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    • 2. 发明申请
    • HANDLER
    • 处理器
    • US20080071409A1
    • 2008-03-20
    • US11857712
    • 2007-09-19
    • Jung-ug AHNSun-hwal KimWan-hee ChoiJung Hur
    • Jung-ug AHNSun-hwal KimWan-hee ChoiJung Hur
    • H01L21/68
    • G01R31/2893G01R31/2867
    • A handler is provided, including a chamber in which to-be-tested packaged chips contained in a test tray are connected to sockets of a test board, an exchanging unit exchanging the test trays with the chamber; a transferring unit transferring the test tray containing the to-be-tested packaged chips from the exchanging unit to the chamber, and transferring the test tray containing tested packaged chips from the chamber to the exchanging unit, a picker removing the tested packaged chips from the test tray staying in the exchanging unit and putting the to-be-tested packaged chips into the test tray staying in the exchanging unit; and an inserting unit including a pusher pushing the test tray to connect the to-be-tested packaged chips to the sockets of the test board, a pusher driving unit driving the pusher, a sensor sensing an amount of pressure applied by the pusher to the test tray; and a controller controlling the pusher driving unit to enable the pusher to apply a proper amount of pressure to the test tray.
    • 提供处理器,包括一个室,其中容纳在测试托盘中的待测试的封装芯片连接到测试板的插座,交换单元将测试托盘与腔室交换; 传送单元,将包含要被测试的包装芯片的测试托盘从所述更换单元传送到所述室,以及将包含经测试的封装芯片的测试托盘从所述室传送到所述交换单元;拾取器,将测试的封装芯片从 测试托盘停留在更换单元中,并将待测试的包装的芯片放入留在更换单元中的测试托盘中; 以及插入单元,其包括推动所述测试托盘以将待测试的封装芯片连接到所述测试板的插座的推动器,驱动所述推动器的推动器驱动单元,感测由所述推动器施加的压力的传感器 试纸盘 以及控制器,其控制所述推动器驱动单元以使所述推动器能够向所述测试托盘施加适当的压力。
    • 3. 发明授权
    • System and method for transferring trays within a test handler
    • 在测试处理程序中传送托盘的系统和方法
    • US07495463B2
    • 2009-02-24
    • US12039045
    • 2008-02-28
    • Jung Ug AnHae Jun ParkKyung Min HyunWan Hee Choi
    • Jung Ug AnHae Jun ParkKyung Min HyunWan Hee Choi
    • G01R31/02
    • G01R31/2893
    • A handler for handling semiconductor chips during a testing process includes a loading position at which packaged chips are loaded into a test tray, and an unloading position at which the packaged chips are unloaded from the test tray. The test tray follows a path through the handler from the loading position to the unloading position, and from the unloading position to the loading position. By separately performing the loading and unloading operations at these different positions within the handler, malfunctions in loading and unloading pickers that load and unload the chips may be reduced. Further, a malfunction in one picker performing one operation may be prevented from influencing operations of the other picker performing another operation. Additionally, collision between the loading picker and the unloading picker may be prevented.
    • 在测试过程中用于处理半导体芯片的处理器包括将封装芯片装载到测试托盘中的装载位置以及从测试托盘卸载封装芯片的卸载位置。 测试盘沿着穿过处理器的路径从装载位置到卸载位置,并且从卸载位置到装载位置。 通过在处理机内的这些不同的位置分别执行装载和卸载操作,可以减少加载和卸载芯片的加载和卸载拾取器的故障。 此外,可以防止执行一个操作的一个拾取器中的故障影响另一个执行另一操作的拾取器的操作。 此外,可以防止装载拾取器与卸载拾取器之间的碰撞。
    • 7. 发明申请
    • SYSTEM AND METHOD FOR TRANSFERRING TRAYS WITHIN A TEST HANDLER
    • 用于在测试处理器中传输托盘的系统和方法
    • US20080297140A1
    • 2008-12-04
    • US12039045
    • 2008-02-28
    • Jung Ug ANHae Jun ParkKyung Min HyunWan Hee Choi
    • Jung Ug ANHae Jun ParkKyung Min HyunWan Hee Choi
    • G01R1/02
    • G01R31/2893
    • A handler for handling semiconductor chips during a testing process includes a loading position at which packaged chips are loaded into a test tray, and an unloading position at which the packaged chips are unloaded from the test tray. The test tray follows a path through the handler from the loading position to the unloading position, and from the unloading position to the loading position. By separately performing the loading and unloading operations at these different positions within the handler, malfunctions in loading and unloading pickers that load and unload the chips may be reduced. Further, a malfunction in one picker performing one operation may be prevented from influencing operations of the other picker performing another operation. Additionally, collision between the loading picker and the unloading picker may be prevented.
    • 在测试过程中用于处理半导体芯片的处理器包括将封装芯片装载到测试托盘中的装载位置以及从测试托盘卸载封装芯片的卸载位置。 测试盘沿着穿过处理器的路径从装载位置到卸载位置,并且从卸载位置到装载位置。 通过在处理机内的这些不同的位置分别执行装载和卸载操作,可以减少加载和卸载芯片的加载和卸载拾取器的故障。 此外,可以防止执行一个操作的一个拾取器中的故障影响另一个执行另一操作的拾取器的操作。 此外,可以防止装载拾取器与卸载拾取器之间的碰撞。