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1. 发明专利

JP2017528924A 積層型圧電セラミック素子审中-公开
公开(公告)号：JP2017528924A
公开(公告)日：2017-09-28
申请号：JP2017531426
申请日：2014-08-29
申请人：ウィソル・カンパニー・リミテッドWisol Co., Ltd. , ウィソル・カンパニー・リミテッドWisol Co., Ltd.
发明人：ノロ，ユキヒロ , チョイ，ジェ・ヒュン , チョイ，ヨ・セップ , ノ，ジュン・レ , チョイ，ヒェ・ジン
IPC分类号： H01L41/23 , H01L41/04 , H01L41/083 , H01L41/09 , H01L41/187 , H01L41/257 , H01L41/273 , H01L41/293 , H01L41/297 , H01L41/31 , H01L41/312 , H01L41/337 , H01L41/338 , H01L41/47
CPC分类号： H01L41/083 , H01L41/0477 , H01L41/0533 , H01L41/187 , H01L41/1876 , H01L41/277
摘要：本発明は、積層型圧電セラミック素子に関するものであって、2枚以上のセラミックグリーンシートが積層されて製造される積層型圧電セラミック素子において、積層型圧電セラミック素子を構成するセラミックの気孔部または欠陥部に有機樹脂が含浸された構造を有させて、高湿度環境で絶縁抵抗の劣化を防止することができる防水能を改善した積層型圧電セラミック素子を提供することができる。

2. 发明公开

KR20100131964A Method for embodiment of capacitor in surface acoustic wave filter, and using the surface acoustic wave filter 审中-公开
标题翻译：表面声波滤波器中电容器的实施例及使用表面声波滤波器的方法
公开(公告)号：KR20100131964A
公开(公告)日：2010-12-16
申请号：KR20100122723
申请日：2010-12-03
申请人： WISOL CO LTD
发明人： KIM YOUNG HUN
IPC分类号： H03H9/64 , H03H9/25
CPC分类号： H03H9/64 , H03H9/25 , H03H9/42 , H03H9/6433 , H03H9/6483
摘要： PURPOSE: A method and a SAW filter thereof are provided to miniaturize a SAW filter by forming a SAW filter chip and a capacitor in a single substrate. CONSTITUTION: A saw filter(100) comprises a capacitor(110) and a saw filter(120) for a filtering process, which an IDT(Inter Digital Transducer) electrode pattern in a direction different from the IDT electrode arrangement of a SAW filter resonator for a filtering process. The saw filter for a filtering process comprises a ladder type SAW filter and a DMS type SAW filter. Each IDT electrode is composed of a pair of comb electrodes.
摘要翻译：目的：提供一种方法和SAW滤波器，以通过在单个基板中形成SAW滤波器芯片和电容器来使SAW滤波器小型化。构造：锯式过滤器（100）包括用于滤波处理的电容器（110）和锯齿式过滤器（120），其沿与SAW滤波器谐振器的IDT电极布置不同的方向的IDT（Inter Digital Transducer）用于过滤过程。用于滤波处理的锯式滤波器包括梯型SAW滤波器和DMS型SAW滤波器。每个IDT电极由一对梳状电极构成。

3. 发明授权

KR101179972B1 IR Camera combined with IR Illuminator 有权
标题翻译：红外摄像机与IR照明器组合
公开(公告)号：KR101179972B1
公开(公告)日：2012-09-07
申请号：KR20120010219
申请日：2012-02-01
申请人： WISOL CO LTD
发明人： JEON BONG SEONG
IPC分类号： G03B17/02 , G03B17/55 , H04N5/225
CPC分类号： G03B17/17 , G03B17/55 , H04N5/2254 , H04N5/33
摘要： PURPOSE: An infrared ray projector integrated infrared camera is provided to manufacture a camera module and an infrared projector to be integrated, thereby obtaining a compact infrared camera. CONSTITUTION: An infrared ray projector integrated infrared camera comprises an infrared projector(100), a camera module(200), a lower case(300), and an upper case(400). The infrared projector adjusts am optic angle of the infrared rays being projected by the movement of a lens being joined to a reflector. The camera module photographs images in an infrared ray domain by using the infrared rays being projected from the infrared projector. The lower case accommodates the infrared projector and the camera module in a partitioned internal space. The upper case covers the lower case.
摘要翻译：目的：提供红外线投影仪一体化红外摄像机，以制造相机模块和红外投影仪进行集成，从而获得小型红外摄像机。构成：红外线投影仪集成红外线摄像机包括红外线投影仪（100），相机模块（200），下壳体（300）和上壳体（400）。红外投影机通过连接到反射器的透镜的运动来调节被投射的红外线的光学角度。相机模块通过使用从红外投影仪投影的红外线来拍摄红外线图像。下壳体将红外投影仪和相机模块容纳在分隔的内部空间中。上壳体覆盖下壳体。

