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1. 发明授权

US06716767B2 Contact planarization materials that generate no volatile byproducts or residue during curing 有权
标题翻译：接触在固化期间不产生挥发性副产物或残留物的平面化材料
公开(公告)号：US06716767B2
公开(公告)日：2004-04-06
申请号：US10282542
申请日：2002-10-28
申请人： Wu-Sheng Shih , James E. Lamb, III , Mark Daffron
发明人： Wu-Sheng Shih , James E. Lamb, III , Mark Daffron
IPC分类号： H01L2131
CPC分类号： B81C1/0046 , B81C1/00611 , B81C2201/0119 , C08G59/68 , C08L63/00 , H01L21/02118 , H01L21/02282 , H01L21/02348 , H01L21/31051 , H01L21/312
摘要： The present invention is directed towards planarization materials that produce little or no volatile byproducts during the hardening process when used in contact planarization processes. The materials can be hardened by photo-irradiation or by heat during the planarization process, and they include one or more types of monomers, oligomers, or mixtures thereof, an optional cross-linker, and an optional organic reactive solvents. The solvent, if used, is chemically reacted with the monomers or oligomers and thus becomes part of the polymer matrix during the curing process. These materials can be used for damascene, dual damascene, bi-layer, and multi-layer applications, microelectromechanical system (MEMS), packaging, optical devices, photonics, optoelectronics, microelectronics, and sensor devices fabrication.
摘要翻译：本发明涉及在用于接触平面化处理时在硬化过程中产生很少或不产生挥发性副产物的平面化材料。这些材料可以在平坦化过程中通过光照射或加热来硬化，并且它们包括一种或多种类型的单体，低聚物或其混合物，任选的交联剂和任选的有机反应性溶剂。溶剂（如果使用的话）与单体或低聚物发生化学反应，因此在固化过程中成为聚合物基质的一部分。这些材料可用于镶嵌，双镶嵌，双层和多层应用，微机电系统（MEMS），封装，光学器件，光子学，光电子学，微电子学和传感器器件制造。

2. 发明申请

US20050167894A1 Patterned structure reproduction using nonsticking mold 审中-公开
标题翻译：图案化结构复制使用非标准模具
公开(公告)号：US20050167894A1
公开(公告)日：2005-08-04
申请号：US11063382
申请日：2005-02-23
申请人： Wu-sheng Shih , James Lamb , Mark Daffron
发明人： Wu-sheng Shih , James Lamb , Mark Daffron
IPC分类号： B29C33/38 , B29C33/62 , B81C1/00 , G03F7/00 , B29C35/08
CPC分类号： B82Y10/00 , B29C33/3857 , B29C33/62 , B81C99/009 , B82Y40/00 , G03F7/0002
摘要： Novel nonstick molds and methods of forming and using such molds are provided. The molds are formed of a nonstick material such as those selected from the group consisting of fluoropolymers, fluorinated siloxane polymers, silicones, and mixtures thereof. The nonstick mold is imprinted with a negative image of a master mold, where the master mold is designed to have a topography pattern corresponding to that desired on the surface of a microelectronic substrate. The nonstick mold is then used to transfer the pattern or image to a flowable film on the substrate surface. This film is subsequently cured or hardened, resulting in the desired pattern ready for further processing.
摘要翻译：提供了新型不粘模具以及形成和使用这种模具的方法。模具由不粘材料形成，例如选自含氟聚合物，氟化硅氧烷聚合物，硅酮及其混合物的那些。不粘模具印有主模具的负像，其中主模具设计成具有对应于微电子基板表面上所需的形状图案。然后使用不粘模具将图案或图像转印到基底表面上的可流动的薄膜上。随后该膜被固化或硬化，导致所需的图案准备进一步加工。

3. 发明授权

US07455955B2 Planarization method for multi-layer lithography processing 有权
标题翻译：多层光刻处理的平面化方法
公开(公告)号：US07455955B2
公开(公告)日：2008-11-25
申请号：US10373897
申请日：2003-02-24
申请人： Wu-Sheng Shih , James E. Lamb, III , Juliet Ann Minzey Snook , Mark G. Daffron
发明人： Wu-Sheng Shih , James E. Lamb, III , Juliet Ann Minzey Snook , Mark G. Daffron
IPC分类号： G03F7/26
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G03F7/094 , G03F7/095 , H01L21/3081 , H01L21/3086 , H01L21/31053 , H01L21/31144 , Y10T428/24802 , Y10T428/24851
摘要： The present invention is directed towards contact planarization methods that can be used to planarize substrate surfaces having a wide range of topographic feature densities for lithography applications. These processes use thermally curable, photo-curable, or thermoplastic materials to provide globally planarized surfaces over topographic substrate surfaces for lithography applications. Additional coating(s) with global planarity and uniform thickness can be obtained on the planarized surfaces. These inventive methods can be utilized with single-layer, bilayer, or multi-layer processing involving bottom anti-reflective coatings, photoresists, hardmasks, and other organic and inorganic polymers in an appropriate coating sequence as required by the particular application. More specifically, this invention produces globally planar surfaces for use in dual damascene and bilayer processes with greatly improved photolithography process latitude. The invention further provides globally planar surfaces to transfer patterns using imprint lithography, nano-imprint lithography, hot-embossing lithography and stamping pattern transfer techniques.
摘要翻译：本发明涉及可用于平面化具有用于光刻应用的宽范围的地形特征密度的衬底表面的接触平面化方法。这些方法使用可热固化，可光固化或热塑性材料，以在光刻应用的地形衬底表面上提供全局平面化的表面。可以在平坦化表面上获得具有全局平面度和均匀厚度的附加涂层。这些本发明的方法可以用于单层，双层或多层加工，其涉及底部抗反射涂层，光致抗蚀剂，硬掩模和其它有机和无机聚合物，按照特定应用所要求的合适的涂层顺序。更具体地，本发明产生用于双镶嵌和双层工艺的全局平面表面，其具有极大改善的光刻工艺纬度。本发明还提供了使用压印光刻，纳米压印光刻，热压印光刻和冲压图案转印技术来传输图案的全局平面表面。

4. 发明授权

US07132219B2 Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition 有权
公开(公告)号：US07132219B2
公开(公告)日：2006-11-07
申请号：US10411046
申请日：2003-04-09
申请人： Ram W. Sabnis , Wu-Sheng Shih , Douglas J. Guerrero
发明人： Ram W. Sabnis , Wu-Sheng Shih , Douglas J. Guerrero
IPC分类号： G03C5/00 , H01L21/31 , H01L21/469 , G03F7/11 , B05D3/02
CPC分类号： G02B1/11 , G02B1/111 , G03F7/091
摘要： An improved method for applying polymeric antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise plasma enhanced chemical vapor depositing (PECVD) a polymer on the substrate surfaces. The most preferred starting monomers are 4-fluorostyrene, 2,3,4,5,6-pentafluorostyrene, and allylpentafluorobenzene. The PECVD processes comprise subjecting the monomers to sufficient electric current and pressure so as to cause the monomers to sublime to form a vapor which is then changed to the plasma state by application of an electric current. The vaporized monomers are subsequently polymerized onto a substrate surface in a deposition chamber. The inventive methods are useful for providing highly conformal antireflective coatings on large surface substrates having super submicron (0.25 μm or smaller) features. The process provides a much faster deposition rate than conventional chemical vapor deposition (CVD) methods, is environmentally friendly, and is economical.

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