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    • 7. 发明申请
    • Curable composition and use thereof
    • 可固化组合物及其用途
    • US20050209410A1
    • 2005-09-22
    • US11053799
    • 2005-02-09
    • Karl BrommXun TangBarry Weinstein
    • Karl BrommXun TangBarry Weinstein
    • B05D7/24C08F8/14C08K5/05C08L101/08
    • C08F8/14C08F220/06C08F20/00
    • A curable composition including a compound, containing as polymerized units, carboxylic acid groups, anhydride groups, or salts thereof, and a styrene, α-methyl styrene, butyl (meth)acrylate, methyl methacrylate, ethyl (meth)acrylate, mono-alkyl (meth)acrylamide, or di-alkyl (meth)acrylamide ethylenically unsaturated monomer having a solubility in water of less than 2 g/100 g water at 25° C.; wherein the compound is either admixed with or copolymerized with a hydroxyl group-containing compound; the curable composition contains from about 3 to about 25 weight percent, based on the total weight of monomers in the curable composition, of the ethylenically unsaturated monomer; the ratio of the number of equivalents of the carboxylic acid groups, anhydride groups, or salts thereof to the number of equivalents of the hydroxyl groups is from about 1/0.01 to about 1/3, is provided. Also provided is a method for treating a substrate with the curable composition, articles prepared by the method of the invention.
    • 包含作为聚合单元的羧酸基团,酸酐基或其盐以及苯乙烯,α-甲基苯乙烯,(甲基)丙烯酸丁酯,甲基丙烯酸甲酯,(甲基)丙烯酸乙酯, (甲基)丙烯酰胺或在25℃下在水中的溶解度小于2g / 100g的(甲基)丙烯酰胺烯键式不饱和单体。 其中所述化合物与含羟基的化合物混合或共聚; 可固化组合物含有约3至约25重量%,基于可固化组合物中单体的总重量;烯属不饱和单体; 羧酸基,酸酐基或其盐的当量数与羟基的当量数之比为约1 / 0.01至约1/3。 还提供了用可固化组合物处理基材的方法,通过本发明的方法制备的制品。
    • 8. 发明授权
    • Coating composition
    • 涂料组成
    • US06797328B2
    • 2004-09-28
    • US10349906
    • 2003-01-23
    • Albert Benner BrownRalph Craig EvenDennis Paul LorahAlvin Michael MauriceRobert Victor SloneXun Tang
    • Albert Benner BrownRalph Craig EvenDennis Paul LorahAlvin Michael MauriceRobert Victor SloneXun Tang
    • B05D300
    • C08F4/34C08F20/12
    • An aqueous composition suitable for use, when dry, as an improved coating is provided including an aqueous emulsion polymer, the polymer having a glass transition temperature (Tg) from greater than 20° C. to 80° C., formed by the free radical polymerization of at least one ethylenically unsaturated nonionic acrylic monomer and 0-7.5%, by weight based on the total weight of the polymer, ethylenically unsaturated acid monomer in the presence of 0.01-1.0%, by weight based on the total weight of the polymer, t-alkyl hydroperoxide, t-alkyl peroxide, or t-alkyl perester wherein the t-alkyl group includes at least 5 Carbon atoms and, optionally, at least one other oxidant. A method of preparing the emulsion polymer, a method for providing a coated substrate wherein the coating contains the emulsion polymer having a Tg from −20° C. to 80° C., and a method for improving the scrub resistance of a coating by including the emulsion polymer having a Tg from −20° C. to 80° C. are also provided.
    • 提供适用于干燥时作为改进涂层的水性组合物,包括水性乳液聚合物,所述聚合物的玻璃化转变温度(Tg)大于20℃至80℃,由自由基形成 至少一种烯键式不饱和非离子丙烯酸单体的聚合,基于聚合物的总重量,基于聚合物总重量的0.01-1.0%的烯键式不饱和酸单体的总重量为0-7.5% 叔烷基过氧化氢,叔烷基过氧化物或叔烷基过酸酯,其中叔烷基包括至少5个碳原子和任选的至少一种其它氧化剂。 一种制备乳液聚合物的方法,一种提供涂覆基质的方法,其中该涂层含有-20℃至80℃的Tg的乳液聚合物,以及一种通过包括以下步骤改善涂层的耐擦洗性的方法: 还提供了具有-20℃至80℃的Tg的乳液聚合物。
    • 9. 发明授权
    • Polymeric binder
    • 聚合物粘合剂
    • US5599890A
    • 1997-02-04
    • US210844
    • 1994-03-21
    • Xun Tang
    • Xun Tang
    • C04B37/00C04B35/634C04B35/638C08L33/04C08L33/14C09J133/10C08F224/00C08F214/00C08F218/04C08F220/10C08F220/44C08F226/06
    • C04B35/63404C04B35/634C04B35/63424C04B35/638
    • A polymeric binder for ceramic materials is provided. The polymeric binder has a temperature range for pyrolysis which is broader than that for polymeric binders conventionally used in ceramic materials. The broader pyrolysis range provides for gradual removal of the binder when a ceramic part containing the binder is heated. Gradual removal of the binder minimizes the formation of voids and cracking in the ceramic part. Voids or cracking can lead to defects in the part, and destruction of the part may occur during removal if a polymeric binder used in the part is rapidly decomposed into gases. Therefore the polymeric binder of the present invention provides for ceramic parts with fewer defects and less chance of destruction than occurs with polymeric binders conventionally used in ceramic parts.
    • 提供了用于陶瓷材料的聚合物粘合剂。 聚合物粘合剂具有比常规用于陶瓷材料的聚合物粘合剂宽的热解温度范围。 当加热含有粘合剂的陶瓷部件时,较宽的热解范围提供粘合剂的逐渐去除。 逐渐去除粘合剂使陶瓷部件中空隙的形成和裂纹最小化。 如果部件中使用的聚合物粘合剂被快速分解成气体,则空隙或裂纹会导致部件缺陷,并且在拆卸过程中会发生零件的破坏。 因此,本发明的聚合物粘合剂提供陶瓷部件,其具有比常规用于陶瓷部件的聚合物粘合剂更少的缺陷和更少的破坏机会。