专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2008217217A Radio communication device 审中-公开
标题翻译：无线电通信设备
公开(公告)号：JP2008217217A
公开(公告)日：2008-09-18
申请号：JP2007051472
申请日：2007-03-01
申请人： Wei-Ming Chen , Infinite Square Technology Inc , 無限平方科技股▲分▼有限公司Infinite Square Technology Inc. , 陳韋名Chen Wei−Ming
发明人： CHEN WEI-MING , YU YI-CHENG , HUANG CHIH-TAO
IPC分类号： G06K19/07 , G06K19/077
摘要： PROBLEM TO BE SOLVED: To provide a portable radio communication device which can be housed in the memory card slot of a notebook computer and can perform radio transmission. SOLUTION: In this radio communication device which is provided with an RF module; a voice processing module; a transmission and reception module; and a device casing, the RF module is wirelessly connected to a notebook computer, and configured to transmit/receive a radio data signal, and to bi-directionally convert the radio data signal into a digital voice signal, and the voice processing module is configured to bi-directionally convert the digital voice signal into an analog voice signal, and the transmission/reception module is configured to input/output the analog voice signal, and the device casing is configured to connect the RF module, the voice processing module and the transmission/reception module to each other, and the appearance dimension is matched with the specific dimension of a personal memory card. Thus, this radio communication device can be housed in the memory card slot of the notebook computer. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种便携式无线电通信装置，其可以容纳在笔记本计算机的存储卡插槽中并且可以执行无线电传输。解决方案：在设置有RF模块的无线电通信设备中; 语音处理模块; 发送和接收模块; 所述RF模块与所述笔记本计算机无线连接，并且被配置为发送/接收无线电数据信号，并且将所述无线电数据信号双向地转换为数字语音信号，并且所述语音处理模块被配置为将数字语音信号双向转换为模拟语音信号，并且发送/接收模块被配置为输入/输出模拟语音信号，并且设备外壳被配置为将RF模块，语音处理模块和发送/接收模块，并且外观尺寸与个人存储卡的特定尺寸相匹配。因此，该无线电通信装置可以容纳在笔记本计算机的存储卡插槽中。版权所有（C）2008，JPO＆INPIT

2. 发明申请

WO2011081443A3 TARGET-AIMING DRUG DELIVERY SYSTEM FOR DIAGNOSIS AND TREATMENT OF CANCER CONTAINING LIPOSOME LABELED WITH PEPTIDES WHICH SPECIFICALLY TARGETS INTERLEUKIN-4 RECEPTORS, AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：用于诊断和治疗含有特异靶向白细胞介素-4受体的肽的含脂质体的脂质体的靶向药物递送系统及其制造方法
公开(公告)号：WO2011081443A3
公开(公告)日：2011-12-01
申请号：PCT/KR2010009495
申请日：2010-12-29
申请人： KYUNGPOOK NAT UNIV IND ACAD , IND TECH RES INST , KIM IN SAN , LEE BYUNG HEON , LU MAGGIE JM , LIANG HSIANG-FA , KO YI-JU , LO YA-CHIN , CHANG LI-WEN , WEI MING-CHEN
发明人： KIM IN SAN , LEE BYUNG HEON , LU MAGGIE JM , LIANG HSIANG-FA , KO YI-JU , LO YA-CHIN , CHANG LI-WEN , WEI MING-CHEN
IPC分类号： A61K9/127 , A61K38/20 , A61K47/18 , A61K47/30 , A61P35/00
CPC分类号： A61K31/704 , A61K9/1271 , A61K38/00 , A61K47/6911
摘要： The present invention relates to a target-aiming drug delivery system for diagnosis and treatment of cancer containing liposome labeled with peptides which specifically targets interleukin-4 receptors, and a manufacturing method thereof. The liposome which contains anticancer drugs labeled with IL4RPep peptides prepared in accordance with the present invention can deliver drugs to cancer cells in which IL-4 receptors are overexpressed by IL4RPep peptides which specifically bind to IL-4 receptors, and the drug delivery can recognize cancer cells specifically by a label. Thus, IL4RPep peptides can increase the effect of drugs only on cancer tissues and at the same time significantly reduce the side effects on normal tissues, which makes possible in vivo (molecular) imaging and early diagnosis of tumors. Therefore, the liposome which contains anticancer drugs labeled with IL4RPep peptides of the present invention can be applied, as the target-aiming drug delivery system, effectively to the diagnosis and treatment of cancers.
摘要翻译：用于诊断和治疗癌症的靶向药物递送系统及其制造方法技术领域本发明涉及一种用于诊断和治疗癌症的靶向药物递送系统及其制造方法，该系统包含特异性靶向白细胞介素-4受体的肽，含有根据本发明制备的IL4RPep肽标记的抗癌药物的脂质体可以将药物递送至其中IL-4受体通过与IL-4受体特异性结合的IL4RPep肽过表达的癌细胞，并且药物递送可以识别癌症细胞特别是由标签。因此，IL4RPep肽可以仅增加药物对癌症组织的作用，同时显着降低对正常组织的副作用，这使得体内（分子）成像和肿瘤的早期诊断成为可能。因此，含有本发明的IL4RPep肽标记的抗癌药物的脂质体可以作为靶向药物递送系统有效地用于癌症的诊断和治疗。