4. 发明公开

KR20180055369A 표면탄성파 소자 패키지 및 그 제작 방법 审中-公开
公开(公告)号：KR20180055369A
公开(公告)日：2018-05-25
申请号：KR20160153157
申请日：2016-11-17
申请人： WISOL CO LTD
发明人： HA JONG SOO , KIM JI HO
IPC分类号： H03H3/08 , H03H9/10 , H03H9/125 , H03H9/25
CPC分类号： H03H3/08 , H03H9/10 , H03H9/125 , H03H9/25
摘要： 본발명에따른표면탄성파소자패키지는, 압전기판및 상기압전기판상에형성되는 IDT 전극과복수개의전극들을포함하는표면탄성파소자; 상기복수개의전극들에각각대응되는복수개의단자들을구비하며상기표면탄성파소자가실장되는패키지용기판; 및상기복수개의전극들각각과상기복수개의단자들각각을전기적으로연결하는경화된나노실버페이스트를포함한다.

5. 发明公开

KR20180068504A 내전력 특성이 개선된 SAW 필터 패키지 审中-公开
公开(公告)号：KR20180068504A
公开(公告)日：2018-06-22
申请号：KR20160170252
申请日：2016-12-14
申请人： WISOL CO LTD
发明人： KIM JONG HWAN
IPC分类号： H03H9/64 , H03H9/25 , H03H9/38
摘要： 본발명은패키징모듈과결합되는 SAW 공진기에있어서, 기판, 기판상에배치되는상부버스바, 기판상에상부버스바와평행하도록배치되는하부버스바, 상부버스바에서하부버스바방향으로연장형성되는상부전극, 상기상부버스바에서상기하부전극방향으로연장형성되는더미상부전극, 하부버스바에서상부버스바방향으로연장형성되는하부전극, 상기하부버스바에서상기상부전극방향으로연장형성되는더미하부전극을포함하고, 캐스케이드(Cascade) 구조를가지며, metallization ratio(전극의폭/(전극의폭+전극간 간격))가 0.7 이상인내전력특성이개선된 SAW 공진기에관한것이다.

6. 发明授权

KR101576444B1 압전 소자를 이용한 버튼 장치 有权
标题翻译：按压设备使用压电元件
公开(公告)号：KR101576444B1
公开(公告)日：2015-12-10
申请号：KR20150107915
申请日：2015-07-30
申请人： WISOL CO LTD
发明人： CHOI YO SEP , CHOI JAE HYUNG , KIM BONG SOO
IPC分类号： H01H13/702 , H01H13/703
CPC分类号： H01L41/1138 , B06B1/0603 , G06F3/016 , H01L41/0471 , H01L41/0474 , H01L41/0475 , H01L41/053 , H01L41/0833 , H01L41/0973 , H01L41/1132
摘要： 본발명에따른압전소자를이용한버튼장치는, 일면에제1 외부전극및 제2 외부전극이형성된압전체및 일면이상기압전체의타면에부착되는플레이트로이루어지는압전소자; 상기압전체의일면측에배치되는지지판; 상기플레이트의타면측에배치되는커버; 상기커버에가해지는외력에의하여상기압전소자가변형될수 있는공간을제공하도록상기플레이트의일면의가장자리부분과상기지지판사이에마련되는제1 스페이서; 상기플레이트와상기커버사이에이격공간을제공하도록상기플레이트의타면의가장자리부분의적어도일부와상기커버사이에마련되는제2 스페이서; 및상기이격공간내에마련되어상기외력을상기압전소자로전달하거나상기압전소자의진동을상기커버로전달하는도트를포함한다.
摘要翻译：根据本发明，使用压电元件的按钮装置包括：压电装置，包括具有第一外部电极和形成在其一个表面上的第二外部电极的压电体，以及具有一个表面附接到另一表面的板的压电体; 支撑板，布置在所述压电体的一个表面侧上; 布置在所述板的另一表面侧上的盖; 布置在所述板的一个表面的边缘部分和所述支撑板之间的第一间隔件，以提供通过施加到所述盖子的外力使所述压电装置能够变形的空间; 第二间隔件，其布置在板的另一表面的边缘部分的至少一部分与盖之间的空间上，以在板和盖之间提供分离空间; 以及布置在分离空间中以将外力传递到压电装置或将压电装置的振动传递到盖的点。

