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1. 发明申请

US20100071195A1 ELECTRIC COMPONENT MOUNTING SYSTEM AND ELECTRIC COMPONENT MOUNTING METHOD 有权
标题翻译：电气组件安装系统和电气组件安装方法
公开(公告)号：US20100071195A1
公开(公告)日：2010-03-25
申请号：US11813872
申请日：2006-01-20
申请人： Masahiro Kihara , Masafumi Inoue , Wataru Hidese
发明人： Masahiro Kihara , Masafumi Inoue , Wataru Hidese
IPC分类号： B23P19/00
CPC分类号： H05K13/0413 , H05K13/0069 , H05K13/082 , Y10T29/49004 , Y10T29/53174
摘要： To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality.The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.
摘要翻译：提供一种能够防止由于基板的高度方向上的位置误差引起的安装故障并确保安装质量的电子部件安装系统和电子部件安装方法。电子部件安装系统包括彼此连接的多个电子部件安装装置，并将电子部件安装在基板上以制造安装基板。用于在焊接印刷之后测试基板的印刷测试装置通过高度测量机22测量设置在基板4的上表面上的高度测量点的高度位置，并输出测量结果作为基板高度数据。在使用电子部件放置装置的部件放置步骤中，更新用于控制放置头32的部件放置操作的控制参数。因此，可以校正单个基板的高度位置的变化，并且可以防止由于基板的高度方向上的位置误差引起的安装故障。

2. 发明授权

US06792676B2 Apparatus and method for mounting electronic parts 失效
标题翻译：用于安装电子部件的装置和方法
公开(公告)号：US06792676B2
公开(公告)日：2004-09-21
申请号：US10212955
申请日：2002-08-06
申请人： Hiroshi Haji , Wataru Hidese
发明人： Hiroshi Haji , Wataru Hidese
IPC分类号： H05K330
CPC分类号： H01L21/67259 , H01L21/67144 , H01L21/681 , Y10T29/4913 , Y10T29/49131 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187 , Y10T29/53191 , Y10T29/53261 , Y10T29/53478
摘要： An electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. A parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera are performed concurrently. Thereby, the number of electronic parts per mount turn can be increased, the tact time can be shortened, and the electronic parts can be efficiently taken out and mounted on the board.
摘要翻译：一种电子部件安装装置，用于通过包括多个吸嘴的传送头从保持在晶片保持部分上的半导体晶片取出半导体芯片，并将半导体芯片传送和安装到板上并具有一个部件识别摄像机从晶片保持部分前进和退出以拾取半导体晶片的图像的方式。同时执行用于通过传送头将多个半导体芯片安装在板上的部件安装步骤和用于拾取由部件识别相机取出的多个半导体芯片的图像拾取步骤。由此，可以提高每个安装转弯的电子部件的数量，可以缩短节拍时间，并且可以有效地将电子部件取出并安装在电路板上。

3. 发明授权

US5208975A Method and apparatus for mounting electronic parts 失效
标题翻译：用于安装电子部件的方法和装置
公开(公告)号：US5208975A
公开(公告)日：1993-05-11
申请号：US918063
申请日：1992-07-24
申请人： Wataru Hidese
发明人： Wataru Hidese
IPC分类号： H05K13/00 , H05K13/04
CPC分类号： H05K13/0069 , H05K13/0413 , Y10T29/4913 , Y10T29/53061 , Y10T29/53178 , Y10T29/53191
摘要： An electronic parts mounting apparatus includes an index rotary member. The index rotary member is rotated. A plurality of mounted heads are provided on the index rotary member for sucking electronic components, and for mounting the electronic components on a printed circuit board. The mounting heads are vertically moved through a stoke relative to the printed circuit board. The stroke of movement of the mounting heads is adjusted. A vertically-movable table is provided on a horizontally-movable table. Clampers are supported on the vertically-movable table for holding the printed circuit board therebetween. The vertically-movable table is vertically moved to adjust a height of the printed circuit board held between the clampers.
摘要翻译：一种电子部件安装装置，包括索引旋转部件。转动旋转构件旋转。多个安装的头部设置在分度旋转构件上用于吸入电子部件，并且用于将电子部件安装在印刷电路板上。安装头相对于印刷电路板垂直移动通过一个脚蹬。调节安装头的运动行程。可水平移动的桌子上设置有可垂直移动的桌子。夹持器支撑在可垂直移动的工作台上，用于将印刷电路板夹在其间。垂直移动的桌子被垂直移动以调节夹持器之间的印刷电路板的高度。