3. 发明专利

TW200727600A 無線通訊裝置 WIRELESS COMMUNICATION DEVICE 审中-公开
简体标题：无线通信设备 WIRELESS COMMUNICATION DEVICE
公开(公告)号：TW200727600A
公开(公告)日：2007-07-16
申请号：TW095101258
申请日：2006-01-12
申请人：陳韋名 WEI MING CHEN , 無限平方科技股份有限公司 INFINITE SQUARE TECHNOLOGY INC.
发明人：陳韋名 WEI-MING CHEN , 余奕澄 YI-CHENG YU , 黃志韜 CHIH-TAO HUANG
IPC分类号： H04B , H04M
摘要：一種無線通訊裝置,其包括一無線射頻模組、一語音處理模組、一收發話模組以及一裝置殼體。無線射頻模組係用以與一筆記型電腦進行無線連結,以收發一無線數據訊號,並雙向轉換此無線數據訊號為一數位語音訊號。語音處理模組係用以雙向轉換此數位語音訊號為一類比語音訊號。收發話模組係用以輸入及輸出此類比語音訊號。裝置殼體係與無線射頻模組、語音處理模組以及收發話模組相互結合,此裝置殼體之外觀尺寸係符合一電腦記憶卡之規格尺寸,可收納於筆記型電腦之一記憶卡擴充槽內。
简体摘要：一种无线通信设备,其包括一无线射频模块、一语音处理模块、一收发话模块以及一设备壳体。无线射频模块系用以与一笔记本电脑进行无线链接,以收发一无线数据信号,并双向转换此无线数据信号为一数码语音频号。语音处理模块系用以双向转换此数码语音频号为一模拟语音频号。收发话模块系用以输入及输出此模拟语音频号。设备壳体系与无线射频模块、语音处理模块以及收发话模块相互结合,此设备壳体之外观尺寸系符合一电脑记忆卡之规格尺寸,可收纳于笔记本电脑之一记忆卡扩充槽内。