7. 发明专利

JP6417479B2 積層型圧電セラミック素子审中-公开
公开(公告)号：JP6417479B2
公开(公告)日：2018-11-07
申请号：JP2017531426
申请日：2014-08-29
申请人：ウィソル・カンパニー・リミテッド , WISOL CO., LTD.
发明人：ノロ,ユキヒロ , チョイ,ジェ・ヒュン , チョイ,ヨ・セップ , ノ,ジュン・レ , チョイ,ヒェ・ジン
IPC分类号： H01L41/083 , H01L41/09 , H01L41/23
CPC分类号： H01L41/083 , H01L41/0477 , H01L41/0533 , H01L41/1876 , H01L41/273 , H01L41/277

8. 发明申请

US20230084409A1 ACOUSTIC RESONATOR 有权
公开(公告)号：US20230084409A1
公开(公告)日：2023-03-16
申请号：US17898775
申请日：2022-08-30
申请人： WISOL CO., LTD.
发明人： Byung Hun KIM , Tah Joon PARK , Jong Hyeon PARK , Chang Kyu YOON
IPC分类号： H03H9/17 , H03H9/02
摘要： Provided is an acoustic resonator including: a substrate including a first cavity; a first electrode formed above the substrate; a piezoelectric layer formed on one surface of the first electrode; and a second electrode formed on one surface of the piezoelectric layer, wherein the first electrode and the piezoelectric layer include an overlapping area that corresponds to a first end and a second end of the first cavity, the first electrode has a termination surface formed as an inclined surface of a first acute angle θ1 outside the overlapping area with respect to the second end of the first cavity, the piezoelectric layer is formed to include a first air bridge area that has a second cavity and is formed between the piezoelectric layer and the first electrode in a vertical direction and between the second end of the first cavity and the termination surface in a horizontal direction.

9. 发明申请

US20230047232A1 Fbar Type Filter 有权
公开(公告)号：US20230047232A1
公开(公告)日：2023-02-16
申请号：US17876898
申请日：2022-07-29
申请人： WISOL CO., LTD.
发明人： Chul Hwa LEE , Jung Hoon HAN , A Young MOON
IPC分类号： H03H9/17 , H03H9/56 , H03H9/13
摘要： Disclosed is a film bulk acoustic resonator (FBAR) type filter including a substrate including two or more cavities on a top surface thereof, a lower electrode formed above the substrate, a piezoelectric layer formed above the lower electrode, two or more upper electrodes formed above the piezoelectric layer, and a package layer including a wall vertically extending while surrounding a periphery of certain areas in which the cavities and the lower electrode are formed and a roof disposed above the wall while being spaced apart from the upper electrodes to seal the certain areas.

10. 发明申请

US20220006440A1 SURFACE ACOUSTIC WAVEWAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：US20220006440A1
公开(公告)日：2022-01-06
申请号：US17348154
申请日：2021-06-15
申请人： WISOL CO., LTD.
发明人： Suk Hwan JANG , Byung Hak KIM , Chang Yup LEE
IPC分类号： H03H9/10 , H03H3/08 , H03H9/05 , H03H9/25
摘要： Disclosed is a surface acoustic wave (SAW) wafer level package including a substrate, an interdigital transducer (IDT) formed on the substrate, a sidewall formed on the substrate along a periphery of the IDT, a cover formed above the sidewall and the IDT to form a hollow above the IDT with the sidewall, a connection electrode formed on the substrate, electrically connected to the IDT, and extending outward from a periphery of the sidewall, a connection terminal electrically connected to a part of the connection electrode which extends outward from the periphery of the sidewall, formed throughout one outer surface of the sidewall and one surface and a part of a top surface of the cover, and having a top surface formed to be higher than the top surface of the cover, and an organic solderability preservative (OSP) coating layer formed on at least the top surface of the connection terminal.

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