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1. 发明申请

US20090268147A1 CHIP HAVING A DRIVING INTEGRATED CIRCUIT AND LIQUID CRYSTAL DISPLAY HAVING THE SAME 有权
标题翻译：具有驱动集成电路的芯片和具有该电路的液晶显示器
公开(公告)号：US20090268147A1
公开(公告)日：2009-10-29
申请号：US12194546
申请日：2008-08-20
申请人： Pao-Yun Tang , Wei-Hao Sun
发明人： Pao-Yun Tang , Wei-Hao Sun
IPC分类号： G02F1/1345 , H01L23/488
CPC分类号： H01L21/027 , G02F1/13452 , H01L24/17 , H01L2224/13099 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15788 , H01L2924/00
摘要： A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.
摘要翻译：具有适用于玻璃技术芯片的凸块布局的芯片和驱动IC包括多个第一凸块和用于电连接到显示器的玻璃基板的多个第二凸块。第一和第二凸起分别设置在芯片的表面和芯片的两个相对的长边附近。第一凸块的总接触面积与第二凸块的总接触面积的比率在0.8和1.2之间。因此，可以在整个芯片上均匀地施加施加在用于连接的显示器的芯片和玻璃基板上的压力，从而提高连接的稳定性。

2. 发明授权

US08491986B2 Panel module and manufacturing method thereof 有权
标题翻译：面板组件及其制造方法
公开(公告)号：US08491986B2
公开(公告)日：2013-07-23
申请号：US13115316
申请日：2011-05-25
申请人： Pao-Yun Tang , Wei-Hao Sun
发明人： Pao-Yun Tang , Wei-Hao Sun
IPC分类号： B32B3/00 , B32B27/14 , B32B7/14
CPC分类号： G06F3/044 , G06F2203/04103 , H03K2217/96076 , Y10T156/10 , Y10T428/24562 , Y10T428/24802 , Y10T428/24826 , Y10T428/24851 , Y10T428/24942 , Y10T428/31504
摘要： A panel module is provided, including a first substrate, a second substrate, a first optical glue, and a second optical glue. The first and second optical glues are disposed between the first and second substrates, wherein the first optical glue protrudes from the first substrate, and the second optical glue adheres the first substrate to the second substrate. Specifically, the viscosity of the second optical glue is smaller than the first optical glue before solidification.
摘要翻译：提供一种面板模块，包括第一基板，第二基板，第一光学胶和第二光学胶。第一和第二光学胶水设置在第一和第二基底之间，其中第一光学胶从第一基底突出，第二光学胶将第一基底粘附到第二基底。具体地说，第二光学胶的粘度比固化前的第一光学胶小。

3. 发明申请

US20110134618A1 CONNECTION STRUCTURE FOR CHIP-ON-GLASS DRIVER IC AND CONNECTION METHOD THEREFOR 审中-公开
标题翻译：芯片玻璃驱动IC的连接结构及其连接方法
公开(公告)号：US20110134618A1
公开(公告)日：2011-06-09
申请号：US12762328
申请日：2010-04-17
申请人： Wei-hao Sun , Pao-yun Tang
发明人： Wei-hao Sun , Pao-yun Tang
IPC分类号： H05K7/12
CPC分类号： H01L23/16 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/02166 , H01L2224/0401 , H01L2224/10126 , H01L2224/13007 , H01L2224/13011 , H01L2224/13019 , H01L2224/13076 , H01L2224/13099 , H01L2224/13144 , H01L2224/1319 , H01L2224/13565 , H01L2224/26125 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2224/8385 , H01L2224/83851 , H01L2224/9211 , H01L2924/00013 , H01L2924/01006 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/15788 , H01L2924/351 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A connection structure for a chip-on-glass (COG) driver IC and a connection method therefor are provided. The connection structure includes a driver IC having a surface provided with a plurality of polymeric bumps and a plurality of conductive bumps, and the height of the polymeric bumps in relation to the surface is smaller than that of the conductive bumps. When the driver IC is bonded to a glass substrate via an adhesive film by thermal compression bonding, the polymeric bumps are embedded into the adhesive film, and a gap is defined between the polymeric bumps and the glass substrate. Thus, the polymeric bumps can increase the contact area between the driver IC and the adhesive film, and enhance the connection reliability between the conductive bumps and pads of the glass substrate.
摘要翻译：提供了一种用于玻璃上芯片（COG）驱动器IC的连接结构及其连接方法。连接结构包括具有设置有多个聚合物凸块和多个导电凸块的表面的驱动器IC，并且聚合物凸块相对于表面的高度小于导电凸块的高度。当通过热压接将驱动器IC通过粘合剂膜结合到玻璃基板上时，聚合物凸块嵌入粘合剂膜中，并且在聚合物凸块和玻璃基板之间限定间隙。因此，聚合物凸起可以增加驱动器IC和粘合剂膜之间的接触面积，并且增强玻璃基板的导电凸块和焊盘之间的连接可靠性。

