一润湿层和非润湿层图案上。与物体接触的探针与焊膏接合。非润湿层图案上的焊膏沿着第一润湿层图案的表面回流以在第一润湿层图案上形成粘合剂层。因此，可以提供足够量的用于粘合探针所需的焊膏，以牢固地结合探针。

9. 发明申请

US20080209720A1 Method and Apparatus for Manufacturing a Probe Card 有权
标题翻译：制造探针卡的方法和装置
公开(公告)号：US20080209720A1
公开(公告)日：2008-09-04
申请号：US11996413
申请日：2006-07-24
申请人： Ki-Joon Kim , Yong-Hwi Jo , Sung-Young Oh , Jun-Tae Hwang
发明人： Ki-Joon Kim , Yong-Hwi Jo , Sung-Young Oh , Jun-Tae Hwang
IPC分类号： H01R9/00 , B23P19/00 , H01R43/00
CPC分类号： G01R3/00 , G01R1/07342 , Y10T29/49133 , Y10T29/49137 , Y10T29/49147 , Y10T29/49222 , Y10T29/53004 , Y10T29/53039 , Y10T29/53061 , Y10T29/53174 , Y10T29/53191 , Y10T29/53265
摘要： In a method of manufacturing a probe card, a plurality of probe modules, including a sacrificial substrate and probes on the sacrificial substrate, is prepared. The probe modules are mutually aligned to form a probe module assembly having the aligned probe modules and a desired size. The probe module assembly is then attached to a probe substrate. Thus, the probe card having a large size may be manufactured.
摘要翻译：在制造探针卡的方法中，准备了包括牺牲衬底和牺牲衬底上的探针的多个探针模块。探针模块相互对准以形成具有对准的探针模块和所需尺寸的探针模块组件。然后将探针模块组件附接到探针衬底。因此，可以制造具有大尺寸的探针卡。

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