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    • 1. 发明授权
    • Power semiconductor field effect transistor structure with charge trapping material in the gate dielectric
    • 功率半导体场效应晶体管结构,在栅极电介质中具有电荷捕获材料
    • US08981460B2
    • 2015-03-17
    • US13883753
    • 2011-12-20
    • Johnny Kin On SinXianda Zhou
    • Johnny Kin On SinXianda Zhou
    • H01L29/792
    • H01L29/7926H01L29/408H01L29/513H01L29/518H01L29/66333H01L29/66712H01L29/66833H01L29/7395H01L29/7802H01L29/792
    • The subject disclosure presents power semiconductor devices, and methods for manufacture thereof, with improved ruggedness and. In an aspect, the power semiconductor devices are power field effect transistors (FETs) having enhanced suppression of the activation of the parasitic bipolar junction transistor (BJT) and a normal threshold value. The devices comprise a doped source (14) of a first conductivity type, a doped body (15) of a second conductivity type, a source electrode (20) short-connecting the doped body and the doped source, a doped drift region (10) of the first conductivity type, a first layer (30) of a gate dielectric region (36) covering the surface of the doped drift region (10), and forming channel from the doped source (14) to the doped drift region (10), a second layer (31) of the gate dielectric region (36) over the first layer (30), a third layer (32) of the gate dielectric region (36) over the second layer (31), and a gate electrode (21) over the third layer (32).
    • 本发明公开了功率半导体器件及其制造方法,具有改进的耐用性和。 一方面,功率半导体器件是具有增强的对寄生双极结型晶体管(BJT)的激活抑制和正常阈值的功率场效应晶体管(FET)。 这些器件包括第一导电类型的掺杂源极(14),第二导电类型的掺杂体(15),短路连接掺杂体的源极(20)和掺杂源,掺杂漂移区(10) ),覆盖掺杂漂移区(10)的表面的栅介质区(36)的第一层(30),以及从掺杂源(14)到掺杂漂移区(10)的沟道 ),位于第一层(30)上方的栅极电介质区域(36)的第二层(31),位于第二层(31)上方的栅极电介质区域(36)的第三层(32) (21)在第三层(32)之上。
    • 2. 发明申请
    • POWER SEMICONDUCTOR FIELD EFFECT TRANSISTOR STRUCTURE WITH CHARGE TRAPPING MATERIAL IN THE GATE DIELECTRIC
    • 功率半导体场效应晶体管结构与栅极电介质中的电荷捕获材料
    • US20130256747A1
    • 2013-10-03
    • US13883753
    • 2011-12-20
    • Johnny Kin On SinXianda Zhou
    • Johnny Kin On SinXianda Zhou
    • H01L29/792H01L29/66H01L29/739
    • H01L29/7926H01L29/408H01L29/513H01L29/518H01L29/66333H01L29/66712H01L29/66833H01L29/7395H01L29/7802H01L29/792
    • The subject disclosure presents power semiconductor devices, and methods for manufacture thereof, with improved ruggedness and. In an aspect, the power semiconductor devices are power field effect transistors (FETs) having enhanced suppression of the activation of the parasitic bipolar junction transistor (BJT) and a normal threshold value. The devices comprise a doped source (14) of a first conductivity type, a doped body (15) of a second conductivity type, a source electrode (20) short-connecting the doped body and the doped source, a doped drift region (10) of the first conductivity type, a first layer (30) of a gate dielectric region (36) covering the surface of the doped drift region (10), and forming channel from the doped source (14) to the doped drift region (10), a second layer (31) of the gate dielectric region (36) over the first layer (30), a third layer (32) of the gate dielectric region (36) over the second layer (31), and a gate electrode (21) over the third layer (32).
    • 本发明公开了功率半导体器件及其制造方法,具有改进的耐用性和。 一方面,功率半导体器件是具有增强的对寄生双极结型晶体管(BJT)的激活抑制和正常阈值的功率场效应晶体管(FET)。 这些器件包括第一导电类型的掺杂源极(14),第二导电类型的掺杂体(15),短路连接掺杂体的源极(20)和掺杂源,掺杂漂移区(10) ),覆盖掺杂漂移区(10)的表面的栅介质区(36)的第一层(30),以及从掺杂源(14)到掺杂漂移区(10)的沟道 ),位于第一层(30)上方的栅极电介质区域(36)的第二层(31),位于第二层(31)上方的栅极电介质区域(36)的第三层(32) (21)在第三层(32)之上。