4. 发明专利

TW200727602A 整合型無線收發模組 INTEGRATED WIRELESS TRANSCEIVER MODULE 失效
简体标题：集成型无线收发模块 INTEGRATED WIRELESS TRANSCEIVER MODULE
公开(公告)号：TW200727602A
公开(公告)日：2007-07-16
申请号：TW095101485
申请日：2006-01-13
申请人：陳韋名 WEI-MING CHEN , 無限平方科技股份有限公司 INFINITE SQUARE TECHNOLOGY INC.
发明人：陳韋名 WEI-MING CHEN , 余奕澄 YI-CHENG YU , 黃志韜 CHIH-TAO HUANG
IPC分类号： H04B , G06F
摘要：一種整合型無線收發模組,適用於一具有一卡座之電子裝置,該整合型無線收發模組包括一複合介面、一微控制器、一訊號處理單元以及一無線射頻單元。複合介面包括一USB介面以及一訊號傳輸介面,此訊號傳輸介面可與卡座連接,以傳輸一特定訊號。微控制器具有一用以儲存一韌體之程式記憶體,此微控制器依據此韌體輸出一控制訊號。訊號處理單元依據此控制訊號對前述之特定訊號進行編碼、壓縮等處理,將此特定訊號轉換為一前置調變訊號。無線射頻單元係連接於訊號處理單元,此無線射頻單元係用以將前置調變訊號轉換為一無線射頻訊號輸出。
简体摘要：一种集成型无线收发模块,适用于一具有一卡座之电子设备,该集成型无线收发模块包括一复合界面、一单片机、一信号处理单元以及一无线射频单元。复合界面包括一USB界面以及一信号传输界面,此信号传输界面可与卡座连接,以传输一特定信号。单片机具有一用以存储一固件之进程内存,此单片机依据此固件输出一控制信号。信号处理单元依据此控制信号对前述之特定信号进行编码、压缩等处理,将此特定信号转换为一前置调制信号。无线射频单元系连接于信号处理单元,此无线射频单元系用以将前置调制信号转换为一无线射频信号输出。

5. 发明授权

US08823179B2 Electronic device package and method for fabricating the same 有权
标题翻译：电子器件封装及其制造方法
公开(公告)号：US08823179B2
公开(公告)日：2014-09-02
申请号：US12667383
申请日：2008-06-13
申请人： Chia-Lun Tsai , Wen-Cheng Chien , Po-Han Lee , Wei-Ming Chen , Chien-Hung Liu , Ying-Nan Wen
发明人： Chia-Lun Tsai , Wen-Cheng Chien , Po-Han Lee , Wei-Ming Chen , Chien-Hung Liu , Ying-Nan Wen
IPC分类号： H01L23/48 , H01L27/146 , H01L21/768 , H01L23/00
CPC分类号： H01L23/481 , H01L21/76898 , H01L24/12 , H01L27/14618 , H01L27/14683 , H01L2224/05001 , H01L2224/05024 , H01L2224/05026 , H01L2224/05548 , H01L2224/05624 , H01L2224/05639 , H01L2224/05655 , H01L2924/00014 , H01L2924/01021 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1461 , H01L2924/3025 , H01L2924/00 , H01L2224/05099
摘要： An embodiment of the present invention provides an electronic device package, which includes a chip having a first surface and an opposite second surface and a trench extending into a body of the chip along a direction from the second surface to the first surface, wherein a bottom portion of the trench includes at least two contact holes.
摘要翻译：本发明的实施例提供了一种电子器件封装，其包括具有第一表面和相对的第二表面的芯片以及沿着从第二表面到第一表面的方向延伸到芯片的主体中的沟槽，其中底部沟槽的一部分包括至少两个接触孔。

6. 发明授权

US08449801B2 Composition and process for preparing NIR shielding masterbatch and NIR shielding masterbatch and application thereof 有权
标题翻译：制备NIR屏蔽母粒和NIR屏蔽母料的组成和工艺及其应用
公开(公告)号：US08449801B2
公开(公告)日：2013-05-28
申请号：US12851583
申请日：2010-08-06
申请人： Ying-Hsiu Hsiao , Sheng-Jen Lin , Wei-Ming Chen , Wei-Peng Lin
发明人： Ying-Hsiu Hsiao , Sheng-Jen Lin , Wei-Ming Chen , Wei-Peng Lin
IPC分类号： B29B9/06
CPC分类号： G02B1/04 , C08J5/00 , D01F1/106
摘要： Disclosed herein is a method for preparing a near infrared shielding masterbatch. The method includes the steps of preparing and compounding a composition, and then pelletizing the compounded composition. The composition includes at least one metallic ionic compound powder in an amount of about 1-25 wt %, a cross-linking agent in an amount of about 0.1-5 wt %, a thermoplastic polymer in an amount of about 67-98.7 wt %, an initiator in an amount of about 0.1-1 wt %, and a dispersing agent in an amount of about 0.1-2 wt %.
摘要翻译：本文公开了一种制备近红外屏蔽母料的方法。该方法包括制备和混合组合物，然后将复合组合物造粒的步骤。该组合物包含至少一种量为约1-25重量％的金属离子化合物粉末，约0.1-5重量％的交联剂，约67-98.7重量％的热塑性聚合物，，约0.1-1重量％的引发剂和约0.1-2重量％的分散剂。

