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1. 发明申请

US20080101894A1 SINGULATION HANDLER SYSTEM FOR ELECTRONIC PACKAGES 有权
标题翻译：电子包装的单机处理系统
公开(公告)号：US20080101894A1
公开(公告)日：2008-05-01
申请号：US11925091
申请日：2007-10-26
申请人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Ming Cheong Kary Tse
发明人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Ming Cheong Kary Tse
IPC分类号： B65H3/00
CPC分类号： H01L21/67092
摘要： A singulation handler system is provided for a strip of electronic packages, which comprises an onloader located adjacent to an onloading location for providing an unsingulated strip of packages for singulation and a cutting jig for mounting the strip of unsingulated packages. The cutting jig is movable between the onloading location and a singulation location at which the strip is singulated by a singulation engine. The system further includes a buffer boat for holding singulated packages that have been removed from the cutting jig and which is operative to convey the singulated packages in a fixed relative orientation. A gang pick head is operative to transfer multiple singulated packages simultaneously from the buffer boat to a rotary turret device and an offloader is provided for transferring singulated packages from the rotary turret device to containers in which the singulated packages are storable.
摘要翻译：提供了一种用于电子包装条的分切处理系统，其包括位于加载位置附近的加载器，用于提供用于分割的未卷曲包装条带和用于安装未卷曲包装条的切割夹具。切割夹具可以在加载位置和切片位置之间移动，在该切割位置，条带由分割引擎分割。该系统还包括用于保持已经从切割夹具移除并且以固定的相对定向输送单个包装的单个包装的缓冲舟。组合拾取头可操作以将多个单独包装从缓冲舟同时转移到旋转转塔装置，并且提供卸载器用于将分离的包装从旋转转塔装置传送到其中可分离包装的容器。

2. 发明授权

US08011058B2 Singulation handler system for electronic packages 有权
标题翻译：电子封装的分割处理系统
公开(公告)号：US08011058B2
公开(公告)日：2011-09-06
申请号：US11925091
申请日：2007-10-26
申请人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Ming Cheong Kary Tse
发明人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Ming Cheong Kary Tse
IPC分类号： A47L5/38
CPC分类号： H01L21/67092
摘要： A singulation handler system is provided for a strip of electronic packages, which comprises an onloader located adjacent to an onloading location for providing an unsingulated strip of packages for singulation and a cutting jig for mounting the strip of unsingulated packages. The cutting jig is movable between the onloading location and a singulation location at which the strip is singulated by a singulation engine. The system further includes a buffer boat for holding singulated packages that have been removed from the cutting jig and which is operative to convey the singulated packages in a fixed relative orientation. A gang pick head is operative to transfer multiple singulated packages simultaneously from the buffer boat to a rotary turret device and an offloader is provided for transferring singulated packages from the rotary turret device to containers in which the singulated packages are storable.
摘要翻译：提供了一种用于电子包装条的分切处理系统，其包括位于加载位置附近的加载器，用于提供用于分割的未卷曲包装条带和用于安装未卷曲包装条的切割夹具。切割夹具可以在加载位置和切片位置之间移动，在该切割位置，条带由分割引擎分割。该系统还包括用于保持已经从切割夹具移除并且以固定的相对定向输送单个包装的单个包装的缓冲舟。组合拾取头可操作以将多个单独包装从缓冲舟同时转移到旋转转塔装置，并且提供卸载器用于将分离的包装从旋转转塔装置传送到其中可分离包装的容器。

3. 发明申请

US20090148258A1 PICK AND PLACE APPARATUS INCORPORATING DEBRIS REMOVAL DEVICE 审中-公开
标题翻译：并入装置去除装置
公开(公告)号：US20090148258A1
公开(公告)日：2009-06-11
申请号：US11952259
申请日：2007-12-07
申请人： Chi Wah CHENG , Wang Lung Alan TSE , Chi Fung Ricky CHAN
发明人： Chi Wah CHENG , Wang Lung Alan TSE , Chi Fung Ricky CHAN
IPC分类号： B65G61/00
CPC分类号： H05K13/0409 , H01L21/67144 , H01L21/6838
摘要： A pick and place apparatus is provided for picking up an electronic component from one location and placing it at another location, which comprises a pick up tool having an opening at which electronic components are configured to be held by vacuum suction. An air channel extends through the pick up tool from the opening and is connectable for fluid communication with an air supply source which is operative to blow a quantity of air out from the opening towards the electronic component for removing any debris located thereon. The air channel is also connectable for fluid communication with a vacuum suction source which is operative to generate vacuum suction force at the opening for picking up the electronic component by vacuum suction.
摘要翻译：提供了一种拾取和放置装置，用于从一个位置拾取电子部件并将其放置在另一位置，该位置包括拾取工具，该拾取工具具有开口，电子部件构造成通过真空抽吸来保持。空气通道从开口延伸穿过拾取工具，并且可连接用于与空气供应源流体连通，空气供应源可操作地将一定量的空气从开口朝向电子部件吹出以去除位于其上的任何碎片。空气通道也可连接用于与真空抽吸源的流体连通，该真空吸入源可操作以在开口处产生真空吸力，以通过真空抽吸拾取电子部件。

