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    • 1. 发明专利
    • Printed circuit transformer
    • 印刷电路变压器
    • JP2005203744A
    • 2005-07-28
    • JP2004331421
    • 2004-11-16
    • Vlt Incヴィエルティー インコーポレーテッド
    • VINCIARELLI PATRIZIO
    • H05K1/16H01F17/00H01F27/28H01F30/00
    • H01F27/2804H01F27/2847H01F2038/006H05K1/165
    • PROBLEM TO BE SOLVED: To easily make adjustments so as to be applied to a broad scope of turns ratio and applications while keeping desired characteristics. SOLUTION: A circuit board has an opening. Individual magnetic flux paths each pass through at least one opening to form a closed loop that encloses an internal space. The magnetic flux path includes a part of the magnetic flux path that is extended inside a permeable core piece. At least two magnetic flux paths are opposite to each other, and a straight line that does not pass through even one opening contained in the path and passes through the internal spaces of the two magnetic flux paths exists in the circuit board. A conductive primary winding has a second segment located outside a first segment that passes through the internal space of the permeable path and the internal space. Two conductive secondary windings or more exist. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了容易地进行调整,以适用于广泛的匝数比和应用,同时保持期望的特性。

      解决方案:电路板有一个开口。 单独的磁通路径每个穿过至少一个开口以形成封闭内部空间的闭环。 磁通路径包括在可渗透芯片内延伸的磁通路径的一部分。 至少两个磁通路径彼此相对,并且不通过包含在通路中的一个开口并穿过两个磁通路径的内部空间的直线存在于电路板中。 导电初级绕组具有位于穿过可渗透路径的内部空间和内部空间的第一段之外的第二段。 存在两个导电次级绕组。 版权所有(C)2005,JPO&NCIPI

    • 4. 发明申请
    • PANEL-MOLDED ELECTRONIC ASSEMBLIES
    • 面板模制电子组件
    • WO2012155036A2
    • 2012-11-15
    • PCT/US2012037495
    • 2012-05-11
    • VLT INCVINCIARELLI PATRIZIOLAFLEUR MICHAEL BFLEMING SEAN TIMOTHYMUTTER RUDOLPHD AMICO ANDREW
    • VINCIARELLI PATRIZIOLAFLEUR MICHAEL BFLEMING SEAN TIMOTHYMUTTER RUDOLPHD AMICO ANDREW
    • H05K7/00B29C33/20H01R43/00H05K5/00
    • H05K3/284B23P15/007B29C45/0055B29C45/14639B29C45/1679B29C2045/0058B29C2045/169B29C2793/0009B29C2793/0027B29C2793/009H01F27/24H01F27/2804H01F2027/2809H01R43/24H05K1/0209H05K1/0298H05K1/115H05K1/181H05K5/0004H05K5/0065H05K5/0217H05K5/0247H05K5/04H05K5/064H05K7/1427H05K7/209H05K2201/066H05K2201/10545H05K2203/1316H05K2203/1327H05K2203/167Y10T29/49117Y10T29/49126Y10T29/4913Y10T29/49133Y10T29/49144Y10T29/49155
    • A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.
    • 封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。 可以包括多个部件的面板可以在封装之后切割成一个或多个单独的部件。 模具可以用于形成成品的一部分,例如, 提供散热鳍片或表面安装可焊接表面。 在分离过程中,单独电路边界处提供的互连特征暴露于提供与组件的电连接,而不浪费有价值的PCB表面积。 模具可以包括各种内部特征,例如将电路板精确地定位在模腔内的配准特征,用于单个模块的结构完整性的互锁轮廓,用于匹配部件形状的轮廓和增加从内部部件散热的尺寸,以及减小所需体积 密封剂,间隙通道为互连提供安全机构间距和挫折。 封装之后可以在模具中形成宽切削,从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。 外部模具特征可以包括用于散热器的各种翅片配置,用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。 可以提供连接适配器,以在连接器,通孔,表面贴装焊料变化中的垂直或水平安装位置使用模块。 互连可以被电镀以提供可插入到配合连接器中的连接器化模块。 可以使用可再利用的板来代替散热板。 或者,面板可以在固化之后被封装在可再使用的模具中并与其分离。
    • 8. 发明授权
    • Driver and output circuit for powering semiconductor loads
    • US10014798B1
    • 2018-07-03
    • US15456055
    • 2017-03-10
    • VLT, Inc.
    • Patrizio Vinciarelli
    • H02M7/219H02M1/32G06F1/32G06F1/26
    • H02M7/219G06F1/263G06F1/3287H01L2924/181H02M1/32H02M1/38H02M3/33507H02M3/33576H02M7/003H02M2001/0032H02M2001/325H03K17/063H03K17/302H03K17/6871Y02B70/1433Y02B70/16
    • A power converter provides a low-voltage output using a full-bridge fault-tolerant rectification circuit. The output circuit uses controlled switches as rectifiers. A fault detection circuit monitors circuit conditions. Upon detection of a fault, the switches are disabled decoupling the power converter from the system.A common-source dual MOSFET device includes a plurality of elements arranged in alternating patterns on a semiconductor die. A common-source dual synchronous rectifier includes control circuitry powered from the drain to source voltage of the complementary switch.A DC-to-DC transformer converts power from an input source to a load using a fixed voltage transformation ratio. A clamp phase may be used to reduce power losses in the converter at light loads, control the effective output resistance of the converter, effectively regulate the voltage transformation ratio, provide narrow band output regulation, and control the rate of change of output voltage for example during start up. One or more of the transformer windings may be clamped. The converter may use the sine amplitude converter topology. The converter may use common-source dual MOSFET devices and fault detection.The density of point of load power conversion may be increased and the associated power dissipation reduced by removing the input driver circuitry from the point of load where it is not necessary. An output circuit may be located at the point of load providing fault tolerant rectification of the AC power from the secondary winding of a power transformer which may be located nearby the output circuit. The resonant voltage and current waveforms on the primary side of the transformer are readily communicated via an AC bus between the driver circuit and the primary winding of the power transformer. The driver circuit may drive a plurality of transformer-output circuit pairs. The transformer and output circuit may be combined in a single module at the point of load. Alternatively, the output circuit may be integrated into point of load circuitry such as a processor core. The transformer may be deployed near the output circuit.