7. 发明授权

US08372902B2 Non-dripping flame retarding masterbatch, composition and process for preparing the same and flame retarding article containing the same 有权
标题翻译：不滴滴阻燃母料，其制备方法及含有该阻燃剂的阻燃制品
公开(公告)号：US08372902B2
公开(公告)日：2013-02-12
申请号：US12648083
申请日：2009-12-28
申请人： Sheng-Jen Lin , Wei-Ming Chen , Nai-Yun Liang , Wei-Peng Lin
发明人： Sheng-Jen Lin , Wei-Ming Chen , Nai-Yun Liang , Wei-Peng Lin
IPC分类号： C08G18/77
CPC分类号： C08K5/0025 , C08J3/226 , C08J2427/00 , C08J2467/00 , C08J2477/00 , C08K3/32 , C08K5/0066 , C08L23/12 , C08L23/10 , C08L67/02 , C08L27/06 , C08L77/00 , C08L2666/02
摘要： Disclosed herein is a composition for preparing a non-dripping flame retarding masterbatch. The flame retarding masterbatch includes a fire retardant in an amount of about 0.1-15.0 wt %, a crosslinking agent in an amount of about 0.1-1.5 wt %, a thermoplastic polymer in an amount of about 76.5-99.5 wt %, a crosslinking initiator in an amount of about 0.01-2.0 wt %, and a dispersing agent in an amount of about 0.1-5.0 wt % in the composition.
摘要翻译：本文公开了一种用于制备不滴加阻燃母料的组合物。阻燃母料包括约0.1-15.0重量％的阻燃剂，约0.1-1.5重量％的交联剂，约76.5-99.5重量％的热塑性聚合物，交联引发剂的量为约0.01-2.0重量％，分散剂的量为组合物中约0.1-5.0重量％。

8. 发明申请

US20130032939A1 CHIP PACKAGE STRUCTURE 有权
标题翻译：芯片包装结构
公开(公告)号：US20130032939A1
公开(公告)日：2013-02-07
申请号：US13481881
申请日：2012-05-28
申请人： Wei-Ming Chen , Chi-Chia Huang
发明人： Wei-Ming Chen , Chi-Chia Huang
IPC分类号： H01L23/498
CPC分类号： H01L23/4985 , H01L21/563 , H01L23/49894 , H01L23/552 , H01L23/60 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/81203 , H01L2224/81805 , H01L2924/00014 , H01L2924/01322 , H01L2924/3511 , H01L2924/00 , H01L2224/0401
摘要： A chip package structure includes a flexible substrate having a chip mounting region, a plurality of leads disposed on the flexible substrate, an insulating layer and a chip. Each lead includes a body portion and an inner lead portion connected to each other. The body portion is located outside the chip mounting region and has a thickness greater than that of the inner lead portion. The insulating layer is disposed on the inner lead portions. The chip has an active surface on which a plurality of bumps and a seal ring adjacent to the chip edges are disposed. The chip is mounted within the chip mounting region and electrically connects the flexible substrate by connecting the inner lead portions of the leads with the bumps. The insulating layer is corresponding to the seal ring in position when the chip is electrically connected to the flexible substrate.
摘要翻译：芯片封装结构包括具有芯片安装区域的柔性衬底，设置在柔性衬底上的多个引线，绝缘层和芯片。每个引线包括彼此连接的主体部分和内部引线部分。主体部分位于芯片安装区域的外侧，其厚度大于内部引线部分的厚度。绝缘层设置在内引线部分上。芯片具有活性表面，多个凸起和与芯片边缘相邻的密封环设置在该表面上。芯片安装在芯片安装区域内，通过将引线的内引线部分与凸块连接来电连接柔性基板。当芯片电连接到柔性基板时，绝缘层对应于密封环就位。