4. 发明申请

US20100052160A1 BUMP STRUCTURE AND METHOD FOR FABRICATING THE SAME 审中-公开
标题翻译： BUMP结构及其制作方法
公开(公告)号：US20100052160A1
公开(公告)日：2010-03-04
申请号：US12255416
申请日：2008-10-21
申请人： Wei-Hao SUN , Pao-Yun Tang
发明人： Wei-Hao SUN , Pao-Yun Tang
IPC分类号： H01L23/52 , H01L21/44
CPC分类号： G06Q30/00 , G06Q30/0601 , H01L24/11 , H01L2924/14 , H01L2924/15788 , H01L2924/00
摘要： The present invention discloses a bump structure and a method for fabricating the same. The bump structure of the present invention comprises a semiconductor substrate having a plurality of connection pads; a passivation layer covering the substrate and having openings each corresponding to one connection pad, wherein the openings reveal a portion of each connection pad to form a plurality of electrical-connection areas; an elastic layer formed on the passivation layer; and a plurality of bumps each formed corresponding to one electric-connection area and extending to the elastic layer, whereby the elasticity and deformability of the bumps is enhanced. The present invention uses a larger-texture (≧20 μm) patterning process to fabricate an appropriate patterned elastic layer (having parallel lines, strips, or saw teeth) to enhance the elasticity and deformability of the bumps, whereby the bump structure of the present invention can apply to a fine-pitch IC.
摘要翻译：本发明公开了一种凸块结构及其制造方法。本发明的凸点结构包括具有多个连接焊盘的半导体衬底; 覆盖所述基板并具有各自对应于一个连接焊盘的开口的钝化层，其中所述开口露出每个连接焊盘的一部分以形成多个电连接区域; 形成在钝化层上的弹性层; 以及多个凸起，每个凸起对应于一个电连接区域形成并延伸到弹性层，从而提高了凸块的弹性和变形能力。本发明使用较大纹理（≥20μm）的图案化工艺来制造适当的图案化弹性层（具有平行的线条，条带或锯齿）以增强凸块的弹性和变形能力，由此本发明的凸起结构本发明可应用于精细间距IC。

5. 发明申请

US20130093697A1 TOUCH PANEL DISPLAY AND ASSEMBLY PROCESS THEREOF 审中-公开
标题翻译：触控面板显示及其组装过程
公开(公告)号：US20130093697A1
公开(公告)日：2013-04-18
申请号：US13456673
申请日：2012-04-26
申请人： Wei-Hao SUN
发明人： Wei-Hao SUN
IPC分类号： G06F3/041 , B32B37/12
CPC分类号： G06F3/044 , G06F3/0412
摘要： A touch panel display is provided. The display includes a display module and a transparent top plate disposed above the display module. The transparent top plate has a touch surface opposite to the display module. A spacer is disposed between the display module and the transparent top plate to form a first cavity therebetween. The spacer includes a first adhesive film attached to the display module, a second adhesive film attached to the transparent top plate and a hard transparent layer sandwiched between the first and second adhesive films. An assembly process and a touch sensing module thereof are also disclosed.
摘要翻译：提供触摸屏显示。显示器包括显示模块和布置在显示模块上方的透明顶板。透明顶板具有与显示模块相对的触摸表面。间隔件设置在显示模块和透明顶板之间，以在它们之间形成第一腔。间隔物包括附着到显示模块的第一粘合膜，附着到透明顶板的第二粘合膜和夹在第一和第二粘合膜之间的硬透明层。还公开了组装过程及其触摸感测模块。

6. 发明申请

US20120025372A1 CHIP HAVING A DRIVING INTEGRATED CIRCUIT 有权
标题翻译：具有驱动集成电路的芯片
公开(公告)号：US20120025372A1
公开(公告)日：2012-02-02
申请号：US13253076
申请日：2011-10-05
申请人： Pao-Yun TANG , Wei-Hao SUN
发明人： Pao-Yun TANG , Wei-Hao SUN
IPC分类号： H01L23/498
CPC分类号： H01L21/027 , G02F1/13452 , H01L24/17 , H01L2224/13099 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15788 , H01L2924/00
摘要： A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.
摘要翻译：具有适用于玻璃技术芯片的凸块布局的芯片和驱动IC包括多个第一凸块和用于电连接到显示器的玻璃基板的多个第二凸块。第一和第二凸起分别设置在芯片的表面和芯片的两个相对的长边附近。第一凸块的总接触面积与第二凸块的总接触面积的比率在0.8和1.2之间。因此，可以在整个芯片上均匀地施加施加在用于连接的显示器的芯片和玻璃基板上的压力，从而提高连接的稳定性。

