专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US11809262B2 Power adjustment circuit, adjustable power supply system and adjustable power supply method 有权
公开(公告)号：US11809262B2
公开(公告)日：2023-11-07
申请号：US17383636
申请日：2021-07-23
申请人： YOUNGTEK ELECTRONICS CORPORATION
发明人： Ching-Yung Tseng , Yong-Da Weng , Ping-Lung Wang
IPC分类号： G06F1/329 , G06F1/3296 , G06F1/3206 , G06F1/20
CPC分类号： G06F1/3296 , G06F1/206 , G06F1/3206
摘要： A power adjustment circuit, an adjustable power supply system and an adjustable power supply method are provided. The adjustable power supply system includes a power module, a device power supply, and a control circuit. The device power supply provides a supplied power to a device to be tested according to an operating voltage. The control circuit outputs an adjustment signal to the power module according to a power consumption status of the device to be tested. The power module generates the operating voltage according to the adjustment signal, and allows a first power dissipation generated by the device power supply to be less than a predetermined power.

2. 发明申请

US20210043532A1 CHIP PACKAGE MODULE WITH HEAT DISSIPATION FUNCTION AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：US20210043532A1
公开(公告)日：2021-02-11
申请号：US16897367
申请日：2020-06-10
申请人： YOUNGTEK ELECTRONICS CORPORATION
发明人： HSI-YING YUAN , TUNG-CHUAN WANG , CHUN-YUAN HOU , PING-LUNG WANG , Tzu-kuei Wen
IPC分类号： H01L23/367 , H01L23/31 , H01L23/538 , H01L23/00 , H01L21/683 , H01L21/48 , H01L21/56
摘要： A power chip package module and a manufacturing method thereof are provided. In the manufacturing method, a temporary carrier having an alignment pattern is provided, in which the temporary carrier includes a base and a peelable adhesive material disposed on the base. Thereafter, a circuit board having an accommodating space passing therethrough is disposed on the temporary carrier according to the alignment pattern. Furthermore, a chip is disposed in the accommodating space with an active surface thereof facing the temporary carrier according to the alignment pattern, in which the chip is fixed on the temporary carrier by the peelable adhesive material. The accommodating space is filled with a molding material to form an initial package structure. The initial package structure is separated from the temporary carrier, and then an electrically and thermally conductive layer is formed on a bottom surface of the chip and is in contact therewith.

3. 发明申请

US20220155845A1 POWER ADJUSTMENT CIRCUIT, ADJUSTABLE POWER SUPPLY SYSTEM AND ADJUSTABLE POWER SUPPLY METHOD 有权
公开(公告)号：US20220155845A1
公开(公告)日：2022-05-19
申请号：US17383636
申请日：2021-07-23
申请人： YOUNGTEK ELECTRONICS CORPORATION
发明人： Ching-Yung Tseng , Yong-Da Weng , PING-LUNG WANG
IPC分类号： G06F1/3296 , G06F1/20 , G06F1/3206
摘要： A power adjustment circuit, an adjustable power supply system and an adjustable power supply method are provided. The adjustable power supply system includes a power module, a device power supply, and a control circuit. The device power supply provides a supplied power to a device to be tested according to an operating voltage. The control circuit outputs an adjustment signal to the power module according to a power consumption status of the device to be tested. The power module generates the operating voltage according to the adjustment signal, and allows a first power dissipation generated by the device power supply to be less than a predetermined power.

4. 发明申请

US20220146575A1 MULTI-CHANNEL TIMING CALIBRATION DEVICE AND METHOD 有权
公开(公告)号：US20220146575A1
公开(公告)日：2022-05-12
申请号：US17460298
申请日：2021-08-29
申请人： YOUNGTEK ELECTRONICS CORPORATION
发明人： Ching-Yung Tseng , Yu-Chih Cheng , PING-LUNG WANG
IPC分类号： G01R31/319 , G01R31/3193
摘要： A multi-channel timing calibration device and a method applicable thereto are provided. The device includes: a plurality of channel inputs, at least one relay switch, at least one comparator, at least one first multiplexer, and a time measurement chip. The at least one comparator is connected to the at least one relay switch, and connected to a reference voltage or a digital analog converter. The at least one first multiplexer has different signals for different channel groups and outputs a signal of a designated channel. The time measurement chip calculates a timing difference of each of the channels of each of the channel inputs as a basis for delay of the timing signals.