4. 发明授权

US07190446B2 System for processing electronic devices 有权
标题翻译：电子设备处理系统
公开(公告)号：US07190446B2
公开(公告)日：2007-03-13
申请号：US10741862
申请日：2003-12-19
申请人： Chi Wah Cheng , Hoi Fung Tsang , Chi Yat Yeung , Wang Lung Alan Tse
发明人： Chi Wah Cheng , Hoi Fung Tsang , Chi Yat Yeung , Wang Lung Alan Tse
IPC分类号： G01N21/00
CPC分类号： G01R31/2893 , G01N21/956
摘要： A system is provided for processing electronic devices, and in particular for handling, inspecting, sorting and offloading the same. An apparatus for inspecting an electronic device comprises a holder for supporting the electronic device and a driving mechanism for moving the electronic device between an onloading position where the electronic device is placed onto the holder and an offloading position where the electronic device is removed from the holder. A first optical system between the onloading and offloading positions is configured to inspect a first surface of the electronic device while it is supported by the holder, Concurrently or subsequently, a second optical system between the onloading and offloading positions is configured to inspect a second surface of the electronic device that is opposite to the first surface while it is supported by the holder.
摘要翻译：提供一种用于处理电子设备的系统，特别是用于处理，检查，分类和卸载它们的系统。一种用于检查电子装置的装置包括一个用于支撑该电子装置的支架和一个驱动机构，用于使电子装置在电子装置放置在保持架上的装载位置和电子装置从支架上移出的卸载位置之间移动。负载和卸载位置之间的第一光学系统被配置为在由所述保持器支撑的同时检查所述电子设备的第一表面，并且所述第二光学系统在所述上载位置和卸载位置之间并行地或后续地被配置为检查所述第二表面与第一表面相对的电子设备。

5. 发明授权

US08978673B2 Megasonic cleaning system 有权
标题翻译：超声波清洗系统
公开(公告)号：US08978673B2
公开(公告)日：2015-03-17
申请号：US11836458
申请日：2007-08-09
申请人： Chi Wah Cheng , Wang Lung Alan Tse , Leung Por Boris Chan
发明人： Chi Wah Cheng , Wang Lung Alan Tse , Leung Por Boris Chan
IPC分类号： B08B3/12 , B08B3/02 , H01L21/67
CPC分类号： B08B3/12 , B08B3/02 , B08B2203/0288 , H01L21/67051
摘要： A system for cleaning semiconductor packages is provided which includes a pickhead that is configured to hold the semiconductor packages in an array arrangement and a plurality of nozzles, each of which is constructed and arranged to project a separate jet of cleaning fluid upwardly against the semiconductor packages. A megasonic energy generator is coupled for imparting megasonic energy to the cleaning fluid and a driving device drives relative movement between the plurality of nozzles and the pickhead to direct the said jets to clean the array of packages on the pickhead.
摘要翻译：提供了一种用于清洁半导体封装的系统，其包括构造成将阵列布置中的半导体封装保持的拾取头和多个喷嘴，每个喷嘴构造和布置成将单独的清洁流体射流向上突出抵靠半导体封装。兆声波能量发生器被耦合以将兆声波能量传递给清洁流体，并且驱动装置驱动多个喷嘴和拾取头之间的相对运动，以引导所述射流清洁拾取头上的包装阵列。

6. 发明授权

US08167524B2 Handling system for inspecting and sorting electronic components 有权
标题翻译：电子元件检查和分类处理系统
公开(公告)号：US08167524B2
公开(公告)日：2012-05-01
申请号：US11941372
申请日：2007-11-16
申请人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Lap Kei Eric Chow
发明人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Lap Kei Eric Chow
IPC分类号： B65H9/08
CPC分类号： H01L21/67271
摘要： A semiconductor package handling system is provided comprising a package holder for receiving and holding singulated semiconductor packages, and a first inspection device which is arranged and configured to inspect a first surface of the packages while they are being held by the package holder. An offloading device receives the packages from the package holder and conveys them packages to an offloader, and a second inspection device is arranged and configured to inspect a second surface of the packages which is opposite from the first surface while they are being held by the offloading device.
摘要翻译：提供一种半导体封装处理系统，包括用于接收和保持单个半导体封装的封装保持器，以及第一检查装置，其布置和构造成在包装夹持器被保持时检查包装的第一表面。卸载装置从包装夹持器接收包装并将包装输送到卸载器，并且第二检查装置被布置和配置成在通过卸载保持的状态下检查与第一表面相对的包装的第二表面设备。