7. 发明授权

US08063497B2 Liquid crystal display 有权
标题翻译：液晶显示器
公开(公告)号：US08063497B2
公开(公告)日：2011-11-22
申请号：US12194546
申请日：2008-08-20
申请人： Pao-Yun Tang , Wei-Hao Sun
发明人： Pao-Yun Tang , Wei-Hao Sun
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L21/027 , G02F1/13452 , H01L24/17 , H01L2224/13099 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15788 , H01L2924/00
摘要： A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.
摘要翻译：具有适用于玻璃技术芯片的凸块布局的芯片和驱动IC包括多个第一凸块和用于电连接到显示器的玻璃基板的多个第二凸块。第一和第二凸起分别设置在芯片的表面和芯片的两个相对的长边附近。第一凸块的总接触面积与第二凸块的总接触面积的比率在0.8和1.2之间。因此，可以在整个芯片上均匀地施加施加在用于连接的显示器的芯片和玻璃基板上的压力，从而提高连接的稳定性。

8. 发明授权

US08841781B2 Chip having a driving integrated circuit 有权
标题翻译：具有驱动集成电路的芯片
公开(公告)号：US08841781B2
公开(公告)日：2014-09-23
申请号：US13253076
申请日：2011-10-05
申请人： Pao-Yun Tang , Wei-Hao Sun
发明人： Pao-Yun Tang , Wei-Hao Sun
IPC分类号： H01L29/40 , H01L23/52 , H01L23/48 , G02F1/1345
CPC分类号： H01L21/027 , G02F1/13452 , H01L24/17 , H01L2224/13099 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15788 , H01L2924/00
摘要： A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.
摘要翻译：具有适用于玻璃技术芯片的凸块布局的芯片和驱动IC包括多个第一凸块和用于电连接到显示器的玻璃基板的多个第二凸块。第一和第二凸起分别设置在芯片的表面和芯片的两个相对的长边附近。第一凸块的总接触面积与第二凸块的总接触面积的比率在0.8和1.2之间。因此，可以在整个芯片上均匀地施加施加在用于连接的显示器的芯片和玻璃基板上的压力，从而提高连接的稳定性。

9. 发明申请

US20120301678A1 PANEL MODULE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：面板模块及其制造方法
公开(公告)号：US20120301678A1
公开(公告)日：2012-11-29
申请号：US13115316
申请日：2011-05-25
申请人： Pao-Yun TANG , Wei-Hao Sun
发明人： Pao-Yun TANG , Wei-Hao Sun
IPC分类号： B32B7/14 , B32B37/12 , B32B3/00 , B32B7/12 , B32B7/02
CPC分类号： G06F3/044 , G06F2203/04103 , H03K2217/96076 , Y10T156/10 , Y10T428/24562 , Y10T428/24802 , Y10T428/24826 , Y10T428/24851 , Y10T428/24942 , Y10T428/31504
摘要： A panel module is provided, including a first substrate, a second substrate, a first optical glue, and a second optical glue. The first and second optical glues are disposed between the first and second substrates, wherein the first optical glue protrudes from the first substrate, and the second optical glue adheres the first substrate to the second substrate. Specifically, the viscosity of the second optical glue is smaller than the first optical glue before solidification.
摘要翻译：提供一种面板模块，包括第一基板，第二基板，第一光学胶和第二光学胶。第一和第二光学胶水设置在第一和第二基底之间，其中第一光学胶从第一基底突出，第二光学胶将第一基底粘附到第二基底。具体地说，第二光学胶的粘度比固化前的第一光学胶小。

10. 发明申请

US20090045528A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20090045528A1
公开(公告)日：2009-02-19
申请号：US11986707
申请日：2007-11-26
申请人： Pao-Yun Tang , Wei-Hao Sun
发明人： Pao-Yun Tang , Wei-Hao Sun
IPC分类号： H01L23/48
CPC分类号： H01L24/13 , G02F1/13452 , H01L21/563 , H01L23/3114 , H01L23/3171 , H01L23/3192 , H01L24/16 , H01L24/32 , H01L24/83 , H01L2224/13016 , H01L2224/13019 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13166 , H01L2224/13184 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/1601 , H01L2224/2919 , H01L2224/73203 , H01L2224/81191 , H01L2224/81903 , H01L2224/83851 , H01L2924/00013 , H01L2924/01013 , H01L2924/01022 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/00014 , H01L2224/13099 , H01L2924/3512 , H01L2924/00
摘要： An electronic structural member or a semiconductor device having conductive bumps is provided. The conductive bump includes an organic buffer layer with an undercut structure, and the conductive bump is deformable during the bonding process so as to compensate the height difference between the conductive bumps. In addition, an adhesive is further disposed between the IC chip and the substrate, and partial adhesive fills in the undercut structure, such that not only the adhesive area can be increased to enhance the bonding force between the IC chip and the substrate, but the return force of the adhesive can be reduced.
摘要翻译：提供具有导电凸块的电子结构件或半导体器件。导电凸块包括具有底切结构的有机缓冲层，并且导电凸块在接合过程期间可变形，以补偿导电凸块之间的高度差。此外，在IC芯片和基板之间进一步设置粘合剂，部分粘合剂填充底切结构，使得不仅可以增加粘合面积以增强IC芯片和基板之间的结合力，而且可以减少粘合剂的返回力。

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