9. 发明申请

US20130007669A1 SYSTEM AND METHOD FOR EDITING INTERACTIVE THREE-DIMENSION MULTIMEDIA, AND ONLINE EDITING AND EXCHANGING ARCHITECTURE AND METHOD THEREOF 有权
标题翻译：用于编辑交互式三维多媒体的系统和方法，以及在线编辑和交换架构及其方法
公开(公告)号：US20130007669A1
公开(公告)日：2013-01-03
申请号：US13221090
申请日：2011-08-30
申请人： Yu-Ling Lu , Chi-Jui Lien , Chien-Ju Li , Wei-Ming Chen
发明人： Yu-Ling Lu , Chi-Jui Lien , Chien-Ju Li , Wei-Ming Chen
IPC分类号： G06F3/048
CPC分类号： G09B5/065 , A63F2300/632 , G06T19/00 , G06T2200/24 , G11B27/034
摘要： A system and method are provided to edit interactive three-dimensional multimedia. A user interface of the system is provided with an event level template that includes event series levels with multiple event developing points. Through the user interface, multiple interactive events related to a first character of the event developing point are edited. Through a three-dimensional engine, interactive relevances are built up between interactive events and multiple materials inside one or more database. When the interactive three-dimensional multimedia with multiple materials is output, the interactive events corresponding to the event developing points are performed according to a user command. An online editing and exchanging method integrated with the system and method is also provided to share pre-edited templates on an exchange server; each of the pre-edited templates is extracted from an interactive three-dimensional multimedia pre-edited by the system and method.
摘要翻译：提供了一种编辑交互式三维多媒体的系统和方法。系统的用户界面提供了一个事件级别模板，其中包括具有多个事件开发点的事件级别级别。通过用户界面编辑与事件开发点的第一个字符相关的多个交互式事件。通过三维引擎，在一个或多个数据库中的交互式事件和多种材料之间建立交互式相关性。当输出具有多种材料的交互式三维多媒体时，根据用户命令执行与事件发展点对应的交互式事件。还提供了与系统和方法集成的在线编辑和交换方法，用于在交换服务器上共享预编辑的模板; 从由系统和方法预编辑的交互式三维多媒体中提取每个预编辑的模板。

10. 发明授权

US08310050B2 Electronic device package and fabrication method thereof 有权
标题翻译：电子器件封装及其制造方法
公开(公告)号：US08310050B2
公开(公告)日：2012-11-13
申请号：US13024902
申请日：2011-02-10
申请人： Wei-Ming Chen , Shu-Ming Chang
发明人： Wei-Ming Chen , Shu-Ming Chang
IPC分类号： H01L23/48
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/481 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24246 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73267 , H01L2224/82 , H01L2224/97 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/00 , H01L2224/83
摘要： A chip package is disclosed. The package includes a carrier substrate, at least two semiconductor chips, a fill material layer, a protective layer, and a plurality of conductive bumps. The carrier substrate includes a grounding region. The semiconductor chips are disposed overlying the grounding region of the carrier substrate. Each semiconductor chip includes at least one signal pad and includes at least one grounding pad electrically connected to the grounding region. The fill material layer is formed overlying the carrier substrate and covers the semiconductor chips. The protective layer covers the fill material layer. The plurality of conductive bumps is disposed overlying the protective layer and is electrically connected to the semiconductor chips. A fabrication method of the chip package is also disclosed.
摘要翻译：公开了一种芯片封装。封装包括载体衬底，至少两个半导体芯片，填充材料层，保护层和多个导电凸块。载体基板包括接地区域。半导体芯片设置在载体基板的接地区域上。每个半导体芯片包括至少一个信号焊盘，并且包括电连接到接地区域的至少一个接地焊盘。填充材料层形成在载体衬底上并覆盖半导体芯片。保护层覆盖填充层。多个导电凸块设置在保护层的上方并与半导体芯片电连接。还公开了芯片封装的制造方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式