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1. 发明授权

US4500400A Counter flow device for electroplating apparatus 失效
标题翻译：电镀设备逆流装置
公开(公告)号：US4500400A
公开(公告)日：1985-02-19
申请号：US627394
申请日：1984-07-03
申请人： Akira Komoda , Yasuhiro Hirooka , Takahisa Yoshihara , Akira Matsuda
发明人： Akira Komoda , Yasuhiro Hirooka , Takahisa Yoshihara , Akira Matsuda
IPC分类号： C25D5/00 , C25D5/02 , C25D7/06 , C25D17/00
CPC分类号： C25D5/02 , C25D7/0635
摘要： A counter flow device for a plating apparatus including a rotary drum with its substantially half part immersed in a plating solution in a plating bath, about which a metallic strip to be plated passes in synchronism with rotation of said rotary drum and anodes spaced apart by radial gaps from the strip for causing electric current to flow between the strip and the anodes. According to the invention the counter flow device comprises a bottom nozzle arranged at a bottom of the bath and directing in a direction substantially opposite to an entering direction of the strip thereat and a top nozzle having a nozzle opening whose tip end is immersed in the proximity of a surface of the plating solution at a location where the strip leaves the plating solution, thereby ensuring uniform counter flows over entire gaps between the metallic strip and anodes to remarkably increase critical current density in plating and advantageously realize uniform plating.
摘要翻译：一种用于电镀设备的逆流装置，其包括旋转滚筒，其基本上半部分浸入电镀液中的镀液中，待镀的金属带与旋转滚筒和径向间隔开的阳极同步地通过来自带材的带隙使得电流在带材和阳极之间流动。根据本发明，逆流装置包括底部喷嘴，该底部喷嘴布置在浴缸的底部并且沿着与其的进入方向基本相反的方向引导，顶部喷嘴具有喷嘴开口，其顶端浸没在接近在剥离电镀液的位置上的电镀液的表面，从而确保在金属带和阳极之间的整个间隙均匀的逆流，显着提高电镀中的临界电流密度，有利地实现均匀电镀。

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