4. 发明授权

US5184397A Electrical component placing apparatus 失效
标题翻译：电气元件放置装置
公开(公告)号：US5184397A
公开(公告)日：1993-02-09
申请号：US738622
申请日：1991-07-31
申请人： Wataru Hidese
发明人： Wataru Hidese
IPC分类号： B23P21/00 , H05K13/00 , H05K13/04
CPC分类号： H05K13/0413 , Y10T29/53178 , Y10T29/53478
摘要： An electrical component placing apparatus having a rotary head is required to be further accelerated to place an electrical component. In order to accelerate the operation of the placing apparatus, the indexing speed of the rotary head must be accelerated. However, since the rotary head is heavy, its rotating inertial is large. Thus, when the indexing speed of the rotary head is accelerated, a vibration at the time of stopping indexing of the rotary head is increased as well. Therefore, mistakes of picking up the electrical component by the pick and place head and placing the electrical component on the substrate occur. This invention reduces the outer diameter of a rotor for indexing a pick and place head smaller than the diameter of a guide for guiding the indexing of a pick and place head, disposes a bracket for supporting the pick and place head along the wall surface of the rotor and reduces the rotating diameter of the pick and place head smaller than the diameter of the guide. With the arrangement described above, the rotary head is reduced in size to largely reduce its weight and to reduce the rotary inertia of the rotary head. Therefore, the rotary inertia of the rotary head is reduced, and the vibration of the pick and place head at the time of indexing is reduced. Consequently, the rotary head can be indexed at a high speed, thereby placing the electrical component on the substrate at a high speed.
摘要翻译：需要进一步加速具有旋转磁头的电气部件放置装置以放置电气部件。为了加速放置装置的操作，必须加速旋转头的分度速度。然而，由于旋转头很重，其旋转惯性大。因此，当旋转头的分度速度加快时，旋转头的分度停止时的振动也增加。因此，发生通过拾取头放置电子元件并将电气元件放置在基板上的错误。本发明减小了转子的外径，用于使拾取头和放置头小于用于引导拾取头的分度的引导件的直径的头部放置头部，配置用于支撑拾取头的支架，并沿着壁的表面放置头部转子，并减小拾音器的旋转直径，并将头部小于导轨的直径。通过上述结构，旋转头的尺寸减小到很大程度上减轻其重量并降低旋转头的旋转惯性。因此，旋转头的旋转惯性降低，并且在分度时的拾放头的振动减小。因此，旋转头可以高速转位，从而高速地将电气部件放置在基板上。

5. 发明申请

US20110023294A1 ELECTRONIC COMPONENT INSTALLATION APPARATUS 有权
标题翻译：电子元件安装设备
公开(公告)号：US20110023294A1
公开(公告)日：2011-02-03
申请号：US12936242
申请日：2009-03-25
申请人： Yoshiaki Awata , Wataru Hidese , Kazuhide Nagao , Takuya Tsutsumi
发明人： Yoshiaki Awata , Wataru Hidese , Kazuhide Nagao , Takuya Tsutsumi
IPC分类号： B23P19/00
CPC分类号： H05K13/0452 , H05K13/0061 , Y10T29/4913 , Y10T29/49828 , Y10T29/5137 , Y10T29/5196 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183
摘要： An object is to provide an electronic component installation apparatus capable of efficiently doing component installation work for which plural substrates including a double-sided mounting substrate are targeted.An electronic component installation apparatus 4 which constructs an electronic component mounting line 1 and installs an electronic component on a substrate is configured to include substrate conveyance lanes L1, L3 as two conveyance paths for feed which respectively feed the substrate carried from the upstream side to the downstream side, the conveyance paths for feed in which substrate positioning parts for positioning and holding the substrate in installation work positions are disposed between two component installation parts 22A, 22B for taking the electronic components out of component supply parts 23A, 23B and transferring and installing the electronic components to the substrate, and a substrate conveyance lane L2 as a return conveyance path which returns the substrate carried from the downstream side to the upstream side and is disposed in a state of being sandwiched between the substrate conveyance lanes L1, L3. Consequently, in the case of targeting a double-sided mounting substrate, the substrate after single-sided mounting can automatically be returned to the upstream portion.
摘要翻译：本发明的目的是提供一种能够有效地进行包括双面安装基板的多个基板的部件安装工作的电子部件安装装置。构成电子部件安装线1并将电子部件安装在基板上的电子部件安装装置4构成为包括基板输送通路L1，L3作为两个进给输送路径，分别将从上游侧输送到基板下游侧，将用于将基板定位和保持在安装作业位置的基板定位部件供给的输送路径设置在用于将电子部件从部件供给部件23A，23B中取出并转移和安装的两个部件安装部件22A，22B之间电子部件到基板，以及作为返回输送路径的基板输送通道L2，该返回输送路径使从下游侧向上游侧返回的基板返回，并且被夹持在基板输送通路L1，L3之间的状态。因此，在对准双面安装基板的情况下，单面安装后的基板可以自动返回到上游部。