5. 发明申请

US20140048457A1 PACKAGED CHIP DETECTION AND CLASSIFICATION DEVICE 审中-公开
标题翻译：包装芯片检测和分类设备
公开(公告)号：US20140048457A1
公开(公告)日：2014-02-20
申请号：US14057785
申请日：2013-10-18
申请人： YOUNGTEK ELECTRONICS CORPORATION
发明人： Bily WANG , Kuei-Pao CHEN , Hsin-Cheng CHEN
IPC分类号： B07C5/00
CPC分类号： B07C5/00 , B07C5/344 , G01R31/01 , G01R31/2893
摘要： A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.
摘要翻译：封装芯片检测和分类装置包括用于传输多个封装芯片的转动单元，封装芯片检测单元和封装芯片分类单元。旋转单元包括旋转转盘，形成在旋转转盘上的多个接收部分和分别形成在接收部分中的多个抽吸排气口。每个接收部分用于选择性地接收至少一个封装的芯片。封装芯片检测单元包括与用于检测每个封装芯片的旋转单元相邻的封装芯片检测模块。封装芯片分类单元包括与旋转单元相邻的封装芯片分类模块，用于对封装芯片进行分类。因此，封装芯片检测和分类装置可以通过匹配旋转单元，封装芯片检测单元和封装芯片分类单元来检测和分类无铅封装芯片。

6. 发明授权

US11531065B2 Multi-channel timing calibration device and method 有权
公开(公告)号：US11531065B2
公开(公告)日：2022-12-20
申请号：US17460298
申请日：2021-08-29
申请人： YOUNGTEK ELECTRONICS CORPORATION
发明人： Ching-Yung Tseng , Yu-Chih Cheng , Ping-Lung Wang
IPC分类号： G01R31/319 , G01R31/3193
摘要： A multi-channel timing calibration device and a method applicable thereto are provided. The device includes: a plurality of channel inputs, at least one relay switch, at least one comparator, at least one first multiplexer, and a time measurement chip. The at least one comparator is connected to the at least one relay switch, and connected to a reference voltage or a digital analog converter. The at least one first multiplexer has different signals for different channel groups and outputs a signal of a designated channel. The time measurement chip calculates a timing difference of each of the channels of each of the channel inputs as a basis for delay of the timing signals.

7. 发明申请

US20160339603A1 METHOD FOR SPLITTING CIRCLES 审中-公开
标题翻译：分割周期的方法
公开(公告)号：US20160339603A1
公开(公告)日：2016-11-24
申请号：US14803098
申请日：2015-07-19
申请人： YOUNGTEK ELECTRONICS CORPORATION
发明人： WEN-MING LIU , JUI-HUAI CHENG , CHAO-CHING WU , CHING-TSUNG CHANG
IPC分类号： B28D5/00 , H01L21/304 , H01L21/78
CPC分类号： B28D5/0005 , H01L21/304 , H01L21/78 , H01L22/12
摘要： The present invention relates to a method for splitting circles, and the method is mainly applied to a wafer of semiconductors. A plurality of splitting blades are disposed above the wafer, and conditions and steps are set for switching the plurality of splitting blades based on a safe distance value set at an outer edge of a wafer or a safe distance value set at an inner edge of a metal ring. Accordingly, the plurality of splitting blades are prevented from cutting an outer frame during splitting and failing to complete actions of splitting wafers. The method has an advantage of efficiency of enhancing a production capacity yield rate.
摘要翻译：本发明涉及一种分割圆的方法，该方法主要应用于半导体晶片。多个分裂刀片设置在晶片上方，并且设置条件和步骤，用于基于设置在晶片的外边缘处的安全距离值或设置在晶片的内边缘处的安全距离值来切换多个分割刀片金属环。因此，可防止多个分裂叶片在分裂期间切割外框，并且不能完成分裂晶片的动作。该方法具有提高生产能力产率的效率的优点。

