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    • 6. 发明授权
    • Semiconductor wafer of single crystalline silicon and process for its manufacture
    • 单晶硅半导体晶圆及其制造工艺
    • US07868325B2
    • 2011-01-11
    • US12372783
    • 2009-02-18
    • Wilfried von Ammon
    • Wilfried von Ammon
    • H01L29/04
    • C30B29/06C30B15/04
    • Semiconductor wafer of monocrystalline silicon contain fluorine, the fluorine concentration being 1·1010 to 1·1016 atoms/cm3, and is free of agglomerated intrinsic point defects whose diameter is greater than or equal to a critical diameter. The semiconductor wafers are produced by providing a melt of silicon which is doped with fluorine, and crystallizing the melt to form a single crystal which contains fluorine within the range of 1·1010 to 1·1016 atoms/cm3, at a growth rate at which agglomerated intrinsic point defects having a critical diameter or larger would arise if fluorine were not present or present in too small an amount, and separating semiconductor wafers from the single crystal.
    • 单晶硅的半导体晶片含氟,氟浓度为1×10 10至1×10 16原子/ cm 3,并且不存在其直径大于或等于临界直径的附聚固有点缺陷。 半导体晶片通过提供掺杂有氟的硅熔体,并使熔体结晶以形成含氟量在1×10 10至1×10 16原子/ cm 3范围内的单晶,其生长速率为 如果氟不存在或以太小的量存在,并且将半导体晶片与单晶分离,则会产生具有临界直径或更大的附聚固有点缺陷。