6. 发明授权

US06588096B1 Method employing X-Y tables for simultaneously mounting electronic parts 有权
标题翻译：采用X-Y表同时安装电子部件的方法
公开(公告)号：US06588096B1
公开(公告)日：2003-07-08
申请号：US09281222
申请日：1999-03-30
申请人： Wataru Hidese
发明人： Wataru Hidese
IPC分类号： H05K330
CPC分类号： H05K13/0452 , H05K13/041 , Y10S29/044 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： An electronic parts-mounting method for mounting parts on a board in which at least two electronic parts can be picked up by a plurality of nozzles including a plurality of first nozzles arranged substantially parallel to the direction of movement of the board and a plurality of second nozzles arranged substantially perpendicular to the direction of movement of the board such that the positions of the parts picked up by the second nozzles can be recognized by a line sensor and corrected.
摘要翻译：一种电子部件安装方法，用于将部件安装在板上，其中至少两个电子部件可以被多个喷嘴拾取，所述多个喷嘴包括基本上平行于板的移动方向排列的多个第一喷嘴，以及多个第二喷嘴布置成基本上垂直于板的运动方向，使得由第二喷嘴拾取的部件的位置可以被线传感器识别并校正。

7. 发明授权

US06539622B2 Electronic components mounting device and the mounting method 失效
标题翻译：电子元件安装装置及安装方法
公开(公告)号：US06539622B2
公开(公告)日：2003-04-01
申请号：US09455459
申请日：1999-12-06
申请人： Wataru Hidese , Yusuke Yamamoto
发明人： Wataru Hidese , Yusuke Yamamoto
IPC分类号： H05K330
CPC分类号： H05K13/0417 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/53178 , Y10T29/53191
摘要： An electronic components mounting device has a plurality of feeder bases attached with tape feeders thereon, and a guide rail and a cylinder for drawing each of the feeder bases independently to a position for replenishing electronic components. When an electronic component runs out of the storage, only the feeder base that is carrying the relevant tape feeder gone out of the stock is drawn to a place for parts replenishment; in the mean time, the mounting actions keep on going by making use of tape feeders attached on other feeder base. Machine stop times can be decreased with the mounting device.
摘要翻译：一种电子部件安装装置，具有多个在其上安装有带式送料器的供料器基座，以及用于独立地将每个进料器基座分别用于补充电子部件的位置的导轨和滚筒。当电子元件从存储器中流出时，只有携带相关磁带馈给器的进纸器底座被拉出到零件补充的地方; 同时，通过使用连接在其他馈线基座上的送带器，安装动作继续进行。停机时间可以通过安装装置降低。

8. 发明授权

US5208969A Electronic components mounting apparatus 失效
标题翻译：电子元件安装装置
公开(公告)号：US5208969A
公开(公告)日：1993-05-11
申请号：US796173
申请日：1991-11-22
申请人： Wataru Hidese
发明人： Wataru Hidese
IPC分类号： B23P21/00 , B23P19/00 , B23Q1/58 , B23Q7/14 , H05K13/00 , H05K13/02
CPC分类号： H05K13/021 , B23P19/001 , B23Q1/58 , B23Q7/1426 , Y10T29/53178 , Y10T29/53183
摘要： A type of electronic components mounting apparatus is widely known, by which electronic components on an electronic components feeding device are picked up, while pick-and-place heads are being rotated for indexing along a rotary head, and the electronic components are mounted on a circuit board or a substrate positioned on an X-Y table. The electronic components feeding device moves the tables with feeders over a base in lateral direction to supply the electronic components to the feeders on the pick-and-place heads. With increasing demands on high-speed mounting of the components, the moving speed of the above tables must be increased to attain high-speed mounting. The electronic components feeding device according to the present invention comprises a plurality of tables where feeders of the electronic components are placed, a base where these tables are placed, a first feeding means for moving said tables in lateral direction along which said tables are arranged in a feeding area at central part of said base in order to stop said feeders at pickup position of said pick-and-place heads, and a second feeding means for moving said tables between retreat areas on the sides of said base and said feeding area. As the result, the tables can be moved at high speed and can be stopped at correct position with high accuracy.
摘要翻译：一种电子部件安装装置是众所周知的，通过该装置，拾取电子部件供给装置上的电子部件，同时拾取头被旋转以沿着旋转头进行分度，电子部件安装在电路板或位于XY台上的基板。电子元件供给装置将具有进料器的工作台在横向方向上移动到基座上，以将电子部件供应到拾放头上的进料器。随着对组件的高速安装的要求的增加，必须增加上表的移动速度以实现高速安装。根据本发明的电子元件供给装置包括多个表格，其中放置电子元件的馈线，放置这些表的基座，用于沿所述桌子布置在其中的横向移动所述桌子的第一馈送装置在所述基座的中央部分的进给区域，以便在所述拾取头的拾取位置停止所述进给器;以及第二进给装置，用于在所述基座的侧面和所述进给区域的后退区域之间移动所述台。因此，可以高速移动台面，并可以高精度地停止在正确的位置。

