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    • 1. 发明授权
    • Electronic device with expansion card
    • 带扩展卡的电子设备
    • US08077459B2
    • 2011-12-13
    • US12721406
    • 2010-03-10
    • Ya-Ni ZhangWen-Hu LuYi-Lung ChouLi-Ping Chen
    • Ya-Ni ZhangWen-Hu LuYi-Lung ChouLi-Ping Chen
    • H05K7/20H05K7/00
    • G06F1/20G06F1/186
    • An electronic device includes a chassis. The chassis has a bottom wall and a rear wall, substantially perpendicular to the bottom wall. A motherboard is disposed on the bottom wall, and a riser card is perpendicularly connected to the motherboard. An expansion card is substantially parallel to the motherboard and coupled to the riser card. The expansion card has a first end and a second end, and the first end is secured to the rear wall. An airflow duct is located on the bottom wall of the chassis. A supporting bar protrudes from the airflow duct. A securing member is pivotably mounted to the airflow duct. The securing member includes a pressing plate. The second end of the expansion card is clamped between the pressing plate and the supporting bar of the airflow duct.
    • 电子设备包括底盘。 底盘具有基本垂直于底壁的底壁和后壁。 主板设置在底壁上,并且转接卡垂直连接到主板。 扩展卡基本上平行于母板并且耦合到转接卡。 扩展卡具有第一端和第二端,并且第一端固定到后壁。 气流管道位于底盘的底壁上。 支撑杆从气流导管突出。 固定构件可枢转地安装到气流管道。 固定构件包括压板。 扩展卡的第二端夹在压板和气流管的支撑杆之间。
    • 3. 发明申请
    • COMPUTER ENCLOSURE WITH INTERCHANGEABLE I/O PLATE
    • 具有可互换I / O板的计算机外壳
    • US20080151488A1
    • 2008-06-26
    • US11738530
    • 2007-04-23
    • WEN-TZU CHENLI-PING CHENCHIA-KANG WUYI-LUNG CHOU
    • WEN-TZU CHENLI-PING CHENCHIA-KANG WUYI-LUNG CHOU
    • G06F1/16
    • G06F1/183
    • A computer enclosure includes a rear plate (20) defining a through opening (22) therein, a mounting bracket (30) secured on the rear plate to cover the through opening of the rear plate, and an interchangeable I/O plate (50). The mounting bracket includes a top wall (32) perpendicular to the rear plate and, a front wall (36) parallel to the rear plate. The top wall forms an engaging tab (322) thereon. The front wall defines a through opening (362) therein corresponding to the through opening of the rear plate. The I/O plate is configured for covering the through opening of the front wall of the mounting bracket, and defines a securing hole (532) therein for receiving the engaging tab of the mounting bracket. A locking piece (57) is formed on the I/O plate and together with the I/O plate sandwiches an edge of the through opening of the mounting bracket therebetween.
    • 计算机外壳包括在其中限定通孔(22)的后板(20),固定在后板上以覆盖后板的通孔的安装支架(30)和可互换的I / O板(50) 。 安装支架包括垂直于后板的顶壁(32)和与后板平行的前壁(36)。 顶壁在其上形成接合突片(322)。 前壁在其中限定了与后板的通孔相对应的通孔(362)。 I / O板构造成用于覆盖安装支架的前壁的通孔,并在其中限定一个固定孔(532),用于容纳安装支架的接合片。 在I / O板上形成锁定件(57),并且与I / O板一起将安装支架的通孔的边缘夹在其间。
    • 6. 发明授权
    • Air conducting device
    • 导气装置
    • US08353746B2
    • 2013-01-15
    • US12463476
    • 2009-05-11
    • Ho-Chin TsaiLung-Sheng TsaiYi-Lung ChouLi-Ping Chen
    • Ho-Chin TsaiLung-Sheng TsaiYi-Lung ChouLi-Ping Chen
    • F24F7/00
    • G06F1/185G06F1/20
    • An air conducting device is used for removing heat from at least one component by directing airflow flowing along a first direction. The first direction is parallel to the at least one component. The air conducting device includes an airduct receiving the at least one component therein, and an air guiding member. The air guiding member is attached to an inner side of the airduct. The air guiding member includes a plurality of resilient legs. The legs extend diagonally relative to the first direction in a first state. The legs are able to accommodate the at least one component in a second state. Each leg in the first state is able to serve as a barrier to the airflow.
