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    • 1. 发明授权
    • Method of preparing ceramic microspheres
    • 制备陶瓷微球的方法
    • US5071635A
    • 1991-12-10
    • US638135
    • 1991-01-04
    • Seiji YamanakaYasuyuki OgataKohji Shirota
    • Seiji YamanakaYasuyuki OgataKohji Shirota
    • C01B13/32C01G25/00C01G25/02
    • B82Y30/00C01B13/328C01G25/00C01G25/02C01P2002/34C01P2004/32C01P2004/52C01P2004/62C01P2004/64
    • A manufacturing method for ceramic microspheres including the steps of; mixing an oil which is immiscible with an aqueous solution of a water-soluble metallic compound and which has a boiling point higher than that of water in the aqueous solution; applying ultrasonic vibration to the mixed solution to form a water-in-oil type emulsion; heating the emulsion at a temperature less than a boiling point of water to evaporate free water from droplets in which the water-soluble metallic compound is dissolved and to disperse spherical particles of the water-soluble metallic compound in the oil phase; and thereafter heating the dispersed solution at a temperature higher than the temperature at which the water-soluble metallic compound is decomposed to form a metallic oxide but lower than the temperature at which grain growth in the metallic oxide starts, to evaporate and decompose the oil and to remove the oil therefrom, thereby obtaining the metallic oxide microspheres.
    • 一种陶瓷微球的制造方法,包括以下步骤: 将与水溶性金属化合物的水溶液不混溶并且在水溶液中沸点高于水的油混合; 对混合溶液施加超声波振动以形成油包水型乳液; 在低于水沸点的温度下加热乳液,从溶解水溶性金属化合物的液滴中蒸发游离水,并将水溶性金属化合物的球形颗粒分散在油相中; 然后在高于水溶性金属化合物分解温度的温度下加热分散溶液,形成金属氧化物,但低于金属氧化物开始晶粒生长的温度,从而蒸发并分解油和 从中除去油,从而得到金属氧化物微球。
    • 3. 发明授权
    • Polishing apparatus, polishing method and method of conditioning polishing pad
    • US06488573B1
    • 2002-12-03
    • US09651299
    • 2000-08-30
    • Tatsunori KobayashiHiroshi TanakaYasuyuki OgataKanji HosokiEturo MoritaSeiji Harada
    • Tatsunori KobayashiHiroshi TanakaYasuyuki OgataKanji HosokiEturo MoritaSeiji Harada
    • B24B2900
    • B24B53/017
    • A polishing apparatus has a plurality of polishing stations for polishing materials to be polished and a plurality of cleaning stations for cleaning the materials being polished, the polishing stations and the cleaning stations being alternately arranged; and an arm for holding the materials being polished and transferring the materials being polished between the polishing stations and the cleaning stations successively. The arm includes a polishing head for holding the material being polished. Each of the cleaning stations comprises a retainer stand on which the material being polished is placed, and a cleaning device for cleaning the material being polished in a state held by the polishing head, cleaning the material being polished in a state placed on the retainer stand, and cleaning the polishing head in a state where the material being polished is separated from the polishing head. A polishing method is used in a polishing apparatus having a plurality of polishing stations for polishing materials to be polished and an arm for holding the materials being polished and transferring the materials being polished between the polishing stations successively, each of the polishing stations including a platen having a polishing pad affixed to a surface of the platen, the arm including a plurality of polishing heads, each of which holds the material being polished and brings one surface of the material being polished into contact with the polishing pad, the material to be polished being polished by the polishing pad with relative movement between the polishing head and the platen. The polishing method comprises the steps of fitting a spindle for supporting the polishing head in a horizontally rotatable manner into each of fitting portions formed in each of a plurality of spindle housings provided in the arm; rotating the material being polished and the polishing pad relatively while keeping the material being polished and the polishing pad contacted with each other; and adjusting an axial position of the polishing head and changing a position of the polishing head relative to the arm by an adjusting mechanism provided on the spindle, whereby the materials to be polished are each polished while being adjusted in position thereof
    • 4. 发明授权
    • EMI filter with a ceramic material having a chemical reaction inhibiting
component
    • 具有具有化学反应抑制成分的陶瓷材料的EMI滤波器
    • US5592134A
    • 1997-01-07
    • US384536
    • 1995-02-08
    • Yasuyuki OgataYoshimasa HayashiYasushi Kojima
    • Yasuyuki OgataYoshimasa HayashiYasushi Kojima
    • C04B35/491H03H1/00H03H7/01G04B35/48
    • C04B35/491H03H7/0115H03H2001/0085
    • A composite ceramic material which is available by sintering a mixed powder of a dielectric material and a magnetic material, and contains a third component serving to inhibit a chemical reaction between the dielectric material and the magnetic material during sintering of the mixed powder and reduce the sintering temperature, and particularly, an EMI filter, a composite LC pan and a composite LC chip part made from such a composite ceramic material. The starting end and the terminal end of the inductor are exposed on the both end faces of the bare chip, and signal electrodes are provided at these ends. Ends of the conductors for grounding are exposed on the other both ends of the bare chip, and grounding electrodes are provided at these ends. The conductors for inductor are spirally connected in succession in the thickness direction of the bare chip via throughholes provided in the sheets within the bare chip to form an inductor. The conductors for grounding are adjacent to, and spaced apart by a distance sufficient for insulation from the conductors for inductor in a plane within the bare chip and piled up alternately with the conductors for inductor to form capacitors each between a conductor for grounding and a conductor for the inductor.
    • 一种复合陶瓷材料,其通过烧结电介质材料和磁性材料的混合粉末而得到,并且包含用于在混合粉末烧结期间抑制介电材料和磁性材料之间的化学反应的第三组分,并减少烧结 温度,特别是由这种复合陶瓷材料制成的EMI滤波器,复合LC盘和复合LC芯片部分。 电感器的起始端和终端暴露在裸芯片的两个端面上,并且在这些端部设置信号电极。 用于接地的导体的端部暴露在裸芯片的另一端,并且在这些端部设置接地电极。 用于电感器的导体通过设置在裸芯片内的片材中的通孔在裸芯片的厚度方向上连续螺旋地连接,以形成电感器。 用于接地的导体相邻并隔开一定距离,足以与裸芯片内的平面中的电感器绝缘绝缘,并与电感器的导体交替堆叠,以在接地导体和导体之间形成电容器 用于电感。