9. 发明授权

US09198336B2 Electric component mounting system and electric component mounting method 有权
标题翻译：电气元件安装系统和电气元件安装方法
公开(公告)号：US09198336B2
公开(公告)日：2015-11-24
申请号：US11813872
申请日：2006-01-20
申请人： Masahiro Kihara , Masafumi Inoue , Wataru Hidese
发明人： Masahiro Kihara , Masafumi Inoue , Wataru Hidese
IPC分类号： H05K3/30 , H05K13/04 , H05K13/00
CPC分类号： H05K13/0413 , H05K13/0069 , H05K13/082 , Y10T29/49004 , Y10T29/53174
摘要： An electronic component mounting system mounts an electronic component on a substrate to manufacture a mounting substrate, and can prevent a mounting failure due to a positional error in a height direction of a substrate and ensure mounting quality. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.
摘要翻译：电子部件安装系统将电子部件安装在基板上以制造安装基板，并且可以防止由于基板的高度方向上的位置误差引起的安装故障，并确保安装质量。用于在焊接印刷之后测试基板的印刷测试装置通过高度测量机22测量设置在基板4的上表面上的高度测量点的高度位置，并输出测量结果作为基板高度数据。在使用电子部件放置装置的部件放置步骤中，更新用于控制放置头32的部件放置操作的控制参数。因此，可以校正单个基板的高度位置的变化，并且可以防止由于基板的高度方向上的位置误差引起的安装故障。

10. 发明授权

US08196287B2 Electronic component installation apparatus 有权
标题翻译：电子元件安装设备
公开(公告)号：US08196287B2
公开(公告)日：2012-06-12
申请号：US12936242
申请日：2009-03-25
申请人： Yoshiaki Awata , Wataru Hidese , Kazuhide Nagao , Takuya Tsutsumi
发明人： Yoshiaki Awata , Wataru Hidese , Kazuhide Nagao , Takuya Tsutsumi
IPC分类号： B23P19/00
CPC分类号： H05K13/0452 , H05K13/0061 , Y10T29/4913 , Y10T29/49828 , Y10T29/5137 , Y10T29/5196 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183
摘要： An electronic component installation apparatus 4 which constructs an electronic component mounting line 1 and installs an electronic component on a substrate is configured to include substrate conveyance lanes L1, L3 as two conveyance paths for feed which respectively feed the substrate carried from the upstream side to the downstream side, the conveyance paths for feed in which substrate positioning parts for positioning and holding the substrate in installation work positions are disposed between two component installation parts 22A, 22B for taking the electronic components out of component supply parts 23A, 23B and transferring and installing the electronic components to the substrate, and a substrate conveyance lane L2 as a return conveyance path which returns the substrate carried from the downstream side to the upstream side and is disposed in a state of being sandwiched between the substrate conveyance lanes L1, L3.
摘要翻译：构成电子部件安装线1并将电子部件安装在基板上的电子部件安装装置4构成为包括基板输送通路L1，L3作为两个进给输送路径，分别将从上游侧输送到基板下游侧，将用于将基板定位和保持在安装作业位置的基板定位部件供给的输送路径设置在用于将电子部件从部件供给部件23A，23B中取出并转移和安装的两个部件安装部件22A，22B之间电子部件到基板，以及作为返回输送路径的基板输送通道L2，该返回输送路径使从下游侧向上游侧返回的基板返回，并且被设置在夹在基板输送通路L1，L3之间的状态。

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