    • 空气传导装置用于通过引导沿着第一方向流动的气流来从至少一个部件移除热量。 第一方向平行于至少一个部件。 空气传导装置包括容纳其中的至少一个部件的空气传送部件和空气引导部件。 空气引导构件附接到该气体的内侧。 空气引导构件包括多个弹性腿。 腿在第一状态下相对于第一方向对角地延伸。 腿部能够在第二状态下容纳至少一个部件。 处于第一状态的每条腿都能够作为气流的屏障。
    • 7. 发明授权
    • Heat dissipating device
    • 散热装置
    • US08282345B2
    • 2012-10-09
    • US12482890
    • 2009-06-11
    • Chen-Lu FanLi-Ping ChenYi-Lung ChouHung-Chieh Chang
    • Chen-Lu FanLi-Ping ChenYi-Lung ChouHung-Chieh Chang
    • F04D29/66
    • H05K7/20172F16F1/3732G06F1/20
    • A heat dissipating device includes a receiving bracket adapted to be mounted in an electronic device enclosure and a fan module accommodated in the receiving bracket. The fan module includes a fan and a mounting bracket connected to the fan. The fan is secured to the mounting bracket via a plurality of fasteners. Each fastener has a securing head. A plurality of vibration absorbers is disposed between the fan and the fastener. Each vibration absorber includes two isolating walls. One of the isolating walls is sandwiched by the fan and the mounting bracket, and the other isolating wall is sandwiched by the mounting bracket and the fastener securing head, so as to isolate the mounting bracket, the fan, and the fastener.
    • 散热装置包括适于安装在电子设备外壳中的接收支架和容纳在接收支架中的风扇模块。 风扇模块包括风扇和连接到风扇的安装支架。 风扇通过多个紧固件固定到安装支架上。 每个紧固件都有一个固定头。 多个振动吸收器设置在风扇和紧固件之间。 每个振动吸收器包括两个隔离壁。 其中一个隔离壁被风扇和安装支架夹住,另一个隔离壁被安装支架和紧固件固定头夹在中间,以隔离安装支架,风扇和紧固件。
    • 8. 发明申请
    • ELECTRONIC DEVICE WITH EXPANSION CARD
    • 带扩展卡的电子设备
    • US20110103010A1
    • 2011-05-05
    • US12721406
    • 2010-03-10
    • Ya-Ni ZHANGWen-Hu LUYi-Lung CHOULi-Ping CHEN
    • Ya-Ni ZHANGWen-Hu LUYi-Lung CHOULi-Ping CHEN
    • G06F1/20
    • G06F1/20G06F1/186
    • An electronic device includes a chassis. The chassis has a bottom wall and a rear wall, substantially perpendicular to the bottom wall. A motherboard is disposed on the bottom wall, and a riser card is perpendicularly connected to the motherboard. An expansion card is substantially parallel to the motherboard and coupled to the riser card. The expansion card has a first end and a second end, and the first end is secured to the rear wall. An airflow duct is located on the bottom wall of the chassis. A supporting bar protrudes from the airflow duct. A securing member is pivotably mounted to the airflow duct. The securing member includes a pressing plate. The second end of the expansion card is clamped between the pressing plate and the supporting bar of the airflow duct.
    • 电子设备包括底盘。 底盘具有基本垂直于底壁的底壁和后壁。 主板设置在底壁上,并且转接卡垂直连接到主板。 扩展卡基本上平行于母板并且耦合到转接卡。 扩展卡具有第一端和第二端,并且第一端固定到后壁。 气流管道位于底盘的底壁上。 支撑杆从气流导管突出。 固定构件可枢转地安装到气流管道。 固定构件包括压板。 扩展卡的第二端夹在压板和气流管的支撑杆之间。
    • 10. 发明申请
    • HEAT DISSIPATING DEVICE
    • 热灭火装置
    • US20100172740A1
    • 2010-07-08
    • US12482890
    • 2009-06-11
    • Chen-Lu FanLi-Ping ChenYi-Lung ChouHung-Chieh Chang
    • Chen-Lu FanLi-Ping ChenYi-Lung ChouHung-Chieh Chang
    • F04D29/66F28F9/00
    • H05K7/20172F16F1/3732G06F1/20
    • A heat dissipating device includes a receiving bracket adapted to be mounted in an electronic device enclosure and a fan module accommodated in the receiving bracket. The fan module includes a fan and a mounting bracket connected to the fan. The fan is secured to the mounting bracket via a plurality of fasteners. Each fastener has a securing head. A plurality of vibration absorbers is disposed between the fan and the fastener. Each vibration absorber includes two isolating walls. One of the isolating walls is sandwiched by the fan and the mounting bracket, and the other isolating wall is sandwiched by the mounting bracket and the fastener securing head, so as to isolate the mounting bracket, the fan, and the fastener.
    • 散热装置包括适于安装在电子设备外壳中的接收支架和容纳在接收支架中的风扇模块。 风扇模块包括风扇和连接到风扇的安装支架。 风扇通过多个紧固件固定到安装支架上。 每个紧固件都有一个固定头。 多个振动吸收器设置在风扇和紧固件之间。 每个振动吸收器包括两个隔离壁。 其中一个隔离壁被风扇和安装支架夹住,另一个隔离壁被安装支架和紧固件固定头夹在中间,以隔离安装支架,风扇和紧固件。