8. 发明申请

US20230026488A1 METHOD FOR TRANSFERRING OBJECTS AND TRANSFER APPARATUS USING THE SAME 有权
公开(公告)号：US20230026488A1
公开(公告)日：2023-01-26
申请号：US17813056
申请日：2022-07-18
申请人： YOUNGTEK ELECTRONICS CORPORATION
发明人： Tsan-Hsiung LAI , Guang-Chen CHEN , Yang-Chieh CHEN , Wei-Liang CHOU , Ping-Lung WANG
IPC分类号： H01L21/67 , H01L21/683 , H01L21/68
摘要： A method for transferring objects and a transfer apparatus using the same are provided. The method includes the following steps: controlling, during a first period, the ejector at an ejecting working position to perform an ejecting process along with a first direction, to transfer the object from the first substrate to the second substrate; controlling, during a second period, the ejector to move to an ejecting standby position along with a second direction which is non-parallel to the first direction, to expose at least one of the object on the first substrate to a detection range of an image capturing device; detecting the position of the object in the detection range to obtain calibration information; and adjusting the position of the first substrate according to the calibration information.

9. 发明授权

US11145565B2 Method of fabricating a chip package module with improve heat dissipation effect 有权
公开(公告)号：US11145565B2
公开(公告)日：2021-10-12
申请号：US16897367
申请日：2020-06-10
申请人： YOUNGTEK ELECTRONICS CORPORATION
发明人： Hsi-Ying Yuan , Tung-Chuan Wang , Chun-Yuan Hou , Ping-Lung Wang , Tzu-kuei Wen
IPC分类号： H01L23/053 , H01L23/34 , H01L23/48 , H01L21/00 , H05K7/20 , H05K7/00 , H01L23/367 , H01L23/538 , H01L23/00 , H01L21/683 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/498
摘要： A power chip package module and a manufacturing method thereof are provided. In the manufacturing method, a temporary carrier having an alignment pattern is provided, in which the temporary carrier includes a base and a peelable adhesive material disposed on the base. Thereafter, a circuit board having an accommodating space passing therethrough is disposed on the temporary carrier according to the alignment pattern. Furthermore, a chip is disposed in the accommodating space with an active surface thereof facing the temporary carrier according to the alignment pattern, in which the chip is fixed on the temporary carrier by the peelable adhesive material. The accommodating space is filled with a molding material to form an initial package structure. The initial package structure is separated from the temporary carrier, and then an electrically and thermally conductive layer is formed on a bottom surface of the chip and is in contact therewith.

10. 发明授权

US09029725B2 Packaged chip detection and classification device 有权
标题翻译：封装芯片检测和分类装置
公开(公告)号：US09029725B2
公开(公告)日：2015-05-12
申请号：US14057785
申请日：2013-10-18
申请人： Youngtek Electronics Corporation
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen
IPC分类号： B07C5/344 , B07C5/00 , G01R31/01 , G01R31/28
CPC分类号： B07C5/00 , B07C5/344 , G01R31/01 , G01R31/2893
摘要： A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.
摘要翻译：封装芯片检测和分类装置包括用于传输多个封装芯片的转动单元，封装芯片检测单元和封装芯片分类单元。旋转单元包括旋转转盘，形成在旋转转盘上的多个接收部分和分别形成在接收部分中的多个抽吸排气口。每个接收部分用于选择性地接收至少一个封装的芯片。封装芯片检测单元包括与用于检测每个封装芯片的旋转单元相邻的封装芯片检测模块。封装芯片分类单元包括与旋转单元相邻的封装芯片分类模块，用于对封装芯片进行分类。因此，封装芯片检测和分类装置可以通过匹配旋转单元，封装芯片检测单元和封装芯片分类单元来检测和分类无铅封装芯片。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式