7. 发明申请

US20090129899A1 HANDLING SYSTEM FOR INSPECTING AND SORTING ELECTRONIC COMPONENTS 有权
标题翻译：用于检查和分类电子元件的处理系统
公开(公告)号：US20090129899A1
公开(公告)日：2009-05-21
申请号：US11941372
申请日：2007-11-16
申请人： Chi Wah CHENG , Wang Lung Alan TSE , Tim Wai Tony MAK , Lap Kei Eric CHOW
发明人： Chi Wah CHENG , Wang Lung Alan TSE , Tim Wai Tony MAK , Lap Kei Eric CHOW
IPC分类号： B65H1/00
CPC分类号： H01L21/67271
摘要： A semiconductor package handling system is provided comprising a package holder for receiving and holding singulated semiconductor packages, and a first inspection device which is arranged and configured to inspect a first surface of the packages while they are being held by the package holder. An offloading device receives the packages from the package holder and conveys them packages to an offloader, and a second inspection device is arranged and configured to inspect a second surface of the packages which is opposite from the first surface while they are being held by the offloading device.
摘要翻译：提供一种半导体封装处理系统，包括用于接收和保持单个半导体封装的封装保持器，以及第一检查装置，其布置和构造成在包装夹持器被保持时检查包装的第一表面。卸载装置从包装夹持器接收包装并将包装输送到卸载器，并且第二检查装置被布置和配置成在通过卸载保持的状态下检查与第一表面相对的包装的第二表面设备。

8. 发明申请

US20090038638A1 MEGASONIC CLEANING SYSTEM 有权
标题翻译：微波清洗系统
公开(公告)号：US20090038638A1
公开(公告)日：2009-02-12
申请号：US11836458
申请日：2007-08-09
申请人： Chi Wah CHENG , Wang Lung Alan TSE , Leung Por Boris CHAN
发明人： Chi Wah CHENG , Wang Lung Alan TSE , Leung Por Boris CHAN
IPC分类号： B08B3/12
CPC分类号： B08B3/12 , B08B3/02 , B08B2203/0288 , H01L21/67051
摘要： A system for cleaning semiconductor packages is provided which comprises a pickhead that is configured to hold the semiconductor packages in an array arrangement and a plurality of nozzles, each of which is constructed and arranged to project a separate jet of cleaning fluid upwardly against the semiconductor packages. A megasonic energy generator is coupled for imparting megasonic energy to the cleaning fluid and a driving device drives relative movement between the plurality of nozzles and the pickhead to direct the said jets to clean the array of packages on the pickhead.
摘要翻译：提供了一种用于清洁半导体封装的系统，其包括被配置为将阵列布置的半导体封装保持的拾取头和多个喷嘴，每个喷嘴构造和布置成将单独的清洁流体射流向上突出抵靠半导体封装。兆声波能量发生器被耦合以将兆声波能量传递给清洁流体，并且驱动装置驱动多个喷嘴和拾取头之间的相对运动，以引导所述射流清洁拾取头上的包装阵列。

9. 发明申请

US20080164646A1 WORKHOLDER FOR SUPPORTING ELECTRONIC DEVICES 审中-公开
标题翻译：支持电子设备的工作人员
公开(公告)号：US20080164646A1
公开(公告)日：2008-07-10
申请号：US11621531
申请日：2007-01-09
申请人： Chi Wah Cheng , Wang Lung Alan Tse
发明人： Chi Wah Cheng , Wang Lung Alan Tse
IPC分类号： B23Q3/02
CPC分类号： B23Q3/088 , B25B11/005 , B28D5/0094
摘要： A workholder, in particular a saw jig, is provided for mounting a substrate containing a plurality of electronic devices. The saw jig has a base platform having a plurality of pockets laid out in the same arrangement as the electronic devices are arranged on the substrate and a plurality of resilient collets are detachably inserted into the pockets, each collet being sized and configured to hold one electronic device by vacuum suction.
摘要翻译：为了安装包含多个电子设备的基板，提供了一个夹持器，特别是锯夹具。锯夹具具有基座平台，其具有以与电子设备布置在基底上相同的布置布置的多个口袋，并且多个弹性夹头可拆卸地插入到口袋中，每个夹头的尺寸和构造被容纳在一个电子设备通过真空抽吸。

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